-
公开(公告)号:US5434682A
公开(公告)日:1995-07-18
申请号:US951392
申请日:1992-09-25
申请人: Masaya Imamura , Hiromi Ogata , Kensuke Sawase
发明人: Masaya Imamura , Hiromi Ogata , Kensuke Sawase
CPC分类号: H04N1/0312 , H04N1/0314 , H04N1/0318 , H04N2201/03112 , H04N2201/03154
摘要: There is provided an image sensor which can reduce loss in light emitted from a light emitting section toward an object to be sensed and also variability in the distribution of light and which can be produced with a small-sized structure with a reduced number of parts and with a decreased manufacturing cost. An optical path from the light emitting section to a transparent covering on which the object is to be placed is surrounded by a light reflecting portion. Light from the light emitting section can be irradiated onto the transparent covering without reduction in the amount of light while being repeatedly reflected by the light reflecting portion. The light reflected by the object is condensed by a condensing lens, the condensed light being then received by a light receiving section mounted on the same base plate as in the light emitting section. At the light receiving section, the light is converted into an electrical signal.
摘要翻译: 提供了一种图像传感器,其可以减少从发光部分朝向待感测物体发射的光的损失,并且还可以减少光的分布,并且可以用具有减少的部件数量的小尺寸结构来产生, 制造成本降低。 从光发射部到其上要放置物体的透明覆盖层的光路被光反射部分包围。 来自发光部的光能够在光反射部反复反射的同时减少光量而照射到透明覆盖物上。 被物体反射的光被会聚透镜会聚,聚光后由与发光部相同的基板安装的受光部接收。 在光接收部分,光被转换成电信号。
-
公开(公告)号:US5506612A
公开(公告)日:1996-04-09
申请号:US929009
申请日:1992-08-13
申请人: Hiromi Ogata , Hideharu Hamada , Manabu Yokoyama , Masaya Imamura
发明人: Hiromi Ogata , Hideharu Hamada , Manabu Yokoyama , Masaya Imamura
CPC分类号: B41J2/451
摘要: In an LED head, a photosensitive drum is positioned with reference to an upper surface of a circuit board on which surface at least one light-emitting element is supported in order to accurately set the distance between the light-emitting element and a photosensitive drum. Further, clips and a spring are used to accurately set the distance between the light-emitting element and a lens and to simplify the process of production.
摘要翻译: 在LED头中,感光鼓相对于电路板的上表面定位,在该表面上支撑有至少一个发光元件,以便精确地设定发光元件和感光鼓之间的距离。 此外,夹子和弹簧用于精确地设定发光元件和透镜之间的距离,并且简化了制造过程。
-
公开(公告)号:US06553155B1
公开(公告)日:2003-04-22
申请号:US08227992
申请日:1994-04-15
申请人: Masaya Imamura , Hiromi Ogata
发明人: Masaya Imamura , Hiromi Ogata
IPC分类号: G06K710
CPC分类号: G06K7/10722 , G06K7/10811
摘要: An image sensor can easily adjust the focus by the use of an inexpensive focus adjusting means even if the dimensional accuracy in the image sensor frame is very low. In the image sensor or an optical character reader incorporating such an image sensor, an original document W, which is being conveyed onto a transparent covering by a platen roller, is irradiated by light from a light emitting element. The light reflected by the original document W is received and condensed by a rod lens array which is positioned perpendicular to the surface of the transparent covering. The condensed light is received by a light receiving element which is located directly below the rod lens array. At the light receiving element, the light is converted into an electrical signal. The image sensor includes a frame having an opened top which includes inner tapered sidewalls opposed to each other. When a transparent covering having the conventional configuration is to be mounted in the opened top of the frame, the focal length H can be easily adjusted by changing the inclination of the transparent covering relative to the opened top of the frame.
摘要翻译: 即使图像传感器框架中的尺寸精度非常低,图像传感器也可以通过使用便宜的焦点调节装置来容易地调节焦点。 在图像传感器或包含这种图像传感器的光学字符读取器中,通过压纸辊被传送到透明覆盖物上的原稿W被来自发光元件的光照射。 由原稿W反射的光被垂直于透明罩的表面定位的杆状透镜阵列接收和聚光。 聚光由位于棒状透镜阵列正下方的光接收元件接收。 在光接收元件处,光被转换为电信号。 图像传感器包括具有开口顶部的框架,该开口顶部包括彼此相对的内锥形侧壁。 当将具有常规构造的透明覆盖物安装在框架的开口顶部时,可以通过改变透明覆盖物相对于框架的开口顶部的倾斜度来容易地调节焦距H.
