公开(公告)号：US5445710A

公开(公告)日：1995-08-29

申请号：US202372

申请日：1994-02-25

申请人： Masaru Hori ,  Hiroyuki Yano ,  Keiji Horioka ,  Hisataka Hayashi ,  Sadayuki Jimbo ,  Haruo Okano ,  Kazuhiro Tomioka ,  Yasuhiro Ito ,  Haruki Mori

发明人： Masaru Hori ,  Hiroyuki Yano ,  Keiji Horioka ,  Hisataka Hayashi ,  Sadayuki Jimbo ,  Haruo Okano ,  Kazuhiro Tomioka ,  Yasuhiro Ito ,  Haruki Mori

IPC分类号： H01L21/033 ,  H01L21/308 ,  H01L21/311 ,  H01L21/314 ,  H01L21/3213 ,  H01L21/306 ,  B44C1/22 ,  C03C15/00 ,  C23F1/00

CPC分类号： H01L21/31122 ,  H01L21/0332 ,  H01L21/3081 ,  H01L21/31116 ,  H01L21/31138 ,  H01L21/31144 ,  H01L21/3146 ,  H01L21/32136 ,  H01L21/32137 ,  H01L21/32139

摘要： A dry-etching method comprising the steps of forming carbon film on a substrate to be etched, forming a resist pattern on said carbon thin film, selectively etching said carbon film using said resist pattern as a mask by a plasma of a gas mixture of a gas containing fluorine atoms and a gas containing oxygen atoms which are mixed at an atomic ratio of fluorine to oxygen of 198:1 to 1:2 so as to form a carbon film pattern, and selectively etching said substrate to be etched using said carbon film pattern as a mask or said resist pattern and said carbon film pattern as masks.

摘要翻译： 一种干蚀刻方法，包括以下步骤：在要蚀刻的基底上形成碳膜，在所述碳薄膜上形成抗蚀剂图案，使用所述抗蚀剂图案作为掩模，用等离子体选择性地蚀刻所述碳膜， 含有氟原子的气体和以氟与氧的原子比混合为198:1〜1:2的含有氧原子的气体，以形成碳膜图案，并使用所述碳膜选择性地蚀刻所述蚀刻用基板 图案作为掩模或所述抗蚀剂图案和所述碳膜图案作为掩模。

公开(公告)号：US5302240A

公开(公告)日：1994-04-12

申请号：US20193

申请日：1993-02-19

申请人： Masaru Hori ,  Hiroyuki Yano ,  Keiji Horioka ,  Hisataka Hayashi ,  Sadayuki Jimbo ,  Haruo Okano ,  Kazuhiro Tomioka ,  Yasuhiro Ito ,  Haruki Mori

发明人： Masaru Hori ,  Hiroyuki Yano ,  Keiji Horioka ,  Hisataka Hayashi ,  Sadayuki Jimbo ,  Haruo Okano ,  Kazuhiro Tomioka ,  Yasuhiro Ito ,  Haruki Mori

IPC分类号： H01L21/033 ,  H01L21/308 ,  H01L21/311 ,  H01L21/314 ,  H01L21/3213 ,  H01L2/306 ,  B44C1/22 ,  C03C15/00 ,  C23F1/00

CPC分类号： H01L21/31122 ,  H01L21/0332 ,  H01L21/3081 ,  H01L21/31116 ,  H01L21/31138 ,  H01L21/31144 ,  H01L21/3146 ,  H01L21/32136 ,  H01L21/32137 ,  H01L21/32139

摘要： A dry-etching method comprising the steps of forming carbon film on a substrate to be etched, forming a resist pattern on said carbon thin film, selectively etching said carbon film using said resist pattern as a mask by a plasma of a gas mixture of a gas containing fluorine atoms and a gas containing oxygen atoms which are mixed at an atomic ratio of fluorine to oxygen of 198:1 to 1:2 so as to form a carbon film pattern, and selectively etching said substrate to be etched using said carbon film pattern as a mask or said resist pattern and said carbon film pattern as masks.

