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1.发明申请公开(公告)号：US20090001248A1
公开(公告)日：2009-01-01
申请号：US11844070
申请日：2007-08-23
申请人： Matthew J. Farinelli , Steven Cordes , Donna S. Nielsen , Samuel Roy McKnight , Jay S. Chey , Peter A. Gruber , Joanna Rosner
发明人： Matthew J. Farinelli , Steven Cordes , Donna S. Nielsen , Samuel Roy McKnight , Jay S. Chey , Peter A. Gruber , Joanna Rosner
IPC分类号： B22C9/00
CPC分类号： H05K3/3457 , H01L24/11 , H01L24/13 , H01L2224/11003 , H01L2224/1308 , H01L2224/13147 , H01L2224/13171 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/014 , H01L2924/07802 , H01L2924/14 , H01L2924/15788 , H01L2924/181 , H05K2203/0113 , H05K2203/0338 , H01L2924/00
摘要： A solder mold includes a substrate and a plurality of cavities for holding solder to be transferred to an integrated circuit. The plurality of cavities comprises cavities of at least two different volumes.
摘要翻译： 焊模包括基板和多个用于保持待传送到集成电路的焊料的空腔。 多个空腔包括至少两个不同体积的空腔。
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2.发明申请公开(公告)号：US20090004840A1
公开(公告)日：2009-01-01
申请号：US11769389
申请日：2007-06-27
申请人： Matthew J. Farinelli , Steven Cordes , Donna S. Nielsen , Samuel Roy McKnight , Jay S. Chey , Peter A. Gruber , Joanna Rosner
发明人： Matthew J. Farinelli , Steven Cordes , Donna S. Nielsen , Samuel Roy McKnight , Jay S. Chey , Peter A. Gruber , Joanna Rosner
IPC分类号： H01L21/441 , H01B13/00
CPC分类号： H05K3/3457 , H01L24/11 , H01L24/13 , H01L2224/11003 , H01L2224/1308 , H01L2224/13147 , H01L2224/13171 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/014 , H01L2924/07802 , H01L2924/14 , H01L2924/15788 , H01L2924/181 , H05K2203/0113 , H05K2203/0338 , H01L2924/00
摘要： A method for fabricating a solder transfer mold includes masking a substrate with a masking agent. A pattern is transferred to the substrate mask. The masked substrate is etched until cavities of a first volume are formed. The cavities of the first volume are selectively coated. The masked substrate is etched until cavities of a second volume are formed.
摘要翻译： 一种制造焊料转移模具的方法包括用掩蔽剂掩蔽衬底。 将图案转移到基板掩模。 蚀刻掩蔽的基板直到形成第一体积的空腔。 选择性地涂覆第一体积的空腔。 蚀刻掩蔽的基板直到形成第二体积的空腔。
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公开(公告)号：US07452212B2
公开(公告)日：2008-11-18
申请号：US11718279
申请日：2005-09-30
申请人： Gareth Geoffrey Hougham , Ali Afzali , Steven Allen Cordes , Paul W. Coteus , Matthew J. Farinelli , Sherif A. Goma , Alphonso P. Lanzetta , Daniel Peter Morris , Joanna Rosner , Nisha Yohannan
发明人： Gareth Geoffrey Hougham , Ali Afzali , Steven Allen Cordes , Paul W. Coteus , Matthew J. Farinelli , Sherif A. Goma , Alphonso P. Lanzetta , Daniel Peter Morris , Joanna Rosner , Nisha Yohannan
IPC分类号： H01R9/00
CPC分类号： H01R9/00 , B33Y80/00 , G01R1/06738 , G01R1/07314 , G01R3/00 , H01R13/2414 , H05K7/1061 , Y10T29/49002
摘要： Techniques for forming enhanced electrical connections are provided. In one aspect, an electrical connecting device comprises an electrically insulating carrier having one or more contact structures traversing a plane thereof. Each contact structure comprises an elastomeric material having an electrically conductive layer running along at least one surface thereof continuously through the plane of the carrier.