-
公开(公告)号:US5570122A
公开(公告)日:1996-10-29
申请号:US182726
申请日:1994-01-14
申请人: Masaya Imamura , Hiromi Ogata , Kensuke Sawase
发明人: Masaya Imamura , Hiromi Ogata , Kensuke Sawase
CPC分类号: H04N1/02427 , B41J2/315 , H04N1/024 , H04N1/02463
摘要: A glass cover is mounted on the top portion of a frame and, in the frame, a light source substrate with a light emitting element packaged therein is fixed and a rod lens array is fixed, a substrate with a light receiving element packaged therein is disposed in the lower portion of the frame, a substrate including a heating resistor is mounted in the lower portion of the frame, a drive element for driving the heating resistor is packaged on the back side of the substrate, and the drive element is electrically connected with the substrate.
摘要翻译: 玻璃盖安装在框架的顶部,并且在框架中固定具有封装在其中的发光元件的光源基板,并且固定杆透镜阵列,设置其中封装有光接收元件的基板 在框架的下部,包括加热电阻器的基板安装在框架的下部,用于驱动加热电阻器的驱动元件封装在基板的背面,驱动元件与 底物。
-
公开(公告)号:US5477329A
公开(公告)日:1995-12-19
申请号:US6631
申请日:1993-01-21
申请人: Masaya Imamura , Hiromi Ogata
发明人: Masaya Imamura , Hiromi Ogata
CPC分类号: H04N1/024
摘要: To provide an image sensor which enables internally mounted electronic parts such as a light receiving element to be protected against adverse affection at assembly of the image sensor, electronic parts in a control block to be easily adjusted after assembly, and the control block to be replaced easily and at low cost conforming to various electrical characteristic requirements, a part of a board containing a light emitting element and/or a light receiving element disposed within a frame is projected from the frame, having a glass cover on the top and side boards on both sides and terminals on one side of a connection terminal block are soldered to the projection of the board and terminals on the other side are soldered to a hybrid unit used as a control block for controlling electric signals of internally mounted electronic parts such as the light emitting and receiving elements. The hybrid unit consists of an electronic parts package and a board to which the package is soldered.
摘要翻译: 为了提供图像传感器,其能够在诸如光接收元件的内部安装的电子部件被保护以防止图像传感器的组装时的不利影响,控制块中的电子部件在组装之后容易地调整,以及待更换的控制块 容易且以低成本符合各种电气特性要求,包含发光元件和/或设置在框架内的光接收元件的板的一部分从框架突出,在顶部和侧板上具有玻璃盖 连接端子块的一侧的两侧和端子焊接到板的突起,另一侧的端子焊接到用作控制内部安装的电子部件如光的电信号的控制块的混合单元 发射和接收元件。 混合单元由电子零件封装和封装焊接的电路板组成。
-
6.
公开(公告)号:US5475417A
公开(公告)日:1995-12-12
申请号:US959652
申请日:1992-10-13
申请人: Hiromi Ogata , Norimichi Teshiba , Masaya Imamura
发明人: Hiromi Ogata , Norimichi Teshiba , Masaya Imamura
CPC分类号: B41J2/45 , H01L2224/48137 , H01L2224/48484 , H01L2224/8592 , H01L2924/01068 , H01L2924/12041 , H01L2924/1815 , H01L33/54
摘要: An LED array printhead comprises a head substrate which carries an array of semiconductor LED chips and an array of drive IC's in corresponding relation to the LED chips. Each of the LED chips has a plurality of light emitting portions. The printhead further comprises a transparent resin coating for covering at least the LED chip array. The resin coating is provided with at least one convex lens portion at a position corresponding to a selected light emitting portion of the LED whose luminance is lower than a predetermined level.
摘要翻译: LED阵列打印头包括:头基板,其承载半导体LED芯片的阵列和与LED芯片对应关系的驱动IC阵列。 每个LED芯片具有多个发光部分。 该打印头还包括用于至少覆盖LED芯片阵列的透明树脂涂层。 在与LED的亮度低于预定水平的所选发光部分对应的位置上设置有至少一个凸透镜部分的树脂涂层。
-
公开(公告)号:US08890568B2
公开(公告)日:2014-11-18
申请号:US13371994
申请日:2012-02-13
申请人: Hiromi Ogata
发明人: Hiromi Ogata
IPC分类号: H01L25/00 , H03K19/00 , H03K17/687 , H01L27/02 , H01L27/092 , H01L27/118
CPC分类号: H03K17/6872 , H01L27/0207 , H01L27/092 , H01L27/11807 , H03K3/012 , H03K17/16 , H03K19/0185
摘要: A semiconductor integrated circuit including: a circuit block having an internal voltage line; an annular rail line forming a closed annular line around the circuit block and supplied with one of a power supply voltage and a reference voltage; and a plurality of switch blocks arranged around the circuit block along the annular rail line, the plurality of switch blocks each including a voltage line segment forming a part of the annular rail line and a switch for controlling connection and disconnection between the voltage line segment and the internal voltage line.
