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    LIQUID CARTRIDGE
    1.
    发明申请
    LIQUID CARTRIDGE 审中-公开
    液体盒

    公开(公告)号：US20100186738A1

    公开(公告)日：2010-07-29

    申请号：US12668892

    申请日：2008-07-16

    申请人： Masaya Kobayashi ,  Haruhiko Terai ,  Hiroyuki Wada ,  Kenichi Sekine ,  Taisuke Iwashita ,  Yoshihisa Negishi

    发明人： Masaya Kobayashi ,  Haruhiko Terai ,  Hiroyuki Wada ,  Kenichi Sekine ,  Taisuke Iwashita ,  Yoshihisa Negishi

    IPC分类号： A61M11/00 ,  A61M15/00

    CPC分类号： A61M15/025 ,  A61M15/0003 ,  A61M15/0028 ,  A61M15/0036 ,  A61M15/0061 ,  A61M15/0085 ,  A61M2202/0468 ,  A61M2205/273 ,  A61M2205/3569 ,  A61M2205/3592

    摘要： A liquid cartridge of the present invention has a liquid ejection portion 1 for ejecting liquid droplets, a reservoir E1 for storing liquid, and a communicating member 3 for providing communication between both of them. The reservoir E1 has first and second storage portions 10a, 10b isolated by films 6 to 8 arranged spaced from each other and an atmospheric release portion. When a small diameter portion 5a is inserted into an applied concave portion 4 of the liquid ejection portion 1, a tip 3a of the communicating member 3 breaks through the first to third films 6 to 8 sequentially in the period from the beginning to the end of insertion. Consequently, liquid in the first storage portion 10a is filled into the ejection head 2 and thereafter liquid stored in the second storage portion 10b is filled.

    摘要翻译： 本发明的液体盒具有用于喷射液滴的液体喷射部分1，用于存储液体的储存器E1和用于在它们之间提供连通的连通构件3。 储存器E1具有由彼此隔开布置的膜6至8隔离的第一和第二存储部分10a，10b和大气释放部分。 当将小直径部分5a插入到液体喷射部分1的所施加的凹入部分4中时，连通构件3的尖端3a在从第一到第三薄膜6至8的开始到结束 插入。 因此，第一存储部分10a中的液体被填充到喷射头2中，然后填充存储在第二存储部分10b中的液体。

    LIQUID EJECTING HEAD
    2.
    发明申请
    LIQUID EJECTING HEAD 审中-公开
    液体喷射头

    公开(公告)号：US20100288270A1

    公开(公告)日：2010-11-18

    申请号：US12376056

    申请日：2008-12-05

    申请人： Hiroyuki Wada ,  Yoshihisa Negishi

    发明人： Hiroyuki Wada ,  Yoshihisa Negishi

    IPC分类号： A61M11/00

    CPC分类号： A61M15/025 ,  A61M2202/0468 ,  B41J2/025 ,  B41J2/1404 ,  B41J2/1433 ,  B41J2002/14475

    摘要： A liquid ejecting head includes an energy generating element for generating energy utilized for ejecting liquid containing a medicine, and a plurality of ejection outlets, provided for said energy generating element, for ejecting the liquid. Each of the ejection outlets has a rotationally asymmetrical cross-section in a plane parallel to the energy generating element.

    摘要翻译： 液体喷射头包括用于产生用于喷射含有药物的液体的能量的能量产生元件，以及为所述能量产生元件设置的用于喷射液体的多个喷射出口。 每个喷射出口在与能量产生元件平行的平面中具有旋转非对称的横截面。

    METHOD FOR CUTTING SOLID-STATE IMAGE PICKUP DEVICE
    3.
    发明申请
    METHOD FOR CUTTING SOLID-STATE IMAGE PICKUP DEVICE 失效
    切割固态图像拾取装置的方法

    公开(公告)号：US20090098683A1

    公开(公告)日：2009-04-16

    申请号：US12067584

    申请日：2006-09-19

    申请人： Yoshihisa Negishi ,  Manjirou Watanabe

    发明人： Yoshihisa Negishi ,  Manjirou Watanabe

    IPC分类号： H01L21/02

    CPC分类号： H01L27/14618 ,  H01L27/14683 ,  H01L2924/0002 ,  H01L2924/16235 ,  H01L2924/00

    摘要： A method for cutting a solid-state image pickup device with high accuracy and high quality is provided which does not cause any chipping and prevents damages to a wafer surface. A temporary bonding agent is coated to a back surface of a glass cover plate which is opposite to the surface having a spacer, and a transparent protective wafer having a surface to which an adhesive sheet having a reducible adhesive strength is attached is adhered to the surface of the glass cover plate to which the temporary bonding agent is coated, with the adhesive sheet facing to the glass cover plate surface. The adhered glass cover plate and protective wafer are cut from the surface of the glass cover plate to the temporary bonding agent. After a CCD wafer is bonded to the cut glass cover plate, the protective wafer, the adhesive sheet, and the temporary bonding agent are peeled off, and the CCD wafer is cut to obtain individual chips. In this way, a cutting of a solid-state image pickup device with high accuracy and high quality is achieved without any damage to a wafer surface.