摘要翻译： 一种干蚀刻方法，包括以下步骤：在要蚀刻的基底上形成碳膜，在所述碳薄膜上形成抗蚀剂图案，使用所述抗蚀剂图案作为掩模，用等离子体选择性地蚀刻所述碳膜， 含有氟原子的气体和以氟与氧的原子比混合为198:1〜1:2的含有氧原子的气体，以形成碳膜图案，并使用所述碳膜选择性地蚀刻所述蚀刻用基板 图案作为掩模或所述抗蚀剂图案和所述碳膜图案作为掩模。

公开(公告)号：US5240554A

公开(公告)日：1993-08-31

申请号：US824095

申请日：1992-01-22

申请人： Masaru Hori ,  Hiroyuki Yano ,  Keiji Horioka ,  Hisataka Hayashi ,  Sadayuki Jimbo ,  Haruo Okano

发明人： Masaru Hori ,  Hiroyuki Yano ,  Keiji Horioka ,  Hisataka Hayashi ,  Sadayuki Jimbo ,  Haruo Okano

IPC分类号： H01L21/308 ,  H01L21/311 ,  H01L21/314 ,  H01L21/3213

CPC分类号： H01L21/31138 ,  H01L21/3081 ,  H01L21/31116 ,  H01L21/31144 ,  H01L21/3146 ,  H01L21/32136 ,  H01L21/32139 ,  Y10S438/945

摘要： A method of manufacturing a semiconductor device includes the steps of forming a carbon film on a target film formed on a substrate, forming an organic film pattern on the carbon film, etching the carbon film using the organic film pattern as a mask to form a carbon film pattern, and heating the substrate, supplying an etching gas having halogen atoms to a reaction area where the substrate is stored, applying an electric field to the reaction area to generate a discharge, and anisotropically etching the silicon oxide film using the carbon film pattern as a mask and a plasma formed by the discharge.

摘要翻译： 一种制造半导体器件的方法包括以下步骤：在形成在基片上的靶膜上形成碳膜，在碳膜上形成有机膜图案，使用有机膜图案作为掩模蚀刻碳膜，形成碳 并对基板进行加热，将具有卤素原子的蚀刻气体供给到存储基板的反应区域，向反应区域施加电场以产生放电，并使用碳膜图案进行各向异性蚀刻氧化硅膜 作为掩模和通过放电形成的等离子体。

公开(公告)号：US5707487A

公开(公告)日：1998-01-13

申请号：US332504

申请日：1994-10-31

申请人： Masaru Hori ,  Hiroyuki Yano ,  Keiji Horioka ,  Haruo Okano

发明人： Masaru Hori ,  Hiroyuki Yano ,  Keiji Horioka ,  Haruo Okano

IPC分类号： C23F4/00 ,  G03F7/09 ,  H01L21/302 ,  H01L21/3065 ,  H01L21/308 ,  H01L21/311 ,  H01L21/314 ,  H01L21/3213

CPC分类号： G03F7/094 ,  H01L21/3081 ,  H01L21/31144 ,  H01L21/3146 ,  H01L21/32139 ,  Y10S438/95

摘要： According to this invention, a method of manufacturing a semiconductor device includes the steps of forming a carbon film on a surface of a substrate, forming a mask pattern on the carbon film, etching the carbon film along the mask pattern to form a carbon film pattern, and reactive ion etching the substrate along the carbon film pattern using a high density plasma produced by application of a high frequency and a magnetic field, application of a microwave, irradiation of an electron beam, application of a high frequency of not less than 27 MHz, or application of a inductive coupled high frequency.