摘要翻译: 一种半导体集成电路,包括:具有内部电压线的电路块; 环形轨道线,围绕电路块形成封闭的环形线,并提供电源电压和参考电压之一; 以及沿着所述环形轨道线布置在所述电路块周围的多个开关块,所述多个开关块各自包括形成所述环形轨道线的一部分的电压线段和用于控制所述电压线段与所述电压线段之间的连接和断开的开关 内部电压线。
-
公开(公告)号:US08143914B2
公开(公告)日:2012-03-27
申请号:US12929180
申请日:2011-01-06
申请人: Hiromi Ogata
发明人: Hiromi Ogata
IPC分类号: H01L25/00 , H03K19/173 , H03K3/01 , G05F1/10 , G05F3/02
CPC分类号: H03K17/6872 , H01L27/0207 , H01L27/092 , H01L27/11807 , H03K3/012 , H03K17/16 , H03K19/0185
摘要: A semiconductor integrated circuit including: a circuit block having an internal voltage line; an annular rail line forming a closed annular line around the circuit block and supplied with one of a power supply voltage and a reference voltage; and a plurality of switch blocks arranged around the circuit block along the annular rail line, the plurality of switch blocks each including a voltage line segment forming a part of the annular rail line and a switch for controlling connection and disconnection between the voltage line segment and the internal voltage line.
摘要翻译: 一种半导体集成电路,包括:具有内部电压线的电路块; 环形轨道线,围绕电路块形成封闭的环形线,并提供电源电压和参考电压之一; 以及沿着所述环形轨道线布置在所述电路块周围的多个开关块,所述多个开关块各自包括形成所述环形轨道线的一部分的电压线段和用于控制所述电压线段与所述电压线段之间的连接和断开的开关 内部电压线。
-
公开(公告)号:US07940080B2
公开(公告)日:2011-05-10
申请号:US12230098
申请日:2008-08-22
申请人: Hiromi Ogata
发明人: Hiromi Ogata
IPC分类号: H03K19/173 , G11C11/00
CPC分类号: H03K17/6872 , H01L27/0207 , H01L27/092 , H01L27/11807 , H03K3/012 , H03K17/16 , H03K19/0185
摘要: A semiconductor integrated circuit including: a circuit block having an internal voltage line; an annular rail line forming a closed annular line around the circuit block and supplied with one of a power supply voltage and a reference voltage; and a plurality of switch blocks arranged around the circuit block along the annular rail line, the plurality of switch blocks each including a voltage line segment forming a part of the annular rail line and a switch for controlling connection and disconnection between the voltage line segment and the internal voltage line.
-
公开(公告)号:US07750681B2
公开(公告)日:2010-07-06
申请号:US12285375
申请日:2008-10-02
申请人: Hiromi Ogata
发明人: Hiromi Ogata
IPC分类号: H03K19/00
CPC分类号: H01L23/528 , H01L23/5286 , H01L27/0203 , H01L27/0207 , H01L2924/0002 , H01L2924/3011 , H03K19/0016 , H01L2924/00
摘要: A semiconductor integrated circuit includes: a main-interconnect to which supply voltage or reference voltage is applied; a plurality of sub-interconnects; a plurality of circuit cells configured to be connected to the plurality of sub-interconnects; a power supply switch cell configured to control, in accordance with an input control signal, connection and disconnection between the main-interconnect and the sub-interconnect to which a predetermined one of the circuit cells is connected, of the plurality of sub-interconnects; and an auxiliary interconnect configured to connect the plurality of sub-interconnects to each other.
摘要翻译: 半导体集成电路包括:施加电源电压或参考电压的主互连; 多个子互连; 多个电路单元,被配置为连接到所述多个子互连; 电源开关单元,被配置为根据输入控制信号控制所述多个子互连中连接有所述电路单元的预定单元的所述主互连和子互连之间的连接和断开; 以及配置成将所述多个子互连件彼此连接的辅助互连。
-
-
-
-
-
-
-
-
-