公开(公告)号：USH1003H

公开(公告)日：1991-12-03

申请号：US480279

申请日：1990-02-15

申请人： Masao Ishiwata ,  Norio Kawame ,  Takeshi Sakurai ,  Mieji Nakano ,  Kazuhide Tamazawa ,  Nobuyuki Kimura ,  Toshio Saito ,  Gentaro Hada

发明人： Masao Ishiwata ,  Norio Kawame ,  Takeshi Sakurai ,  Mieji Nakano ,  Kazuhide Tamazawa ,  Nobuyuki Kimura ,  Toshio Saito ,  Gentaro Hada

IPC分类号： G03C1/76 ,  B05C5/00 ,  B05C9/06 ,  G03C1/005 ,  G03C1/38 ,  G03C1/74 ,  B05D1/36 ,  B05D1/02 ,  B05D1/30 ,  G03C1/46

CPC分类号： B05C5/007 ,  B05C9/06 ,  G03C1/005 ,  G03C1/38 ,  G03C1/74 ,  G03C2001/7481 ,  G03C2007/3034 ,  G03C2200/11 ,  G03C2200/20

摘要： An improved process for producing a photographic material in which an assembly of superposed liquid photographic layers is coated onto the surface of a moving base support in such a way that the properties of the liquid photographic layers being coated are evaluated by their dynamic surface tensions.

公开(公告)号：US20130213852A1

公开(公告)日：2013-08-22

申请号：US13876662

申请日：2011-09-30

申请人： Yasuo Yamazaki ,  Toru Shiragami ,  Noriaki Masuda ,  Takeshi Sakurai ,  Hiroki Yamazaki

发明人： Yasuo Yamazaki ,  Toru Shiragami ,  Noriaki Masuda ,  Takeshi Sakurai ,  Hiroki Yamazaki

IPC分类号： B65D85/00

CPC分类号： B65D85/00 ,  C03C3/19 ,  C03C8/08 ,  C03C8/24 ,  H01L51/5246 ,  H01L2924/16195 ,  H05B33/04

摘要： Provided is an electrical element package, comprising an element substrate on which an electrical element is provided, a sealing substrate provided at a distance from a surface of the element substrate on a side of the electrical element so as to be opposed to the element substrate, and a glass frit for hermetically sealing a gap between the element substrate and the sealing substrate so as to surround the electrical element, wherein the electrical element package comprises a protective film for protecting an electrode from laser light applied in welding the glass frit, the protective film being provided between the element substrate and the glass frit.

摘要翻译： 提供一种电气元件封装，包括其上设置有电气元件的元件基板，密封基板，其设置在元件基板的与元件基板相对的一侧上距元件基板的表面一定距离处， 以及用于密封元件基板和密封基板之间的间隙以围绕电气元件的玻璃料，其中电气元件封装包括用于保护电极免受焊接玻璃料时施加的激光的保护膜，该保护膜 膜被提供在元件基底和玻璃料之间。

公开(公告)号：US20120307386A1

公开(公告)日：2012-12-06

申请号：US13522337

申请日：2011-04-25

申请人： Takeshi Sakurai

发明人： Takeshi Sakurai

IPC分类号： G02B1/10

CPC分类号： C23C14/081 ,  C03C17/36 ,  C03C17/3607 ,  C03C17/3644 ,  C03C17/3647 ,  C03C17/3663 ,  C23C14/185 ,  C23C28/322 ,  C23C28/345 ,  G02B1/105 ,  G02B1/14 ,  G02B5/0808

摘要： Provided is a reflection member including a silver reflective coating and having excellent thermal resistance. A reflection member (1) includes a reflection member body (11), a silver reflective coating (13), and a first protective film (15). The silver reflective coating (13) is formed on the reflection member body (11). The silver reflective coating (13) is made of silver or a silver-containing alloy. The first protective film (15) is formed on the silver reflective coating (13). The first protective film (15) is made of Ti, Ta or Nb.

摘要翻译： 提供一种反射构件，其包括银反射涂层并具有优异的耐热性。 反射构件（1）包括反射构件主体（11），银反射涂层（13）和第一保护膜（15）。 银反射涂层（13）形成在反射构件主体（11）上。 银反射涂层（13）由银或含银合金制成。 第一保护膜（15）形成在银反射涂层（13）上。 第一保护膜（15）由Ti，Ta或Nb制成。

公开(公告)号：US5468724A

公开(公告)日：1995-11-21

申请号：US68587

申请日：1993-05-27

申请人： Takahiro Wada ,  Shin-ichi Koriyama ,  Takeshi Sakurai ,  Nobuo Suzuki ,  Takayuki Miyatake ,  Hisao Yamauchi ,  Naoki Koshizuka ,  Shoji Tanaka

