摘要:
Disclosed is an apparatus for and a method of thixocasting a cast iron, that can effectively prevent the scale from mixing in the die (cavity) thereby to obtain sound iron castings having good mechanical properties. The apparatus includes at least a pair of dies that can freely opened and closed to define a cavity to be filled under a pressure, and an injector that injects the semi-molten iron into the cavity through a hole in a gate at the entry of the cavity so as to throttle the entry. The gate is a separate member disposed at the entry of the cavity every time an injection casting operation is carried out and is taken out together with the casting after the injection casting operation.
摘要:
A billet for a thixocasting process and a thixocasting process using the billet allows casting using a thixocasting process to be realized at low production cost without permeation of an oxide film to the inside of the billet in injection molding. In a billet used for a thixocasting process continuously cast by intermittently drawing out, the interval of the oscillation marks is 10 mm or less and the maximum tilt angle of the oscillation marks relative to a cross section which is at a right angle to the drawing out direction is 45° or less.
摘要:
An iron based alloy material for a thixocasting process and a method for casting the material which extends the service life of dies by inhibiting solidification contraction, and in which casting defects such as size variations and cracks can be inhibited. The material comprises 1.6 wt %≦C≦2.5 wt % and 3.0 wt %
摘要翻译:用于触变过程的铁基合金材料和通过抑制凝固收缩延长模具使用寿命的铸造材料的方法,并且其中可以抑制诸如尺寸变化和裂纹的铸造缺陷。 该材料包含1.6重量%<= C <= 2.5重量%和3.0重量%
摘要:
A thixocast Fe-based alloy material is provided, from which a cast product having mechanical properties uniform over the whole thereof can be produced. The Fe-based alloy material comprises 1.8% by weight≦C≦2.5% by weight, 1.0% by weight≦Si≦3.0% by weight, 0.1% by weight≦Mn≦1.5% by weight, 0.5% by weight≦Ni≦3.0% by weight, and as the balance, iron (Fe) including inevitable impurities. The eutectic crystal amount Ec is in a range of 10% by weight
摘要翻译:提供了一种触变Fe基合金材料,由此可以生产出具有整体机械性能均匀的铸造产品.Fe基合金材料包含1.8重量%<= C <2.5重量%,1.0 重量百分比<= Si <= 3.0%重量,0.1%(重量)<= Mn <= 1.5%(重量),0.5%(重量)
摘要:
An injection mold for casting a semi-solidified Fe alloy includes a scalping gate for eliminating surface oxide film of a semi-solidified Fe alloy injected into the mold cavity from a pressure chamber. The scalping gate is arranged between the pressure chamber and a runner that is in communication with the mold cavity. The mold halves and the scalping gate are each formed of a copper alloy having a thermal conductivity of not less than 120 W/(m·K) and a hardness of not less than 180 HB. The mold halves and the scalping gate each have a cermet layer consisting essentially of at least one member selected from a group consisting of Co, Cu, Cr and Ni. The cermet layer is formed by electro-spark deposition, via an intermediate layer of Ni alloy, which is also formed by electro-spark deposition.
摘要:
A battery system according to the present invention includes a secondary battery; a battery control unit that controls charging and discharging of said secondary battery; and a charging/discharging management unit that controls the charging and discharging of said secondary battery through said battery control unit, wherein said battery control unit, if an abnormality occurred during operation of said battery control unit, transmits remaining capacity data that represent a remaining capacity of said secondary battery that remained immediately before the abnormality occurred to said charging/discharging management unit.
摘要:
A semiconductor device includes: a semiconductor layer; at least one electrode formed on a semiconductor layer to be in contact with the semiconductor layer; and a passivation film covering the semiconductor layer and at least part of the top surface of the electrode to protect the semiconductor layer and formed of a plurality of sub-films. The passivation film includes a first sub-film made of aluminum nitride.
摘要:
A scrambler that facilitates encryption of data to be recorded and a magnetic storage device using this are provided. The scrambler has a shift register of a plurality of stages and an exclusive OR circuit that finds the exclusive OR of the logic of the stages of the shift register that correspond to a single generating polynomial. The output of the exclusive OR circuit is arranged to be fed back to the initial stage of the shift register. At least this single generating polynomial is an arbitrary generating polynomial. The drive number, in binary form, that identifies the storage device, is set as the initial value of the shift register of a plurality of stages.
摘要:
A nitride semiconductor device includes: a first semiconductor layer made of first nitride semiconductor; a second semiconductor layer formed on a principal surface of the first semiconductor layer and made of second nitride semiconductor having a bandgap wider than that of the first nitride semiconductor; a control layer selectively formed on, or above, an upper portion of the second semiconductor layer and made of third nitride semiconductor having a p-type conductivity; source and drain electrodes formed on the second semiconductor layer at respective sides of the control layer; a gate electrode formed on the control layer; and a fourth semiconductor layer formed on a surface of the first semiconductor layer opposite to the principal surface, having a potential barrier in a valence band with respect to the first nitride semiconductor and made of fourth nitride semiconductor containing aluminum.
摘要:
A semiconductor device includes: a first group-III nitride semiconductor layer formed on a substrate; a second group-III nitride semiconductor layer made of a single layer or two or more layers, formed on the first group-III nitride semiconductor layer, and acting as a barrier layer; a source electrode, a drain electrode, and a gate electrode formed on the second group-III nitride semiconductor layer, the gate electrode controlling a current flowing between the source and drain electrodes; and a heat radiation film with high thermal conductivity which covers, as a surface passivation film, the entire surface other than a bonding pad.