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    OXIDATION ANNEALING DEVICE AND METHOD FOR FABRICATING THIN FILM TRANSISTOR USING OXIDATION ANNEALING
    7.
    发明申请
    OXIDATION ANNEALING DEVICE AND METHOD FOR FABRICATING THIN FILM TRANSISTOR USING OXIDATION ANNEALING 有权
    氧化退火装置和使用氧化退火制造薄膜晶体管的方法

    公开(公告)号：US20130280925A1

    公开(公告)日：2013-10-24

    申请号：US13883027

    申请日：2011-10-28

    申请人： Yoshifumi Ota ,  Masato Hashimoto

    发明人： Yoshifumi Ota ,  Masato Hashimoto

    IPC分类号： H01L21/324

    CPC分类号： H01L21/324 ,  H01L21/477 ,  H01L21/67115 ,  H01L21/67178 ,  H01L21/6719 ,  H01L29/7869

    摘要： A far-infrared plane heater 6 is placed in a closed-container-shaped device body 3 of an oxidation annealing device 1, an oxygen addition gas feed pipe 8 through which an oxygen addition gas containing water vapor and oxygen is fed into the device body 3 is connected to a gas exhaust pipe 11 through which gas in the device body 3 is discharged, and jet nozzles 16 through which the oxygen addition gas containing water vapor and oxygen is ejected to an oxygen-deficient portion of a substrate 50 are brought into communication with the oxygen addition gas feed pipe 8. This allows oxidation annealing of a large substrate at high throughput and low cost while preventing a leakage current.

    摘要翻译： 将远红外线加热器6放置在氧化退火装置1的密闭容器状的装置主体3内，氧气添加气体供给管8，含有水蒸汽和氧气的氧气添加气体通过该氧气供给管8供给到装置主体 3连接到排气管11，通过该排气管11排出装置主体3中的气体，并且将含有水蒸气和氧气的氧气添加气体喷射到基板50的缺氧部分的喷嘴16被引入 与氧气添加气体供给管8的通信。这允许大的基板以高生产率和低成本进行氧化退火，同时防止漏电流。

    Chip-type electronic component and chip resistor
    8.
    发明授权
    Chip-type electronic component and chip resistor 失效
    片式电子元器件和片式电阻器

    公开(公告)号：US07161459B2

    公开(公告)日：2007-01-09

    申请号：US11240289

    申请日：2005-09-30

    申请人： Mitsuru Harada ,  Kazunori Omoya ,  Masato Hashimoto ,  Akio Fukuoka

    发明人： Mitsuru Harada ,  Kazunori Omoya ,  Masato Hashimoto ,  Akio Fukuoka

    IPC分类号： H01C7/10

    CPC分类号： H01C7/003 ,  H01C1/148 ,  H01C17/065 ,  H01C17/283

    摘要： In chip electronic components, the application state of conductive paste that makes side electrodes can be optically distinguished in the production of small-sized chip electronic components. The chip electronic component comprises a substrate, and side electrodes disposed at the end portions of the substrate. The lightness of an entire surface of the side electrode is not more than 6 as defined in JIS-Z8721.

    摘要翻译： 在芯片电子元件中，制造侧电极的导电浆料的应用状态可以在制造小尺寸芯片电子部件时被光学地区分开。 芯片电子部件包括基板和设置在基板的端部的侧电极。 侧面电极的整个表面的亮度不超过JIS-Z8721中规定的6。

    Resistor and its manufacturing method
    9.
    发明授权
    Resistor and its manufacturing method 有权
    电阻及其制造方法

    公开(公告)号：US06023217A

    公开(公告)日：2000-02-08

    申请号：US226549

    申请日：1999-01-07

    申请人： Hiroyuki Yamada ,  Masato Hashimoto ,  Seiji Tsuda

    发明人： Hiroyuki Yamada ,  Masato Hashimoto ,  Seiji Tsuda

    IPC分类号： H01C1/142 ,  H01C17/00 ,  H01C17/28 ,  H05K3/34 ,  H01C1/012

    CPC分类号： H01C17/281 ,  H01C1/142 ,  H01C17/006 ,  H05K3/3442

    摘要： A resistor comprising a substrate, a pair of first top electrode layers disposed at least on the top face of the substrate, a resistance layer disposed so as to electrically connect with the first top electrode layers, a protective layer disposed so as to cover at least the resistance layer, and a pair of second top electrode layers disposed at least on the top faces of the pair of first top electrode layers. At least one of the pairs of first top electrode layers or second top electrode layers partially extends to the substrate side faces.

    摘要翻译： 一种电阻器，包括基板，至少设置在所述基板的顶面上的一对第一顶电极层，设置为与所述第一顶电极层电连接的电阻层，设置成至少覆盖所述第一顶电极层的保护层 所述电阻层和至少设置在所述一对第一顶电极层的顶面上的一对第二顶电极层。 成对的第一顶部电极层或第二顶部电极层中的至少一个部分地延伸到衬底侧面。