公开(公告)号：US20050221536A1

公开(公告)日：2005-10-06

申请号：US11096058

申请日：2005-03-31

申请人： Masatoshi Akagawa ,  Masao Nakazawa ,  Hideto Nakazawa

发明人： Masatoshi Akagawa ,  Masao Nakazawa ,  Hideto Nakazawa

IPC分类号： H01L23/40 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L23/34 ,  H01L23/36 ,  H01L23/373

CPC分类号： H01L23/3736 ,  H01L21/4882 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/16152

摘要： A method of manufacturing a radiating plate using In as a thermal conducting bonding material 20 provided between a semiconductor device and a radiating plate 14 and serving to bond a back surface of the semiconductor device to the radiating plate, includes the steps of carrying out a cleaning treatment for cleaning a surface of the radiating plate 14, supplying the In to the radiating plate 14, heating and melting the In and hermetically adhering the In 18 to the radiating plate, thereby obtaining an In integral type radiating plate.

摘要翻译： 使用In制作作为设置在半导体器件与散热板14之间并用于将半导体器件的后表面粘合到散热板上的导热接合材料20的散热板的制造方法包括以下步骤： 用于清洁散热板14的表面的处理，将In供应到散热板14中，对In进行加热和熔化，并将In 18气密地粘附到散热板上，从而获得In积分型散热板。

公开(公告)号：US07445965B2

公开(公告)日：2008-11-04

申请号：US11096058

申请日：2005-03-31

申请人： Masatoshi Akagawa ,  Masao Nakazawa ,  Hideto Nakazawa

发明人： Masatoshi Akagawa ,  Masao Nakazawa ,  Hideto Nakazawa

IPC分类号： H01L21/00

CPC分类号： H01L23/3736 ,  H01L21/4882 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/16152

摘要： A method of manufacturing a radiating plate using In as a thermal conducting bonding material 20 provided between a semiconductor device and a radiating plate 14 and serving to bond a back surface of the semiconductor device to the radiating plate, includes the steps of carrying out a cleaning treatment for cleaning a surface of the radiating plate 14, supplying the In to the radiating plate 14, heating and melting the In and hermetically adhering the In 18 to the radiating plate, thereby obtaining an In integral type radiating plate.

摘要翻译： 使用In制作作为设置在半导体器件与散热板14之间并用于将半导体器件的后表面粘合到散热板上的导热接合材料20的散热板的制造方法包括以下步骤： 用于清洁散热板14的表面的处理，将In供应到散热板14中，对In进行加热和熔化，并将In 18气密地粘附到散热板上，从而获得In积分型散热板。

公开(公告)号：US07100279B2

公开(公告)日：2006-09-05

申请号：US10828210

申请日：2004-04-21

申请人： Tadatomo Suga ,  Toshihiro Itoh ,  Hideto Nakazawa ,  Masatoshi Akagawa

发明人： Tadatomo Suga ,  Toshihiro Itoh ,  Hideto Nakazawa ,  Masatoshi Akagawa

IPC分类号： H05K3/34 ,  H01R9/00 ,  B23K31/02

CPC分类号： H01L24/81 ,  H01L23/49816 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/81054 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/81894 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H05K3/3436 ,  H05K2203/085 ,  H05K2203/086 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49197 ,  H01L2224/05624 ,  H01L2924/00014

摘要： A method of mounting an electronic part on a board, in which an electronic part and a mounting board on which the electronic part is to be mounted are placed in a vacuum or inert atmosphere, and the electronic part is mounted on the board by bringing the bonding members of the electronic part and the board into contact with each other at normal temperature to thereby mount the electronic part on the board, the method comprising forming the bonding members of at least one of the electronic part and the board out of a solder material, and bringing the bonding members of the electronic part and the board into contact with each other without preprocessing the bonding surfaces of the bonding members.

摘要翻译： 将电子部件安装在基板上的方法，其中要将电子部件和其上安装电子部件的安装板放置在真空或惰性气氛中，并且通过使电子部件和电子部件 电子部件和电路板的接合部件在常温下彼此接触，从而将电子部件安装在电路板上，该方法包括从焊料材料形成至少一个电子部件和电路板的接合部件 并且使电子部件和基板的接合部件彼此接触而不对接合部件的接合面进行预处理。