发明人： Takahiro Wada ,  Shin-ichi Koriyama ,  Takeshi Sakurai ,  Nobuo Suzuki ,  Takayuki Miyatake ,  Hisao Yamauchi ,  Naoki Koshizuka ,  Shoji Tanaka

IPC分类号： C01G3/00 ,  C04B35/45 ,  H01L39/12 ,  H01B12/00

CPC分类号： C01G3/006 ,  C04B35/4504 ,  H01L39/126 ,  C01P2002/72 ,  C01P2002/77 ,  C01P2002/88 ,  C01P2004/80 ,  C01P2006/14 ,  Y10S505/779 ,  Y10S505/78

摘要： Disclosed herein are high-temperature oxide superconductors of RBa.sub.2 Cu.sub.4 O.sub.8 type, with Ba partly replaced by Sr or Ca, or with R and Ba partly replaced by Ca and Sr, respectively, as represented by the chemical composition formula of R(Ba.sub.1-y Sr.sub.y).sub.2 Cu.sub.4 O.sub.8 or R(Ba.sub.1-z Ca.sub.z).sub.2 Cu.sub.4 O.sub.8 or (R.sub.1-x Ca.sub.x) (Ba.sub.1-y Sr.sub.y).sub.2 Cu.sub.4 O.sub.8. They exhibit superconductivity at high temperatures. Especially, the last one exhibits superconductivity at a higher temperature than the former two. All of them can be made with a less amount of Ba as a deleterious substance, and the first two have improved sinterability. The best results are obtained when they are produced by the process involving the hot hydrostatic pressure treatment of the mixture of raw materials at 850.degree.-1100.degree. C. in an atmosphere composed of an inert gas and oxygen. The process permits a wider selection of Ba raw materials.

摘要翻译： 本文公开了RBa2Cu4O8型的高温氧化物超导体，其中Ba部分被Sr或Ca取代，或者R和Ba分别被Ca和Sr部分替代，如R（Ba1-ySry）2Cu4O8的化学组成式所示 或R（Ba1-zCaz）2 Cu4O8或（R1-xCax）（Ba1-ySry）2Cu4O8。 它们在高温下表现出超导性。 特别地，最后一个在比前两个更高的温度下表现出超导性。 所有这些都可以用少量的Ba作为有害物质，前两种具有改善的烧结性。 通过在惰性气体和氧气组成的气氛中，在850〜-1100℃的原料混合物进行热静水压处理的方法制造时，得到最好的结果。 该过程允许更广泛地选择Ba原料。

公开(公告)号：US5445252A

公开(公告)日：1995-08-29

申请号：US279896

申请日：1994-07-25

申请人： Thomas S. McKee ,  Takeshi Sakurai

发明人： Thomas S. McKee ,  Takeshi Sakurai

IPC分类号： H02G11/02

CPC分类号： B60L11/1825 ,  B60L11/1816 ,  B65H75/368 ,  B65H75/425 ,  B65H75/4402 ,  B65H75/48 ,  H02G11/02 ,  B60L2230/12 ,  B65H2701/34 ,  B65H2701/3914 ,  Y02T10/7005 ,  Y02T10/7088 ,  Y02T90/121 ,  Y02T90/128 ,  Y02T90/14

摘要： A charging cord for supplying electric current to an electric power storing device of an electric vehicle includes an electrical cable having a first end and a second end, the first end being operatively connected to the electric power storing device and the second end being adapted to be connected to an electrical power supply. A housing is provided for supporting the electrical cable along a predetermined length thereof. The housing includes a plurality of section members pivotally connected relative to each other for permitting limited lateral motion in a single plane to maintain the charging cord a predetermined distance above the ground surface.

摘要翻译： 用于向电动车辆的蓄电装置供给电流的充电线包括具有第一端和第二端的电缆，所述第一端可操作地连接到所述蓄电装置，所述第二端适于 连接到电源。 设置有用于沿预定长度支撑电缆的壳体。 壳体包括多个相对于彼此枢转地连接的部件，以允许在单个平面中的有限横向运动，以将充电线保持在地面上方预定的距离。

公开(公告)号：US09255310B2

公开(公告)日：2016-02-09

申请号：US12801359

申请日：2010-06-04

申请人： Takeshi Sakurai ,  Yoshihiro Kameyama ,  Yoshio Abe

发明人： Takeshi Sakurai ,  Yoshihiro Kameyama ,  Yoshio Abe

IPC分类号： C22C9/00 ,  H01B5/02 ,  C22F1/08

CPC分类号： C22C9/00 ,  C22F1/08

摘要： A copper alloy material includes, by mass %, Mg of 0.3 to 2%, P of 0.001 to 0.1%, and the balance including Cu and inevitable impurities. An area fraction of such crystal grains that an average misorientation between all the pixels in each crystal grain is less than 4° is 45 to 55% of a measured area, when orientations of all the pixels in the measured area of the surface of the copper alloy material are measured by an EBSD method with a scanning electron microscope of an electron backscattered diffraction image system and a boundary in which a misorientation between adjacent pixels is 5° or more is considered as a crystal grain boundary, and a tensile strength is 641 to 708 N/mm2, and a bending elastic limit value is 472 to 503 N/mm2.

