摘要:
A soldering flux contains a base resin and an activating agent. The base resin contains a thermoplastic acrylic resin having a glass transition temperature of below −50° C. This enables to sufficiently suppress the occurrence of cracks in the flux residue after soldering, under the severe environment where the temperature difference is extremely large. The soldering flux has high reliability and excellent solderability, and is conventional with respect to the load against manufacturing cost and environment.
摘要:
A solder paste according to an aspect of the invention includes, within a flux, an activator that has a dibasic acid with a molecular weight of 250 or less, a monobasic acid with a molecular weight of 150 or greater and 300 or less, and a dibasic acid with a molecular weight of 300 or greater and 600 or less; and at least one resin additive selected from the group consisting of high-density polyethylenes and polypropylenes. The solder paste has the resin additive in an amount of 4% by weight or greater and 12% by weight or less when the total amount of the flux is taken as 100% by weight, and has a viscosity of 400 Pa·s or greater at 80° C.
摘要:
A flux for a solder paste according to an aspect of the invention includes an acrylic resin obtained by radically copolymerizing a (meth)acrylate having a C6-C15 alkyl group and a (meth)acrylate other than the above-mentioned (meth)acrylate; and rosins. The weight ratio of the acrylic resin is 0.5 or greater and 1.2 or less when the weight of the rosins is taken as 1, and the flux for a solder paste is fluidized by application of a shear force of 10 Pa or greater and 150 Pa or less.
摘要:
A soldering flux contains a base resin and an activating agent. The soldering flux contains, as the activating agent, an oxygen-containing heterocyclic compound having at least one carboxyl group in a molecule. A solder paste composition contains the abovementioned soldering flux and the solder alloy powder. These enable exhibition of excellent wettability to lead-free metals and plating, irrespective of the type of the metals.
摘要:
Disclosed is a solder bonding structure which is capable of retaining sufficient solder bonding strength and ensuring high bonding reliability even in severe environments having an extremely large temperature difference. In the solder bonding structure, an electronic component 4 is mounted on a main surface 1a of a substrate having an electrode section 2 and an insulating film 3, and the electrode section 2 and the electronic component 4 are electrically bonded to each other through a solder section 5, and a flux residue 6 exuded from the solder section 5 is present between the electronic component 4 and the insulating film 3. The flux contains an acrylic resin, an activating agent, and a thixotropic agent having a hydroxyl group. The glass transition point of the acrylic resin is not higher than −40° C., or not lower than the softening temperature of the flux residue. The flux residue has a maximum value of 300×10−6/K or less of linear thermal expansion coefficient within a temperature range from −40° C. to the softening temperature of the flux residue.
摘要:
A semiconductor light-emitting element includes a semiconductor layer including a light-emitting layer, a refractive index gradient layer provided on a light extraction surface of the semiconductor layer, and a holding substrate bounded to an outer surface of the refractive index gradient layer with an adhesion layer interposed therebetween. A refractive index of the refractive index gradient layer is changed continuously or stepwise in a film thickness direction such that a semiconductor-layer-side refractive index is substantially equivalent to a refractive index of the semiconductor layer and a holding-substrate-side refractive index is substantially equivalent to a refractive index of the holding substrate. The refractive index gradient layer is formed by vapor plating.
摘要:
A method for manufacturing thin films in which a first film is formed on a substrate using chemical-vapor deposition (CVD), and a second film is formed on the substrate using sputtering, wherein the processes are sequentially performed in the same deposition chamber without exposing the substrate to an oxidative atmosphere. The deposition chamber includes a first electrode, and a second electrode located under the first electrode. During the CVD process, a dummy target is mounted on the first electrode and the substrate is mounted on the second electrode, a reactive gas is introduced into the chamber, and high frequency electrical power is applied to both the first and second electrodes, thereby causing the constituents of the reactive gas to deposit on the substrate to form the first film. Subsequently, any remaining reactive gas is removed from the chamber and an automated mechanism removes the dummy target from the first electrode and stores the dummy target in a storage chamber. A sputtering electrode is then mounted on the first electrode and a sputtering gas is introduced into the reaction chamber. High frequency electrical power is then applied to both the first and second electrodes, thereby causing the sputtering gas and sputtering target to deposit the second film on the substrate.
摘要:
Disclosed is a test assistant system for a logical design process comprising a description storage data base for storing statements expressing logical functions of circuit components to be tested, a compiler for compiling the statements to output object data, a data base for storing the object data, a test pattern generator for generating test patterns by using the object data stored in the data base, a test pattern data base for storing the test patterns, each having a level number, a simulator for executing a simulation for the logical function by using the test patterns stored in the test pattern data base, and a display for displaying the object data, the test patterns, the information used in the simulation, and relationships among them. The data base comprises a region for storing a statement correspondence table expressing statements as descriptions of the logical functions of the circuit components, a region for storing a circuit component table expressing a circuit component corresponding to the function described in the statement, a region for storing a dependent relationship table expressing the dependent relationship between the statements, and a correspondence relationship table expressing the correspondence relationship between the statement correspondence table and the circuit component table.
摘要:
A thin holographic optical switch used in a liquid crystal display device contains opposing transparent substrates transparent electrodes between the substrates and a diffraction grating between the electrodes. The diffraction grating contains regions of transparent polymerized photopolymers and cholesteric liquid crystal micro-droplets. Refractive indexes of the photopolymers and liquid crystal are substantially the same when the electrodes have the same potential. The holographic optical switch transmits broadband LED light when the potential difference between the electrodes is zero and is polarization independent. The holographic optical switch diffracts broadband LED light when the potential difference between the electrodes is non-zero and is polarization independent.
摘要:
A thin holographic optical switch used in a liquid crystal display device contains opposing transparent substrates transparent electrodes between the substrates and a diffraction grating between the electrodes. The diffraction grating contains regions of transparent polymerized photopolymers and cholesteric liquid crystal micro-droplets. Refractive indexes of the photopolymers and liquid crystal are substantially the same when the electrodes have the same potential. The holographic optical switch transmits broadband LED light when the potential difference between the electrodes is zero and is polarization independent. The holographic optical switch diffracts broadband LED light when the potential difference between the electrodes is non-zero and is polarization independent.