公开(公告)号：US06744179B2

公开(公告)日：2004-06-01

申请号：US09740913

申请日：2000-12-20

申请人： Masaya Wajima ,  Kenichi Kotani

发明人： Masaya Wajima ,  Kenichi Kotani

IPC分类号： H01L4108

CPC分类号： H03H9/177 ,  H03H9/0557 ,  H03H9/0561 ,  H03H9/1035

摘要： A piezoelectric resonator includes a piezoelectric resonating element, and a first exterior substrate and a second exterior substrate, laminated over and under, respectively, the piezoelectric resonating element. In the piezoelectric resonator, the first exterior substrate and the second exterior substrate each include a multilayer substrate having at least one layer of an internal electrode.

摘要翻译： 压电谐振器包括压电谐振元件和分别层叠在压电谐振元件上和之下的第一外部基板和第二外部基板。 在压电谐振器中，第一外部基板和第二外部基板各自包括具有至少一层内部电极的多层基板。

公开(公告)号：US06865090B2

公开(公告)日：2005-03-08

申请号：US10127472

申请日：2002-04-23

申请人： Masaya Wajima ,  Tsuneo Amano ,  Kenichi Kotani ,  Kenichi Sakai

发明人： Masaya Wajima ,  Tsuneo Amano ,  Kenichi Kotani ,  Kenichi Sakai

IPC分类号： H03H9/05 ,  H03H9/10 ,  H03H9/17 ,  H05K1/03

CPC分类号： H03H9/177 ,  H03H9/0514 ,  H03H9/0561 ,  H03H9/1014 ,  H03H9/1035 ,  Y10T428/24926

摘要： An outer coating substrate for an electronic component is constructed to be calcined at a low temperature, and greatly decreases the cost thereof while greatly improving the dimensional precision of the substrate. The outer coating substrate for an electronic component includes a multi-layered substrate including a first material layer that is sintered in a liquid phase and a second material layer that is not sintered at the sintering temperature of the first material layer. The first and second material layers are laminated, and calcined at the calcining temperature of the first material layer.

摘要翻译： 构成电子部件用外涂层基板，在低温下进行煅烧，大大降低成本，同时极大地提高基板的尺寸精度。 电子部件用外涂层基板包括：包含以液相烧结的第一材料层和在第一材料层的烧结温度下未烧结的第二材料层的多层基板。 将第一和第二材料层层压，并在第一材料层的煅烧温度下煅烧。

公开(公告)号：US06448696B2

公开(公告)日：2002-09-10

申请号：US09740914

申请日：2000-12-20

申请人： Masaya Wajima ,  Tsuneo Amano ,  Kenichi Kotani ,  Kenichi Sakai

发明人： Masaya Wajima ,  Tsuneo Amano ,  Kenichi Kotani ,  Kenichi Sakai

IPC分类号： H01L4108

CPC分类号： H03H9/177 ,  H03H9/0514 ,  H03H9/0561 ,  H03H9/1014 ,  H03H9/1035 ,  Y10T428/24926

摘要： An outer coating substrate for an electronic component is constructed to be calcined at a low temperature, and greatly decreases the cost thereof while greatly improving the dimensional precision of the substrate. The outer coating substrate for an electronic component includes a multi-layered substrate including a first material layer that is sintered in a liquid phase and a second material layer that is not sintered at the sintering temperature of the first material layer. The first and second material layers are laminated, and calcined at the calcining temperature of the first material layer.

摘要翻译： 构成电子部件用外涂层基板，在低温下进行煅烧，大大降低成本，同时极大地提高基板的尺寸精度。 电子部件用外涂层基板包括：包含以液相烧结的第一材料层和在第一材料层的烧结温度下未烧结的第二材料层的多层基板。 将第一和第二材料层层压，并在第一材料层的煅烧温度下煅烧。

公开(公告)号：US06839243B2

公开(公告)日：2005-01-04

申请号：US10372749

申请日：2003-02-24

申请人： Kenichi Kotani ,  Masaya Wajima

发明人： Kenichi Kotani ,  Masaya Wajima

IPC分类号： H01L23/12 ,  H01L23/02 ,  H01L41/09 ,  H01L41/22 ,  H01L41/23 ,  H01L41/29 ,  H01L41/313 ,  H03H3/02 ,  H03H9/02 ,  H03H9/05 ,  H03H9/10 ,  H03H9/17 ,  H03H9/54 ,  H03H9/56 ,  H05K1/03 ,  H05K3/40 ,  H05K3/46 ,  H01R12/16

CPC分类号： H03H9/0542 ,  H03H3/02 ,  H03H9/0561 ,  H03H9/1035 ,  H03H9/56 ,  H05K1/0306 ,  H05K3/403 ,  H05K3/4611 ,  H05K3/4629

摘要： An electronic component includes a laminate having a structure in which an element substrate and a sealing substrate are bonded to each other through an adhesive layer, a terminal electrode is arranged on the element substrate so as to be exposed at an end surface of the laminate, an outside electrode is disposed on the outer surface of the sealing substrate, the terminal electrode and the outside electrode are electrically connected to each other through an end surface electrode disposed on the end surface of the laminate, and the thickness of the end surface electrode is between about one half of the thickness of the adhesive layer and about five times of the thickness thereof.