摘要翻译： 铜合金材料以质量％计含有0.3〜2％的Mg，0.001〜0.1％的P，余量包含Cu和不可避免的杂质。 在每个晶粒中的所有像素之间的平均取向度小于4°的这种晶粒的面积分数是测量面积的45至55％，当铜的表面的测量区域中的所有像素的取向 合金材料通过电子背散射衍射图像系统的扫描电子显微镜和相邻像素之间的取向偏差为5°以上的边界的EBSD法测定为晶界，拉伸强度为641〜 708N / mm2，弯曲弹性极限值为472〜503N / mm2。

公开(公告)号：US20110094085A1

公开(公告)日：2011-04-28

申请号：US12736785

申请日：2009-05-20

申请人： Takeshi Sakurai ,  Shunroku Sukumoda ,  Shinya Koike

发明人： Takeshi Sakurai ,  Shunroku Sukumoda ,  Shinya Koike

IPC分类号： B23P17/00

CPC分类号： B21H8/00 ,  Y10T29/4998

摘要： A method for producing a contour strip includes a rough rolling step for rolling a plate material to form a contour molding material, a slitting step for slitting the contour molding material at the middle position in the width direction of a thick portion or a thin portion at both side edge portions thereof to form a contour slit material, and a stretching step for stretching the contour slit material to obtain a contour strip. Rolling is carried out in the rough rolling step so that Δt is 0.01 or less, e is 0.15 or less, D1 is 0.4 or less, and a rough rolling management value X determined by Δt×e×D1 is 5×10−4 or less, assuming the deviation of plate thickness at a thin portion from a target value is Δt (mm), an actual measurement of the radius of curvature at a corner formed by the side surface and the top surface of a tick portion is e (mm), and an actual measurement of curvature per meter-length of the contour molding material is D1 (mm), the contour molding material is cut in the slitting step so that an actual measurement |A−B| (mm) of the difference in the width from the side edge of the thick portion or thin portion between both side edge portions is 0.08 or less, and the contour slit material is stretched in the stretching step so that an actual measurement D2 (mm) of curvature per meter-length of the contour molding strip is 0.13 or less.

摘要翻译： 轮廓条的制造方法包括：轧制板材以形成轮廓成型材料的粗轧工序;切割步骤，用于在厚部或薄部的宽度方向的中间位置切割轮廓成型材料 其两个侧边缘部分形成轮廓狭缝材料，以及用于拉伸轮廓狭缝材料以获得轮廓条的拉伸步骤。 在粗轧工序中进行轧制，使Dgr为0.01以下，e为0.15以下，D1为0.4以下，由＆Dgr; t×e×D1决定的粗轧管理值X为5× 10-4以下，假设薄板部分的板厚与目标值的偏差为＆Dgr; t（mm），由侧面和顶面形成的拐角处的曲率半径的实际测量值 刻度部分为e（mm），并且轮廓成型材料的每米长度的实际曲率测量为D1（mm），在切割步骤中切割轮廓成型材料，使得实际测量| A-B | 与两侧缘部之间的厚壁部分或薄部分的侧边缘的宽度差的宽度（mm）为0.08以下，并且在拉伸步骤中拉伸轮廓狭缝材料，使得实际测量值D2（mm） 轮廓成型条的每米长度的曲率为0.13以下。

公开(公告)号：US06319105B1

公开(公告)日：2001-11-20

申请号：US09327650

申请日：1999-06-08

申请人： Tetsuji Togawa ,  Takeshi Sakurai ,  Nobuyuki Takada

发明人： Tetsuji Togawa ,  Takeshi Sakurai ,  Nobuyuki Takada

IPC分类号： B24B2900

CPC分类号： B24B53/017 ,  H01L21/67051

摘要： A polishing apparatus includes a cleaning device for critical cleaning of a top ring or a dressing tool to obtain high quality polishing by minimizing surface damage caused by contaminants originating from the top ring and/or dressing tool. The polishing apparatus includes a polishing table; a workpiece holding member for pressing a workpiece onto the polishing table; a dressing tool for conditioning a work surface provided on the polishing table. A cleaning device is provided for cleaning the dressing tool and/or the workpiece holding member. The cleaning device is provided with a spray nozzle for directing a cleaning solution toward at least an upper surface of the workpiece holding member or the dressing tool.

