Ultra-Wide Field-of-View Flat Optics

    公开(公告)号:US20210306564A1

    公开(公告)日:2021-09-30

    申请号:US17209496

    申请日:2021-03-23

    IPC分类号: H04N5/232 G02B13/06 G02B1/00

    摘要: Wide-angle optical functionality is beneficial for imaging and image projection devices. Conventionally, wide-angle operation is attained by a complicated assembly of optical elements. Recent advances have led to meta-surface lenses or meta-lenses, which are ultra-thin planar lenses with nanoantennas that control the phase, amplitude, and/or polarization of light. Here, we present a meta-lens capable of diffraction-limited focusing and imaging over an unprecedented >170° angular field of view (FOV). The lens is integrated on a one-piece flat substrate and includes an aperture on one side and a single meta-surface on the other side. The meta-surface corrects third-order Seidel aberrations, including coma, astigmatism, and field curvature. The meta-lens has a planar focal plane, which enables considerably simplified system architectures for imaging and projection. The meta-lens design is generic and can be readily adapted to different meta-atom geometries and wavelength ranges to meet diverse application demands.

    Integrated Freeform Optical Couplers And Fabrication Methods Thereof

    公开(公告)号:US20230393357A1

    公开(公告)日:2023-12-07

    申请号:US18329059

    申请日:2023-06-05

    IPC分类号: G02B6/43 G02B6/42

    CPC分类号: G02B6/43 G02B6/4219

    摘要: The present technology is related to optics and optical systems, particularly to photonic packaging, optical coupling, optical interconnects, micro-optics, and their fabrication. The present technology includes free-form micro-optical coupler architectures and systems with superb optical performance and a high-throughput method of fabricating large-area coupler arrays for scalable manufacturing. Embodiments include chip-to-fiber-array, chip-to-chip, chip-to-interposer, and chip-to-free-space couplers for applications including photonic packaging, optical communications, LiDAR, optical trapping and manipulation, augmented reality, virtual reality, and sensing.

    GSST AND APPLICATIONS IN OPTICAL DEVICES
    5.
    发明申请

    公开(公告)号:US20200285083A1

    公开(公告)日:2020-09-10

    申请号:US16826489

    申请日:2020-03-23

    摘要: An alloy of GexSbySezTem includes atoms of Ge, Sb, Se, and Te that form a crystalline structure having a plurality of vacancies randomly distributed in the crystalline structure. The alloy can be used to construct an optical device including a first waveguide to guide a light beam and a modulation layer disposed on the first waveguide. The modulation includes the alloy of GexSbySezTem which has a first refractive index n1 in an amorphous state and a second refractive index n2, greater than the first refractive index by at least 1, in a crystalline state. The first waveguide and the modulation layer are configured to guide about 1% to about 50% of the light beam in the modulation layer when the alloy is in the amorphous state and guide no optical mode when the alloy is in the crystalline state.

    GSST AND APPLICATIONS IN OPTICAL DEVICES
    7.
    发明申请

    公开(公告)号:US20180284492A1

    公开(公告)日:2018-10-04

    申请号:US15941879

    申请日:2018-03-30

    摘要: An alloy of GexSbySezTem includes atoms of Ge, Sb, Se, and Te that form a crystalline structure having a plurality of vacancies randomly distributed in the crystalline structure. The alloy can be used to construct an optical device including a first waveguide to guide a light beam and a modulation layer disposed on the first waveguide. The modulation includes the alloy of GexSbySezTem which has a first refractive index n1 in an amorphous state and a second refractive index n2, greater than the first refractive index by at least 1, in a crystalline state. The first waveguide and the modulation layer are configured to guide about 1% to about 50% of the light beam in the modulation layer when the alloy is in the amorphous state and guide no optical mode when the alloy is in the crystalline state.

    MINIATURIZED FOURIER-TRANSFORM RAMAN SPECTROMETER SYSTEMS AND METHODS

    公开(公告)号:US20210025756A1

    公开(公告)日:2021-01-28

    申请号:US16928197

    申请日:2020-07-14

    摘要: State-of-the-art portable Raman spectrometers use discrete free-space optical components that must be aligned well and that don't tolerate vibrations well. Conversely, the inventive spectrometers are made with monolithic photonic integration to fabricate some or all optical components on one or more planar substrates. Photonic integration enables dense integration of components, eliminates manual alignment and individual component assembly, and yields superior mechanical stability and resistance to shock or vibration. These features make inventive spectrometers especially suitable for use in high-performance portable or wearable sensors. They also yield significant performance advantages, including a large (e.g., 10,000-fold) increase in Raman scattering efficiency resulting from on-chip interaction of the tightly localized optical mode and the analyte and a large enhancement in spectral resolution and sensitivity resulting from the integration of an on-chip Fourier-transform spectrometer.