摘要翻译： 根据本发明，制造半导体器件的方法包括以下步骤：在基片的表面上形成碳膜，在碳膜上形成掩模图案，沿着掩模图案蚀刻碳膜以形成碳膜图案 并且使用通过施加高频和磁场产生的高密度等离子体沿着碳膜图案反应离子蚀刻基板，施加微波，照射电子束，施加不小于27的高频 MHz或应用电感耦合高频。

公开(公告)号：US5310454A

公开(公告)日：1994-05-10

申请号：US26042

申请日：1993-03-04

申请人： Tokuhisa Ohiwa ,  Hisataka Hayashi ,  Keiji Horioka ,  Haruo Okano ,  Takaya Matsushita ,  Isahiro Hasegawa ,  Akira Takeuchi

发明人： Tokuhisa Ohiwa ,  Hisataka Hayashi ,  Keiji Horioka ,  Haruo Okano ,  Takaya Matsushita ,  Isahiro Hasegawa ,  Akira Takeuchi

IPC分类号： H01L21/302 ,  H01L21/3065 ,  H01L21/311 ,  B44C1/22 ,  C03C15/00 ,  C03C25/06

CPC分类号： H01L21/31116

摘要： A dry etching method by a plasma etching forms a mask pattern, having an opening up to 1 .mu.m width on a silicon oxide layer formed on a silicon substrate. The substrate is laced into a reactive chamber having an etching gas introducing means and fluorocarbon gas and hydrogen gas as the etching gas are introduced such that a ratio of the hydrogen gas to the gas mixture satisfies 50% to 80%. The plasma is generated, and by using the plasma etching, the silicon oxide layer is etched according to the mask pattern to form an opening having an aspect ratio of more than 1 in the silicon oxide layer.

摘要翻译： 通过等离子体蚀刻的干蚀刻方法形成在硅基板上形成的氧化硅层上具有至多1μm宽的开口的掩模图案。 衬底被引入具有蚀刻气体引入装置的反应室和碳氟化合物气体和氢气作为蚀刻气体，使得氢气与气体混合物的比率满足50％至80％。 产生等离子体，并且通过使用等离子体蚀刻，根据掩模图案蚀刻氧化硅层，以在氧化硅层中形成长径比大于1的开口。

公开(公告)号：US5259923A

公开(公告)日：1993-11-09

申请号：US889627

申请日：1992-05-28

申请人： Masaru Hori ,  Keiji Horioka ,  Haruo Okano ,  Masao Ito ,  Masahito Hiratsuka ,  Yoshio Ishikawa

发明人： Masaru Hori ,  Keiji Horioka ,  Haruo Okano ,  Masao Ito ,  Masahito Hiratsuka ,  Yoshio Ishikawa

IPC分类号： H01L21/28 ,  H01L21/302 ,  H01L21/3065 ,  H01L21/3205 ,  H01L21/3213 ,  H01L23/52 ,  H01L29/423 ,  H01L29/43 ,  H01L29/49 ,  H01L21/306 ,  B44C1/22 ,  C03C15/00 ,  C23F1/00

CPC分类号： H01L21/32136 ,  H01L21/32137 ,  H01L2924/0002

摘要： A dry etching method, wherein a multilayer film including one selected from tungsten, molybdenum, and a silicide thereof, as the first layer, and polycrystal silicon as the second layer underlying is formed on a silicon oxide insulation film, a substrate having a mask pattern on the multilayer film is placed in a vacuum container, an etching gas is introduced into the vacuum container, and an electrical discharge is induced by applying an electrical field to the vacuum container, thereby anisotropically etching the multilayered film in accordance with the mask pattern. The method comprises the first etching step for etching the first layer by use of the first gas selected from fluorine, sulfur hexafluoride, and nitrogen trifuoride, or a mixture gas containing the first gas and the second gas selected from hydrogen chloride, hydrogen bromide, chlorine, bromine, and carbon tetrachloride, as an etching gas, and the second etching step for etching the second layer by use of the second gas, or a mixture gas containing the second gas and the third gas selected from an inert gas, nitrogen gas, oxygen gas, silicon tetrachloride gas and carbon monoxide gas, as an etching gas.