摘要翻译： 抛光装置包括清洁装置，用于通过最小化由顶环和/或修整工具产生的污染物引起的表面损伤来对顶环或修整工具进行临界清洁以获得高质量的抛光。 抛光装置包括：抛光台; 工件保持构件，用于将工件压在抛光台上; 用于调节设置在抛光台上的工作表面的修整工具。 提供了用于清洁修整工具和/或工件保持构件的清洁装置。 清洁装置设置有用于将清洁溶液引导至至少工件保持构件或修整工具的上表面的喷嘴。

公开(公告)号：US09435016B2

公开(公告)日：2016-09-06

申请号：US13808351

申请日：2010-07-07

申请人： Takeshi Sakurai ,  Yoshio Abe ,  Akira Saito ,  Yoshihiro Kameyama

发明人： Takeshi Sakurai ,  Yoshio Abe ,  Akira Saito ,  Yoshihiro Kameyama

IPC分类号： C22F1/08 ,  C22C9/06 ,  H01B1/02 ,  C22C9/04 ,  C22F1/00 ,  C22C9/10

CPC分类号： C22F1/08 ,  C22C9/04 ,  C22C9/06 ,  C22C9/10 ,  C22F1/00 ,  H01B1/026

摘要： The Cu—Ni—Si-based copper alloy plate contains 1.0 mass % to 3.0 mass % of Ni, and Si at a concentration of ⅙ to ¼ of the mass % concentration of Ni with a remainder of Cu and inevitable impurities, in which, when the average value of the aspect ratio (the minor axis of crystal grains/the major axis of crystal grains) of each crystal grains in an alloy structure is 0.4 to 0.6, the average value of GOS in the all crystal grains is 1.2° to 1.5°, and the ratio (Lσ/L) of the total special grain boundary length Lσ of special grain boundaries to the total grain boundary length L of crystal grain boundaries is 60% to 70%, the spring bending elastic limit becomes 450 N/mm2 to 600 N/mm2, the solder resistance to heat separation is favorable and deep drawing workability is excellent at 150° C. for 1000 hours.

摘要翻译： Cu-Ni-Si系铜合金板含有1.0质量％〜3.0质量％的Ni，Si的质量％浓度为⅙〜¼的Si，余量为Cu和不可避免的杂质， 当合金结构中每个晶粒的纵横比（晶粒的短轴/晶粒的长轴）的平均值为0.4至0.6时，所有晶粒中GOS的平均值为1.2°至 1.5°，特殊晶界的总特殊晶界长度Lσ与晶界的总晶界长L的比（Lσ/ L）为60％〜70％，弹性弯曲弹性极限为450N / mm2〜600N / mm2，耐热焊接性良好，在150℃，1000小时时深冲加工性优异。

公开(公告)号：US08698002B2

公开(公告)日：2014-04-15

申请号：US12998700

申请日：2009-07-09

申请人： Takeshi Sakurai ,  Seiichi Ishikawa ,  Kenji Kubota ,  Takashi Tamagawa

发明人： Takeshi Sakurai ,  Seiichi Ishikawa ,  Kenji Kubota ,  Takashi Tamagawa

IPC分类号： H05K1/03 ,  H05K3/00

CPC分类号： C25D5/505 ,  C25D5/12 ,  C25D5/50 ,  C25D7/00 ,  H01R13/03 ,  Y10T29/49124 ,  Y10T428/12708

摘要： A Cu—Sn layer and an Sn-based surface layer are formed in this order on the surface of a Cu-based substrate through an Ni-based base layer, and the Cu—Sn layer is composed of a Cu3Sn layer arranged on the Ni-based base layer and a Cu6Sn5 layer arranged on the Cu3Sn layer; the Cu—Sn layer obtained by bonding the Cu3Sn layer and the Cu6Sn5 layer is provided with recessed and projected portions on the surface which is in contact with the Sn-based surface layer; thicknesses of the recessed portions are set to 0.05 μm to 1.5 μm, the area coverage of the Cu3Sn layer with respect to the Ni-based base layer is 60% or higher, the ratio of the thicknesses of the projected portions to the thicknesses of the recessed portions in the Cu—Sn layer is 1.2 to 5, and the average thickness of the Cu3Sn layer is 0.01 μm to 0.5 μm.

摘要翻译： 通过Ni基底层在Cu基基板的表面上依次形成Cu-Sn层和Sn系表面层，Cu-Sn层由设置在Ni上的Cu 3 Sn层构成 基底层和布置在Cu3Sn层上的Cu6Sn5层; 通过结合Cu 3 Sn层和Cu 6 Sn 5层获得的Cu-Sn层在与Sn基表面层接触的表面上设置有凹凸部分; 将凹部的厚度设定为0.05μm〜1.5μm，Cu3Sn层相对于Ni基底层的面积覆盖率为60％以上，凸部的厚度与厚度的比例 Cu-Sn层的凹部为1.2〜5，Cu 3 Sn层的平均厚度为0.01μm〜0.5μm。