摘要翻译： 电子部件包括具有通过粘合剂层将元件基板和密封基板接合的结构的层压体，在元件基板上配置端子电极以露出在层叠体的端面， 外部电极设置在密封基板的外表面上，端子电极和外部电极通过设置在层叠体的端面上的端面电极彼此电连接，并且端面电极的厚度为 约为粘合剂层厚度的约一半，约为其厚度的五倍。

公开(公告)号：US06570262B1

公开(公告)日：2003-05-27

申请号：US09525077

申请日：2000-03-14

申请人： Masaya Wajima

发明人： Masaya Wajima

IPC分类号： H01L23544

CPC分类号： H05K3/403 ,  H01L21/4846 ,  H01L2924/0002 ,  H05K1/0243 ,  H05K1/092 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/4061 ,  H05K2201/09181 ,  H05K2201/09854 ,  H05K2201/10068 ,  H01L2924/00

摘要： An apparatus and method for manufacturing substrate elements includes providing a mother substrate, and forming a plurality of through-holes on first lines and second lines opposing each other across sections on the mother substrate. The sections define each of the substrate elements to be formed. The through-holes on the first lines are disposed alternately with respect to the through-holes on the second lines. Electrodes are also provided on the principal plane of the mother substrate and on the inner surfaces of the through-holes. Then, the mother substrate is cut along cut lines in the vertical and horizontal directions.

摘要翻译： 用于制造衬底元件的装置和方法包括提供母体衬底，以及在母体衬底上的部分上彼此相对的第一线和第二线上形成多个通孔。 这些部分限定要形成的每个基板元件。 第一线上的通孔相对于第二线上的通孔交替设置。 电极也设置在母基板的主平面上和通孔的内表面上。 然后，沿着垂直和水平方向的切割线切割母基板。

公开(公告)号：US06433466B1

公开(公告)日：2002-08-13

申请号：US09802614

申请日：2001-03-09

申请人： Masaya Wajima

发明人： Masaya Wajima

IPC分类号： H01L4108

摘要： A piezoelectric resonant component is constructed such that it is possible to reduce the thickness of an exterior case member while preventing fracture and chipping of the exterior case member. The piezoelectric resonant component preferably includes exterior substrates defining exterior case members and being stacked on an energy trap type piezoelectric resonant element via adhesive layers disposed therebetween so as to define spaces for allowing for free and unhindered vibration of the piezoelectric vibration portion, and a plurality of external electrodes disposed on the surfaces of the exterior substrates on the opposite side of the surfaces thereof fastened to the piezoelectric resonant element are arranged so as not to overlap with the spaces through the intermediary of the exterior substrates.

公开(公告)号：US06276992B1

公开(公告)日：2001-08-21

申请号：US09212884

申请日：1998-12-16

申请人： Masuyoshi Houda ,  Masaya Wajima

发明人： Masuyoshi Houda ,  Masaya Wajima

IPC分类号： B24B100

CPC分类号： B81C1/00412 ,  B24C1/04 ,  H01L21/3046 ,  H05K1/0306 ,  H05K3/0044 ,  H05K2203/025

摘要： A method of forming a groove on a mother material substrate includes the steps of forming a first layer on a surface of the mother material substrate, the first layer including a chain-polymer material which is soluble in an organic solvent. Then a second layer is formed on the first layer except for a portion where the groove is to be formed. The second layer includes a chain-polymer material having very high resistance to sand blasting. Then a groove is formed by cutting the first layer and the mother material substrate at the portion where the groove is to be formed, by a sand blasting process in which sand is directed from above the second layer downwardly. Then the first and second layers are removed from the mother material by dissolving the first layer using the organic solvent.

