摘要:
Electric windings comprising an electric conductor and a plurality of cured insulating layers wrapping around the conductor, said cured insulating layers being obtained by bonding two or more insulating materials with a binder solution containing a mixture of a condensation polymerization type silicone resin containing hydroxyl groups in the molecule and an addition polymerization type silicone resin to form a composite insulating material, wrapping the composite insulating material around the conductor, impregnating the wrapped composite insulating material with an impregnating varnish of an epoxy-isocyanate resin and curing the impregnated composite insulating material, have excellent water resistance in addition to excellent thermal resistance, and mechanical properties.
摘要:
A thermosetting resin composition comprising a polyfunctional epoxy compound such as diglycidyl ether of bisphenol A, a polyfunctional isocyanate such as diphenylmethane diisocyanate, a curing agent and polybutadiene type polymer having terminal hydroxyl groups can produce cured articles excellent in heat resistance and crack resistance.
摘要:
Electric machine windings produced by wrapping a composite insulating material around an electrical conductor, said composite insulating material having been prepared by bonding two or more insulating materials with a silicone resin containing hydroxyl groups in the molecular structure, impregnating said composite insulating material with an insulating varnish comprising 1 equivalent of a polyfunctional epoxy compound and 2.5 to 25 equivalents of a polyfunctional isocyanate compound and curing said varnish, have excellent insulation properties under high temperatures and high humidity and thermal resistance of class H or more.
摘要:
An insulation system for winding of electric rotating machines having thermal resistance of class H or more and excellent adhesiveness between a conductor and an insulating layer and resistance to thermal stress can be produced by wrapping a plurality of layers of an insulating tape or sheet having thermal resistance of class H or more around a winding conductor, impregnating the thus treated winding conductor with a solventless varnish consisting essentially of 1 equivalent of an epoxy compound containing at least two vicinal epoxy groups, more than one equivalent of an organic polyisocyanate, and then heating the inpregnated winding conductor at a temperature above 60.degree. C. for a time sufficient to form and cure a resin containing as recurring units at least two isocyanurate rings directly bonded to one another through the residue of the polyisocyanate and two oxazolidone rings directly bonded to each other through the residue of the polyepoxide in the presence of 0.01-10% by weight of a catalyst which forms the isocyanurate rings and oxazolidone rings based on the total amount of the polyepoxide and polyisocyanate.
摘要:
Thermosetting resins are produced by blending 1 equivalent of a polyoxazolidone terminated by two vicinal epoxy groups and containing at least two oxazolidone rings with at least 1 equivalent of a polyfunctional isocyanate compound, adding 0.01 to 10% by weight of a catalyst which forms isocyanurate rings and oxazolidone rings based on the total amount of the polyoxazolidone and the isocyanate compound, and then heating the resulting composition to polymerize the composition by forming isocyanurate rings and oxazolidone rings. The resin compositions have excellent mechanical properties, and particularly excellent flexibility, and excellent thermal resistance.
摘要:
In an epoxy resin composition comprising an alicyclic epoxy resin, a curing agent having phenolic hydroxyl group in its molecule and an imidazole curing accelerator, excellent thermal resistance and excellent mechanical properties can be given to the cured epoxy resin composition by blending 100 parts by weight of 2-(3,4-epoxy)cyclohexyl-5,5-spiro(3,4-epoxy)cyclohexane-m-dioxane as the alicyclic epoxy resin, 25 to 50 parts by weight of a phenol-formaldehyde condensate as the curing agent having phenolic hydroxyl group in its molecule and 0.1 to 15 parts by weight of at least one imidazole compound selected from the group consisting of 2-phenylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-phenyl-4-methylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-methyl-4-ethylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-azine-2-methylimidazole, 1-azine-2-undecylimidazole and 1-azine-2-ethyl-4-methylimidazole as the imidazole curing accelerator.
摘要:
Thermosetting resin compositions are obtained by mixing a resinous addition product produced by reacting an isocyanate compound having a molecular weight of 100 to 2000 and containing at least two isocyanate groups in its molecule with an epoxyphenol compound represented by the formula, ##EQU1## wherein R is a bi- or more valent group containing phenyl, R.sub.1 is hydrogen, methyl or ethyl, m and n each are an integer of 1-8, and optionally an ordinary thermosetting epoxy resin, and 0.01 to 10 % by weight of a basic heterocycle forming catalyst based on the weight of said resinous addition product, said isocyanate compound and said epoxyphenol compound being blended so that said OH group may be present in an amount of 1/3 to 1 equivalent per equivalent of said isocyanate group and said epoxy group may be present in an amount of one-fifth to two-thirds equivalent per equivalent of said isocyanate group. The said addition product can be converted into a stable B-stage and is particularly useful as a varnish for prepreg.
摘要:
The present invention provides a thermosetting resin composition comprising(a) a prepolymer of a poly-p-hydroxystyrene derivative represented by the general formula ##STR1## wherein A is a halogen group, R.sub.1 is an alkenyl or alkenoyl group of 2 to 4 carbon atoms, 4 carbon atoms, m denotes a number of 1 to 4 and n denotes a number of 1 to 100,(b) an epoxy-modified polybutadiene, and(c) an aromatic maleimide compound, and a prepreg and a laminated sheet which use said resin composition.
摘要:
The present invention provides a thermosetting resin composition comprising(a) a prepolymer of a poly(p-hydroxystyrene) derivative represented by the general formula ##STR1## wherein A is a halogen group, R.sub.1 is an alkenyl or alkenoyl group of 2 to 4 carbon atoms, m denotes a number of 1 to 4 and n denotes a number of 1 to 100,(b) an epoxy-modified polybutadiene, and(c) an aromatic maleimide compound, and a prepreg and a laminated sheet which use said resin composition.
摘要:
A thermosetting resin composition comprising a special poly(p-hydroxystyrene) derivative resin and a radical polymerization initiator, and if necessary an epoxy modified polybutadiene, can provide prepregs and laminates having a low dielectric constant, a shorter signalling delay time, good heat resistance and flame retardancy and thus being suitable for producing multilayer printed circuit boards.