摘要:
There is provided an image sensor which can reduce loss in light emitted from a light emitting section toward an object to be sensed and also variability in the distribution of light and which can be produced with a small-sized structure with a reduced number of parts and with a decreased manufacturing cost. An optical path from the light emitting section to a transparent covering on which the object is to be placed is surrounded by a light reflecting portion. Light from the light emitting section can be irradiated onto the transparent covering without reduction in the amount of light while being repeatedly reflected by the light reflecting portion. The light reflected by the object is condensed by a condensing lens, the condensed light being then received by a light receiving section mounted on the same base plate as in the light emitting section. At the light receiving section, the light is converted into an electrical signal.
摘要:
A glass cover is mounted on the top portion of a frame and, in the frame, a light source substrate with a light emitting element packaged therein is fixed and a rod lens array is fixed, a substrate with a light receiving element packaged therein is disposed in the lower portion of the frame, a substrate including a heating resistor is mounted in the lower portion of the frame, a drive element for driving the heating resistor is packaged on the back side of the substrate, and the drive element is electrically connected with the substrate.
摘要:
An LED light source with readily adjustable luminous energy including LED chips is disclosed. A resistor device is provided in order to control the current flowing in LED chips for reducing variance of luminous energy. The resistor device includes a plurality of resistors arranged in parallel, and a plurality of fuses connected in series with the respective resistors. In order to obtain the desired resistance value of the resistor device, the fuses connected to unnecessary resistors in series are burnt out by applying an excess current to the fuses thereby omitting a bonding process of the resistors or the like.
摘要:
An image sensor includes a frame 1, a light source unit 4 located in the frame 1 for irradiating light onto an original A to be read, a light receiving sensor 5 located in the frame 1 and including a plurality of light receiving portions arranged therein, and an optical system 6 located in the frame 1 for causing the light from the original A to be received by the light receiving portions in the light receiving sensor. The image sensor also includes at least one positioning portion formed in the frame 1 at an appropriate location and used to mount the light receiving sensor substrate 3 in the frame 1 and a stopper engaging and receiving portion 12 formed in the frame at an appropriate location. A leaf spring 2 has a stopper 21 formed thereon for detachably engaging the stopper engaging and receiving portion. The light receiving sensor substrate 3 properly positioned in the frame relative to the positioning portion 11 is resiliently biased against the frame. Thus, the light receiving sensor substrate can be detachably mounted and held in the frame.
摘要:
A small-sized image sensor which does not exert the deleterious influence of soldering, especially, on the light receiving device when attaching a substrate for a light emitting device. A glass cover (11) is attached to the upper portion of a frame (10), and a substrate of a light projecting portion having a light emitting device (12) is fixed to the frame (10) in such a manner as to be inclined toward the glass cover (11). A rod lens array (14) for converging the light reflected from a copy on the glass cover (11) is fixed to the frame (10) in such a manner as to be perpendicular to the glass cover (11). A sensor substrate (16) having a light receiving device (15) is disposed directly under the rod lens array (14), and a hybrid substrate (21) with an electronic part (20) mounted thereon is disposed in a space within the frame (10). The substrates (16) and (21) are connected by a lead frame (22 ) soldered to the bottom surface of the sensor substrate (16). The lead frame also supports the substrate (21).
摘要:
An LED array in which the optical output distribution in each light emitting region is as uniform as possible. An n electrode 3 is provided on the under surface of a substrate 2 and a p electrode is provided on the upper surface thereof. A multiplicity of light emitting regions 4 are formed on the upper layer of the substrate 2. Two strip-like conductor portions 6c extending over each light emitting region 4 in ohmic contact are connected to each electrode 6 so that a current is efficiently applied to the conductor portions 6c of each light emitting region 4 and the optical output distribution in each light emitting region 4 is made uniform.
摘要:
An LED array in which the optical output distribution in each light emitting region is as uniform as possible. An n electrode 3 is provided on the under surface of a substrate 2 and a p electrode is provided on the upper surface thereof. A multiplicity of light emitting regions 4 are formed on the upper layer of the substrate 2. Two strip-like conductor portions 6c extending over each light emitting region 4 in ohmic contact are connected to each electrode 6 so that a current is efficiently applied to the conductor portions 6c of each light emitting region 4 and the optical output distribution in each light emitting region 4 is made uniform.
摘要:
An image sensor comprises a light emitting element for emitting light to be irradiated onto the original document, a light receiving element for receiving the light reflected by the document, and a connector, all of which are mounted on the same base plate. The base plate is then mounted in a frame. Therefore, the image sensor can be produced through a reduced number of assembling steps and with a reduced dimension.
摘要:
The spots to be bonded are determined by a light intensity controller as data and bonding is carried out in accordance with the data. The data obtained are stored in a memory or disk memory. In the case of storing the data in the memory, the data is transmitted to a wire bonder as occasion demands, and the wire bonder carries out bonding in accordance with the received data. In the case of storing the data in the disk memory, the disk memory is mounted on the wire bonder. The wire bonder reads out the data from the disk memory as occasion demands and carries out wire bonding.
摘要:
An apparatus for optically writing information comprises a row of longitudinally spaced LED array chips, a photosensitive surface arranged to face the chip row in parallel thereto, and a lens system arranged between the chip row and the photosensitive surface. Each array chip has constantly spaced LEDs to provide luminescent dots. The lens system includes convex lens elements arranged in corresponding relation to the respective array chips to form magnified images, in inverted arrangement, of the luminescent dots of the respective array chips on the photosensitive surface, so that all of the dot images on the photosensitive surface are constantly spaced.