公开(公告)号：US20130087370A1

公开(公告)日：2013-04-11

申请号：US13617366

申请日：2012-09-14

Applicant: Masatoshi INABA ,  Hiroshi MIYATA ,  Hirohito WATANABE

Inventor： Masatoshi INABA ,  Hiroshi MIYATA ,  Hirohito WATANABE

IPC: B32B38/10 ,  H05K1/00

CPC classification number: H05K3/244 ,  H05K1/118 ,  H05K3/26

Abstract: A method of manufacturing a printed circuit board includes: forming a copper layer of an interconnection pattern on a base film; laminating a cover lay on the base film so as to expose a part of the copper layer from the cover lay and cover the copper layer by the cover lay; mechanically polishing at least the exposed portion of the copper layer; and performing a plating process on the exposed portion of the copper layer so as to form a plated layer on the copper layer, and the angles α1 and α2 between the polishing direction of the exposed portion of the copper layer and the bending lines C1 and C2 satisfy the following formula (1): 30[°]≦α1 and α2≦150[°]  (1).

Abstract translation: 制造印刷电路板的方法包括：在基膜上形成互连图形的铜层; 将盖层叠在基膜上，以便从覆盖层露出铜层的一部分，并通过覆盖层覆盖铜层; 至少机械抛光铜层的暴露部分; 对铜层的露出部进行电镀处理，在铜层上形成镀层，铜层的露出部的研磨方向和弯曲线C1，C2的角度α1，α2 满足下列公式（1）：30 [°]＆nlE;α1和α2＆nlE; 150 [°]（1）。

公开(公告)号：US20120279050A1

公开(公告)日：2012-11-08

申请号：US13462399

申请日：2012-05-02

Applicant: Hirohito WATANABE ,  Taiji OGAWA ,  Takaomi Tomonaga ,  Eriko TOMONAGA

Inventor： Hirohito WATANABE ,  Taiji OGAWA ,  Takaomi Tomonaga ,  Eriko TOMONAGA

IPC: H05K3/00

CPC classification number: H05K1/0269 ,  H05K3/06 ,  H05K2201/09781 ,  H05K2203/1545 ,  H05K2203/163

Abstract: Quickly making changes to etching conditions suppresses the production yield of printed wiring boards from being deteriorated. Disclosed is a method comprising: an etching step that comprises: preparing a conductor-clad base material continuous in a certain direction, the conductor-clad base material (1) having an insulating layer and one or more conductive layers formed on main surfaces of the insulating layer; and subjecting a predetermined region of a conductor layer of one main surface of the conductor-clad base material (1) to an etching process thereby to form a wiring pattern (1a) to be of a product and an inspection pattern (1b) to be used for inspection; a measuring step that measures a line width of the inspection pattern after the etching step; and a control step that controls an etching condition in the etching step based on the measured line width.

Abstract translation: 迅速改变蚀刻条件抑制了印刷电路板的生产成本的恶化。 公开了一种方法，包括：蚀刻步骤，包括：制备在一定方向上连续的导体包覆基材，所述导体包覆基材（1）具有绝缘层和形成在所述导体包覆基材的主表面上的一个或多个导电层 绝缘层; 并对导体包覆基材（1）的一个主表面的导体层的预定区域进行蚀刻处理，从而形成作为产品的布线图案（1a）和检查图案（1b） 用于检验; 测量步骤，其测量所述蚀刻步骤之后的所述检查图案的线宽; 以及控制步骤，其基于所测量的线宽来控制蚀刻步骤中的蚀刻条件。

公开(公告)号：US20100307797A1

公开(公告)日：2010-12-09

申请号：US12754929

申请日：2010-04-06

Applicant: Hirohito WATANABE

Inventor： Hirohito WATANABE

IPC: H05K1/02 ,  H05K1/09 ,  H05K3/00

CPC classification number: H05K3/281 ,  H05K1/0281 ,  H05K3/0058 ,  H05K3/386 ,  H05K2201/2009 ,  H05K2203/0195 ,  H05K2203/0278 ,  Y10T29/49124

Abstract: To improve reliability by preventing separation of a sheet material attached on a flexible printed circuit, provided is a flexible printed circuit including a printed board body and a reinforcing board. A leaked portion of an adhesive agent is formed to leak in an outward direction relative to an end surface of the reinforcing board. The leaked portion adheres to part of the end surface of the reinforcing board to be continuous from a lower end of the end surface to form an inclined surface tapered in the outward direction. The leaked portion is formed such that a portion thereof that covers the end surface has an adhesion height hA, as measured from an adhesive surface of the reinforcing board, of greater than 0% and not greater than 80% of the thickness H1 of the reinforcing board.

Abstract translation: 为了通过防止附着在柔性印刷电路上的片材的分离来提高可靠性，提供了包括印刷板主体和加强板的柔性印刷电路。 粘合剂的泄漏部形成为相对于加强板的端面在向外方向泄漏。 泄漏部分粘附在加强板的端面的一部分上，从端面的下端连续，形成向外方向倾斜的倾斜面。 泄漏部分形成为使得其覆盖端面的部分具有从加强板的粘合表面测量的粘合高度hA大于加强件的厚度H1的0％且不大于80％ 板。

公开(公告)号：US20120205141A1

公开(公告)日：2012-08-16

申请号：US13345974

申请日：2012-01-09

Applicant: Taiji OGAWA ,  Hirohito WATANABE ,  Masakazu SATO

Inventor： Taiji OGAWA ,  Hirohito WATANABE ,  Masakazu SATO

IPC: H05K1/02

CPC classification number: H05K1/024 ,  H01P3/081 ,  H05K1/0225 ,  H05K1/0245 ,  H05K1/0253 ,  H05K2201/09236 ,  H05K2201/09681