    摘要翻译： 提供了一种用于切割高精度和高质量的固态图像拾取装置的方法，其不会引起任何碎裂并且防止对晶片表面的损坏。 将临时粘合剂涂覆到与具有间隔件的表面相对的玻璃盖板的背面，并且具有附着有具有可还原性粘合强度的粘合片的表面的透明保护性晶片粘附到表面 的粘合片面对玻璃盖板表面的玻璃盖板。 将粘附的玻璃盖板和保护晶片从玻璃盖板的表面切割成临时粘合剂。 将CCD晶片接合到切割的玻璃盖板上之后，剥离保护晶片，粘合片和临时粘接剂，切割CCD晶片以获得单独的芯片。 以这种方式，实现了高精度和高质量的固态图像拾取装置的切割，而没有对晶片表面的任何损坏。

    Solid-state imaging device and method of manufacturing the same
    5.
    发明授权
    Solid-state imaging device and method of manufacturing the same 失效
    固态成像装置及其制造方法

    公开(公告)号：US07592200B2

    公开(公告)日：2009-09-22

    申请号：US11165133

    申请日：2005-06-24

    申请人： Hiroshi Maeda ,  Kazuhiro Nishida ,  Yoshihisa Negishi ,  Shunichi Hosaka

    发明人： Hiroshi Maeda ,  Kazuhiro Nishida ,  Yoshihisa Negishi ,  Shunichi Hosaka

    IPC分类号： H01L21/00

    CPC分类号： H01L27/14618 ,  H01L31/0203 ,  H01L2924/0002 ,  H01L2924/00

    摘要： There are provided a semiconductor substrate 101 on which solid-state imaging devices are formed, and a translucent member 201 provided onto a surface of the semiconductor substrate such that spaces are provided to oppose to light receiving areas of the solid-state imaging devices, wherein external connecting terminals are arranged on an opposing surface of the semiconductor substrate 101 to a solid-state imaging device forming surface, and the external connecting terminals are connected to the solid-state imaging devices via through-holes provided in the semiconductor substrate 101.

    摘要翻译： 提供了形成有固态成像器件的半导体衬底101和设置在半导体衬底的表面上的半透明构件201，使得提供与固态成像器件的光接收区域相对的空间，其中 外部连接端子被配置在半导体衬底101的相对表面上，并与固态成像器件形成表面相连，外部连接端子通过设置在半导体衬底101中的通孔与固态成像器件连接。

    Method of Grinding Multilayer Body and Method of Manufacturing Solid State Image Pickup Device
    6.
    发明申请
    Method of Grinding Multilayer Body and Method of Manufacturing Solid State Image Pickup Device 审中-公开
    研磨多层体的方法及制作固态图像拾取装置的方法

    公开(公告)号：US20080003926A1

    公开(公告)日：2008-01-03

    申请号：US11663561

    申请日：2005-09-27

    申请人： Manjirou Watanabe ,  Yoshihisa Negishi ,  Hiroshi Maeda ,  Hitoshi Shimamura

    发明人： Manjirou Watanabe ,  Yoshihisa Negishi ,  Hiroshi Maeda ,  Hitoshi Shimamura

    IPC分类号： G01L23/02 ,  H01L21/301

    CPC分类号： H01L27/14618 ,  H01L21/31053 ,  H01L21/50 ,  H01L27/14621 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14683 ,  H01L27/14685 ,  H01L2924/0002 ,  H01L2924/16235 ,  H01L2924/00

    摘要： A method of grinding a multilayer body which can prevent a substrate from being damaged by a broken piece of a planar substance, which occurs during grinding and cutting in grinding and cutting the planar substance of the multilayer substance constructed by the substrate and the planar substance which are joined with an extremely narrow gap portion therebetween is provided. A protection layer of the substrate is formed in the gap portion in advance and the substrate can be prevented from being damaged by the broken piece of the planar substance occurring by grinding, in grinding and cutting the planar substance by cutting into the gap portion with a grindstone, of the multilayer body in which the substrate and the planar substance are joined to have the gap portion therebetween.

    摘要翻译： 一种研磨多层体的方法，其能够防止基板被磨削和切削期间发生的平面物质的破碎片而损坏，所述平面物质在由基板和平面物质构成的多层物质的研磨和切割中的平面物质中发生， 设置有非常窄的间隙部分。 基板的保护层预先形成在间隙部分中，并且可以防止基板由于通过研磨发生的平面物质的破碎片而被损坏，在通过切割到间隙部分中来研磨和切割平面物质时 研磨基板和平面状物质接合的多层体的磨石，其间具有间隙部分。