摘要翻译： 提供了用于形成增强的电连接的技术。 一方面，电连接装置包括具有穿过其平面的一个或多个接触结构的电绝缘载体。 每个接触结构包括具有连续穿过载体平面的至少一个表面延伸的导电层的弹性体材料。
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公开(公告)号：US20090300914A1
公开(公告)日：2009-12-10
申请号：US12533766
申请日：2009-07-31
申请人： Gareth Geoffrey Hougham , Ali Afzali , Steven Allen Cordes , Paul W. Coteus , Matthew J. Farinelli , Sherif A. Goma , Alphonso P. Lanzetta , Daniel Peter Morris , Joanna Rosner , Nisha Yohannan
发明人： Gareth Geoffrey Hougham , Ali Afzali , Steven Allen Cordes , Paul W. Coteus , Matthew J. Farinelli , Sherif A. Goma , Alphonso P. Lanzetta , Daniel Peter Morris , Joanna Rosner , Nisha Yohannan
IPC分类号： H01R43/16
CPC分类号： H01R13/2414 , G01R1/07378 , H05K3/326 , H05K3/4007 , H05K3/4038 , H05K7/1061
摘要： Techniques for forming enhanced electrical connections are provided. In one aspect, a method of forming an electrical connecting device includes the steps of: depositing an elastomeric material on an electrically insulating carrier; and metallizing the elastomeric material so as to form an electrically conductive layer running continuously through a plane of the carrier and along a surface of the elastomeric material.
摘要翻译： 提供了用于形成增强的电连接的技术。 一方面，一种形成电连接装置的方法包括以下步骤：将弹性体材料沉积在电绝缘载体上; 以及对弹性体材料进行金属化，以便形成连续穿过载体的平面并且沿弹性体材料的表面延伸的导电层。
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公开(公告)号：US20090053908A1
公开(公告)日：2009-02-26
申请号：US12127418
申请日：2008-05-27
申请人： Gareth Geoffrey Hougham , Ali Afzali , Steven Allen Cordes , Paul W. Coteus , Matthew J. Farinelli , Sherif A. Goma , Alphonso P. Lanzetta , Daniel Peter Morris , Joanna Rosner , Nisha Yohannan
发明人： Gareth Geoffrey Hougham , Ali Afzali , Steven Allen Cordes , Paul W. Coteus , Matthew J. Farinelli , Sherif A. Goma , Alphonso P. Lanzetta , Daniel Peter Morris , Joanna Rosner , Nisha Yohannan
IPC分类号： H01R12/00
CPC分类号： H01R9/09 , G01R1/07378 , H01R13/2414 , H05K3/326 , H05K3/4007 , H05K3/4038 , H05K7/1061 , Y10S439/931
摘要： Techniques for forming enhanced electrical connections are provided. In one aspect, an electrical connecting device comprises an electrically insulating carrier having one or more contact structures traversing a plane thereof. Each contact structure comprises an elastomeric material having an electrically conductive layer running along at least one surface thereof continuously through the plane of the carrier.
摘要翻译： 提供了用于形成增强的电连接的技术。 一方面，电连接装置包括具有穿过其平面的一个或多个接触结构的电绝缘载体。 每个接触结构包括具有连续穿过载体平面的至少一个表面延伸的导电层的弹性体材料。
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公开(公告)号：US07771208B2
公开(公告)日：2010-08-10
申请号：US12127418
申请日：2008-05-27
申请人： Gareth Geoffrey Hougham , Ali Afzali , Steven Allen Cordes , Paul W. Coteus , Matthew J. Farinelli , Sherif A. Goma , Alphonso P. Lanzetta , Daniel Peter Morris , Joanna Rosner , Nisha Yohannan
发明人： Gareth Geoffrey Hougham , Ali Afzali , Steven Allen Cordes , Paul W. Coteus , Matthew J. Farinelli , Sherif A. Goma , Alphonso P. Lanzetta , Daniel Peter Morris , Joanna Rosner , Nisha Yohannan
IPC分类号： H01R9/09
CPC分类号： H01R9/09 , G01R1/07378 , H01R13/2414 , H05K3/326 , H05K3/4007 , H05K3/4038 , H05K7/1061 , Y10S439/931
摘要： Techniques for forming enhanced electrical connections are provided. In one aspect, an electrical connecting device comprises an electrically insulating carrier having one or more contact structures traversing a plane thereof. Each contact structure comprises an elastomeric material having an electrically conductive layer running along at least one surface thereof continuously through the plane of the carrier.