公开(公告)号：US5733713A

公开(公告)日：1998-03-31

申请号：US428522

申请日：1995-04-21

申请人： Hiroyuki Yano ,  Haruo Okano ,  Tohru Watanabe ,  Keiji Horioka

发明人： Hiroyuki Yano ,  Haruo Okano ,  Tohru Watanabe ,  Keiji Horioka

IPC分类号： G03F7/00 ,  H01L21/027 ,  H01L21/768

CPC分类号： G03F7/0005 ,  H01L21/0276 ,  H01L21/76885 ,  Y10S430/151 ,  Y10S438/95

摘要： A method of manufacturing a semiconductor device is disclosed. The method comprises the steps of forming carbon layer on a light-reflective layer or a transparent layer formed on a light-reflective layer, forming a photosensitive resin layer on the carbon layer, selectively radiating light on the photosensitive resin layer, forming a photosensitive resin pattern by developing the photosensitive resin layer selectively irradiated with the light, forming a carbon pattern by etching the carbon layer using the photosensitive pattern as a mask, and forming a light-reflective pattern or a transparent layer pattern by etching the light-reflective layer using the photosensitive resin layer or the carbon pattern as a mask. When the light-reflective layer pattern is formed, the thickness of the carbon layer is set to be less than 100 nm. When the transparent layer pattern is formed, the thickness of the carbon layer is set to be 80 nm or more.

公开(公告)号：US5437961A

公开(公告)日：1995-08-01

申请号：US263415

申请日：1994-06-21

申请人： Hiroyuki Yano ,  Haruo Okano ,  Tohru Watanabe ,  Keiji Horioka

发明人： Hiroyuki Yano ,  Haruo Okano ,  Tohru Watanabe ,  Keiji Horioka

IPC分类号： G03F7/00 ,  H01L21/027 ,  H01L21/768

CPC分类号： G03F7/0005 ,  H01L21/0276 ,  H01L21/76885 ,  Y10S430/151 ,  Y10S438/95

摘要： A method of manufacturing a semiconductor device is disclosed. The method comprises the steps of forming carbon layer on a light-reflective layer or a transparent layer formed on a light-reflective layer, forming a photosensitive resin layer on the carbon layer, selectively radiating light on the photosensitive resin layer, forming a photosensitive resin pattern by developing the photosensitive resin layer selectively irradiated with the light, forming a carbon pattern by etching the carbon layer using the photosensitive pattern as a mask, and forming a light-reflective pattern or a transparent layer pattern by etching the light-reflective layer using the photosensitive resin layer or the carbon pattern as a mask. When the light-reflective layer pattern is formed, the thickness of the carbon layer is set to be less than 100 nm. When the transparent layer pattern is formed, the thickness of the carbon layer is set to be 80 nm or more.

摘要翻译： 公开了制造半导体器件的方法。 该方法包括以下步骤：在形成在光反射层上的光反射层或透明层上形成碳层，在碳层上形成感光性树脂层，在感光性树脂层上选择性地照射光，形成感光性树脂 通过显影选择性地照射光的感光性树脂层，通过使用感光图案作为掩模蚀刻碳层形成碳图案，并且通过使用以下方式蚀刻光反射层来形成光反射图案或透明层图案： 感光性树脂层或碳图案作为掩模。 当形成光反射层图案时，碳层的厚度设定为小于100nm。 当形成透明层图案时，碳层的厚度设定为80nm以上。

公开(公告)号：US5660744A

公开(公告)日：1997-08-26

申请号：US492322

申请日：1995-06-19

申请人： Makoto Sekine ,  Keiji Horioka ,  Haruo Okano ,  Katsuya Okumura ,  Isahiro Hasegawa ,  Masaki Narita

发明人： Makoto Sekine ,  Keiji Horioka ,  Haruo Okano ,  Katsuya Okumura ,  Isahiro Hasegawa ,  Masaki Narita