Abstract: The printed wiring board has a conductor of signal line 41 and two conductive lines 42 on one face of the first insulating layer 10 covered by a second insulating layer 20, while having a ground layer of the ground 30 potential on the opposite face thereof, when the dielectric tangent A of the second insulating layer (insulating layer A) 20 is larger than the dielectric tangent B of the first insulating layer (insulating layer B) 10, Relational Expression 1: (relative permittivity B)·(width (W41) of signal line(s) 41)/(thickness (T10) of first insulating layer (insulating layer B) 10)>(relative permittivity A)·{(thickness (T41) of signal line(s) 41)/(distance (S1) between signal line(s) 41 and one conductive line 42a)+(thickness (T41) of signal line(s) 41)/(distance (S2) between signal line(s) 41 and other conductive line 42b)+(thickness (T41) of signal lines 41)/(distance (S3) between pair of signal lines (41a and 41b)·2} is satisfied.

Abstract translation: 印刷电路板具有由第二绝缘层20覆盖的第一绝缘层10的一面上的信号线41的导体和两条导线42，同时在其相对面上具有接地层30的电位的地层， 第二绝缘层（绝缘层A）20的介质切线A大于第一绝缘层（绝缘层B）10的介质切线B，关系式1（相对介电常数B）·（宽（W41） 信号线41）/（第一绝缘层（绝缘层B）的厚度（T10））10）>（相对介电常数A）·{（信号线的厚度（T41）41）/（距离（S1 信号线41和一根导线42a之间）+（信号线41的厚度（T41））/（信号线41与其他导线42b的距离（S2））+（厚度 信号线41的（T41）/（信号线对（41a，41b）·2之间的距离（S3））满足。

公开(公告)号：US20110247863A1

公开(公告)日：2011-10-13

申请号：US13077304

申请日：2011-03-31

Applicant: Hirohito WATANABE

Inventor： Hirohito WATANABE

IPC: H05K1/02 ,  H05K3/00

CPC classification number: H05K1/028 ,  H05K1/0218 ,  H05K3/1216 ,  H05K2201/0373

Abstract: [Object] To provide a flexible printed board improved in bendability.[Means for solving] The flexible printed board 2 comprises: an insulating substrate 21; a circuit wiring 22 laid on the insulating substrate 21; a circuit protection layer 23 laid on the circuit wiring 22; a shield conductive layer 24 laid on the circuit protection layer 23; and a shield insulating layer 25 laid on the shield conductive layer 24, and is characterized by meeting the following Expression (1). 0.75≦E2/E1≦1.29  Expression (1) Note that E1 denotes the tensile elastic modulus of the shield conductive layer 24 and E2 denotes the tensile elastic modulus of the shield insulating layer 25.

Abstract translation: 提供改善弯曲性的柔性印刷电路板。 [解决方案]柔性印刷电路板2包括：绝缘基板21; 布置在绝缘基板21上的电路布线22; 布置在电路布线22上的电路保护层23; 布置在电路保护层23上的屏蔽导电层24; 以及敷设在屏蔽导电层24上的屏蔽绝缘层25，其特征在于满足下述式（1）。 0.75＆nlE; E2 / E1＆nlE; 1.29表达式（1）注意，E1表示屏蔽导电层24的拉伸弹性模量，E2表示屏蔽绝缘层25的拉伸弹性模量。

公开(公告)号：US20100319972A1

公开(公告)日：2010-12-23

申请号：US12820605

申请日：2010-06-22

Applicant: Hirohito WATANABE

Inventor： Hirohito WATANABE

IPC: H05K1/11 ,  H05K1/02 ,  B32B37/02 ,  B29C65/02

CPC classification number: H05K1/117 ,  H05K1/118 ,  H05K3/0058 ,  H05K3/386 ,  H05K2201/0191 ,  H05K2201/09154 ,  H05K2201/09827 ,  H05K2201/2009 ,  Y10T29/49147 ,  Y10T156/10

Abstract: A printed circuit board having a connection terminal which includes: an insulating substrate including first and second surfaces, and an end surface along an outline normal to an insertion direction of the connection terminal; at least one lead wiring layer formed on the first surface of the insulating substrate; an insulating protection film covering the lead wiring layer; at least one lead terminal layer constituting an end portion of the lead wiring layer, the lead terminal layer being formed into a strip, and having an end surface along the outline; a reinforcement body adhered on the second surface of the insulating substrate at a backside position of the lead terminal layer; wherein a distance between an outer surface of the lead terminal layer and an outer surface of the reinforcement body on the outline side is smaller than a distance therebetween on the lead wiring layer side.

Abstract translation: 一种具有连接端子的印刷电路板，包括：绝缘基板，包括第一表面和第二表面;以及沿着垂直于连接端子的插入方向的轮廓的端面; 形成在绝缘基板的第一表面上的至少一个引线布线层; 覆盖引线布线层的绝缘保护膜; 构成所述引线配线层的端部的至少一个引线端子层，所述引线端子层形成为带状，并且具有沿着所述轮廓的端面; 加强体，其在所述引线端子层的背面位置粘附在所述绝缘基板的所述第二表面上; 其中，引线端子层的外表面与轮廓侧的加强体的外表面之间的距离小于引线布线层侧的距离。