摘要翻译： 在母材基板上形成槽的方法包括以下步骤：在母材基板的表面上形成第一层，第一层包括可溶于有机溶剂的链聚合物材料。 然后，除了要形成凹槽的部分之外，在第一层上形成第二层。 第二层包括具有非常高的抗喷砂性能的链聚合物材料。 然后，通过从第二层的上方向下方引导砂的喷砂处理，通过在要形成槽的部分切割第一层和母材基板而形成凹槽。 然后通过使用有机溶剂溶解第一层从母材中除去第一层和第二层。

公开(公告)号：US06274968B1

公开(公告)日：2001-08-14

申请号：US09173603

申请日：1998-10-16

申请人： Masaya Wajima ,  Ryuhei Yoshida

发明人： Masaya Wajima ,  Ryuhei Yoshida

IPC分类号： H01L4108

CPC分类号： H03H9/1035

摘要： An electronic component includes an electronic component element having a substantially rectangular plate disposed between upper and lower case substrates in the form of substantially rectangular plates such that the upper and lower case substrates and the electronic component element are stacked and define an integral unit. Assuming that the length of the shorter sides and the length of the longer sides of the electronic component element are a0 and b0, respectively, and that the length of the shorter sides and the length of the longer sides of the lower case substrate 3 are a1 and b1, respectively, the relationships a0

摘要翻译： 电子部件包括电子部件元件，其具有设置在大致矩形板的形式的上下壳体基板之间的大致矩形板，使得上下壳体基板和电子部件元件堆叠并限定一体的单元。 假设电子元件的长边长度和长边长度分别为a0和b0，下壳体基板3的长边长度和长边长度为a1 和b1分别满足关系a0

公开(公告)号：US06232699B1

公开(公告)日：2001-05-15

申请号：US09412966

申请日：1999-10-05

申请人： Masaya Wajima

发明人： Masaya Wajima

IPC分类号： H01L4108

CPC分类号： H03H9/1035 ,  H03H9/0207 ,  H03H9/0547 ,  H03H9/1014 ,  H03H9/132 ,  H03H9/177

摘要： An energy-trap piezoelectric resonator utilizing thickness extensional vibration includes a piezoelectric substrate and first and second resonance electrodes. The piezoelectric substrate is polarized in the thickness direction thereof and has first and second main surfaces. The first resonance electrode is partially disposed on the first main surface of the piezoelectric substrate, and the second resonance electrode is partially disposed on the second main surface of the piezoelectric substrate. The second resonance electrode is arranged to oppose the first resonance electrode with the piezoelectric substrate disposed therebetween and has an external dimension that is different from that of the first resonance electrode.

摘要翻译： 利用厚度延伸振动的能量陷波压电谐振包括压电基片和第一和第二谐振电极。 压电基板在其厚度方向上极化，并具有第一和第二主表面。 第一谐振电极部分地设置在压电基板的第一主表面上，第二谐振电极部分地设置在压电基板的第二主表面上。 第二谐振电极被布置成与设置在其间的压电基板相对的第一谐振电极相对，并且具有与第一谐振电极的外部尺寸不同的外部尺寸。

公开(公告)号：US06747392B1

公开(公告)日：2004-06-08

申请号：US09656106

申请日：2000-09-06

申请人： Masaya Wajima ,  Naoshi Bamoto

发明人： Masaya Wajima ,  Naoshi Bamoto

IPC分类号： H01L4104

CPC分类号： H03H9/177 ,  H03H9/02133 ,  H03H9/1014 ,  H03H9/1035 ,  H03H9/56 ,  H05K3/3442 ,  H05K2201/09381 ,  H05K2201/10083 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

摘要： A chip electronic component capable of being mounted with high density while preventing separation of bonded portions caused by solder fillets without requiring a case member having a complicated structure is provided at a low cost. The chip electronic component includes an electronic component element board including a circuit that defines an electronic component therein and having a pair of side surfaces and a lower surface, and a plurality of external electrodes extending over at least one of the side surface and the lower surface of the electronic component element and being electrically connected to the circuit provided therein. The electrode portion provided on the lower surface of the monolithic body as an electronic component element of each external electrode is provided with narrow portions and wide portions provided thereon, and the narrow portion continues to the external electrode portion provided on the side surface thereof.

摘要翻译： 以低成本提供能够以高密度安装的芯片电子部件，同时防止由焊接圆角引起的接合部分的分离而不需要具有复杂结构的壳体部件。 芯片电子部件包括电子元件基板，其包括在其中限定电子部件并具有一对侧表面和下表面的电路，以及多个外部电极，其在侧表面和下表面中的至少一个 并且电连接到设置在其中的电路。 设置在作为每个外部电极的电子元件的单片体的下表面上的电极部分设置有设置在其上的窄部分和宽部分，并且窄部分继续到设置在其侧表面上的外部电极部分。