IPC分类号： H01J37/32 ,  B23K10/00

CPC分类号： H01J37/32623 ,  H01J37/3266

摘要： A surface processing apparatus comprises a container provided with a first electrode and a second electrode disposed opposite to the first electrode for supporting a substrate to be processed and filled with a gas at a reduced pressure, an electric field generator for generating an electric field between the first and second electrodes, and a magnetic field generator for generating a magnetic field in the vacuum container. The magnetic field generator comprises a plurality of magnet element groups arranged in a circle around the container so as to form a ring, each of the magnet element groups having an axis directed to a center of the circle and a synthetic magnetization direction and comprising one or a plurality of magnet elements having respective magnetization directions which are synthesized to be equal to the synthetic magnetization direction of the each of the magnetic element groups. One of the magnet element groups is so disposed that the synthetic magnetization direction thereof coincides with the axis thereof, and each of the magnet element groups other than the one magnet element group is so disposed that an angle of the synthetic magnetization direction thereof relative to the synthetic magnetization direction of the one magnet element group is substantially twice an angle of the axis thereof relative to the axis of the one magnet element group.

摘要翻译： 表面处理装置包括：容器，其设置有第一电极和与第一电极相对设置的第二电极，用于支撑待处理的基板并在减压下填充气体;电场发生器，用于在第一电极之间产生电场; 第一和第二电极以及用于在真空容器中产生磁场的磁场发生器。 磁场发生器包括围绕容器布置成圆形的多个磁体元件组，以便形成环，每个磁体元件组具有指向圆心的合成磁化方向的轴线，并包括一个或多个 多个磁体元件，其各自的磁化方向被合成为等于每个磁性元件组的合成磁化方向。 一个磁体元件组被设置成合成磁化方向与其轴线重合，并且除了一个磁体元件组之外的每个磁体元件组被设置成使得其合成磁化方向相对于 一个磁体元件组的合成磁化方向基本上是相对于一个磁体元件组的轴线的轴的两倍。

公开(公告)号：US5444207A

公开(公告)日：1995-08-22

申请号：US37169

申请日：1993-03-26

申请人： Makoto Sekine ,  Keiji Horioka ,  Haruo Okano ,  Katsuya Okumura ,  Isahiro Hasegawa ,  Masaki Narita

发明人： Makoto Sekine ,  Keiji Horioka ,  Haruo Okano ,  Katsuya Okumura ,  Isahiro Hasegawa ,  Masaki Narita

IPC分类号： B23K10/00 ,  H01J37/32 ,  H01L21/00 ,  H05H1/18

CPC分类号： H01J37/32623 ,  B23K10/003 ,  H01J37/3266

摘要： A surface processing device and method for forming a magnetic field having a uniform strength over a wide area of an electrode surface to generate a uniform high density plasma over the overall surface of a wafer. The device comprises a vacuum container contains a first electrode and a second electrode disposed opposite to the first electrode; a gas feeding system for feeding a predetermined gas into the vacuum container; an evacuating system for maintaining the inside of the container at a reduced pressure; an electric field generating system for generating an electric field in a region between the first and second electrodes; and a magnetic field generating system for generating a magnetic field in the vacuum container. The magnetic field generating system comprising a plurality of magnets arranged around the outer periphery of the container so as to form a ring in such a manner that directions of magnetization thereof differ from adjacent magnetic element making a 720 degree rotation along the circumference of said ring.

摘要翻译： 一种用于形成在电极表面的广泛区域上具有均匀强度的磁场的表面处理装置和方法，以在晶片的整个表面上产生均匀的高密度等离子体。 该装置包括：真空容器，包含第一电极和与第一电极相对设置的第二电极; 用于将预定气体供给到真空容器中的气体供给系统; 用于在减压下保持容器内部的排气系统; 用于在第一和第二电极之间的区域中产生电场的电场产生系统; 以及用于在真空容器中产生磁场的磁场产生系统。 磁场产生系统包括围绕容器的外周布置的多个磁体，以便形成环，使得其磁化方向与相邻的磁性元件不同，沿着所述环的圆周旋转720度。