摘要翻译： 提供了用于形成增强的电连接的技术。 一方面，电连接装置包括具有穿过其平面的一个或多个接触结构的电绝缘载体。 每个接触结构包括具有连续穿过载体平面的至少一个表面延伸的导电层的弹性体材料。
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公开(公告)号：US08832936B2
公开(公告)日：2014-09-16
申请号：US12533766
申请日：2009-07-31
申请人： Gareth Geoffrey Hougham , Ali Afzali , Steven Allen Cordes , Paul W. Coteus , Matthew J. Farinelli , Sherif A. Goma , Alphonso P. Lanzetta , Daniel Peter Morris , Joanna Rosner , Nisha Yohannan
发明人： Gareth Geoffrey Hougham , Ali Afzali , Steven Allen Cordes , Paul W. Coteus , Matthew J. Farinelli , Sherif A. Goma , Alphonso P. Lanzetta , Daniel Peter Morris , Joanna Rosner , Nisha Yohannan
IPC分类号： H01R43/00
CPC分类号： H01R13/2414 , G01R1/07378 , H05K3/326 , H05K3/4007 , H05K3/4038 , H05K7/1061
摘要： Techniques for forming enhanced electrical connections are provided. In one aspect, a method of forming an electrical connecting device includes the steps of: depositing an elastomeric material on an electrically insulating carrier; and metallizing the elastomeric material so as to form an electrically conductive layer running continuously through a plane of the carrier and along a surface of the elastomeric material.
摘要翻译： 提供了用于形成增强的电连接的技术。 一方面，一种形成电连接装置的方法包括以下步骤：将弹性体材料沉积在电绝缘载体上; 以及对弹性体材料进行金属化，以便形成连续穿过载体的平面并且沿弹性体材料的表面延伸的导电层。
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公开(公告)号：US08054095B2
公开(公告)日：2011-11-08
申请号：US11718283
申请日：2005-09-30
申请人： Gareth Geoffrey Hougham , Ali Afzali , Steven Allen Cordes , Paul W. Coteus , Matthew J. Farinelli , Sherif A. Goma , Alphonso P. Lanzetta , Daniel Peter Morris , Joanna Rosner , Nisha Yohannan
发明人： Gareth Geoffrey Hougham , Ali Afzali , Steven Allen Cordes , Paul W. Coteus , Matthew J. Farinelli , Sherif A. Goma , Alphonso P. Lanzetta , Daniel Peter Morris , Joanna Rosner , Nisha Yohannan
CPC分类号： H01R9/00 , B33Y80/00 , G01R1/06738 , G01R1/07314 , G01R3/00 , H01R13/2414 , H05K7/1061 , Y10T29/49002
摘要： A probe structure for an electronic device is provided. In one aspect, the probe structure includes an electrically insulating carrier having one or more contact structures traversing a plane thereof. Each contact structure includes an elastomeric material having an electrically conductive layer running along at least one surface thereof continuously through the plane of the carrier. The probe structure includes one or more other contact structures adapted for connection to a test apparatus.
摘要翻译： 提供了一种用于电子设备的探针结构。 一方面，探针结构包括具有穿过其平面的一个或多个接触结构的电绝缘载体。 每个接触结构包括具有连续穿过载体平面的至少一个表面延伸的导电层的弹性体材料。 探针结构包括适于连接到测试装置的一个或多个其它接触结构。
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公开(公告)号：US20080094085A1
公开(公告)日：2008-04-24
申请号：US11718283
申请日：2005-09-30
申请人： Gareth Hougham , Ali Afzali , Steven Cordes , Paul Coteus , Matthew Farinelli , Sherif Goma , Alphonso Lanzetta , Daniel Morris , Joanna Rosner , Nisha Yohannan
发明人： Gareth Hougham , Ali Afzali , Steven Cordes , Paul Coteus , Matthew Farinelli , Sherif Goma , Alphonso Lanzetta , Daniel Morris , Joanna Rosner , Nisha Yohannan
CPC分类号： H01R9/00 , B33Y80/00 , G01R1/06738 , G01R1/07314 , G01R3/00 , H01R13/2414 , H05K7/1061 , Y10T29/49002
摘要： A probe structure for an electronic device is provided. In one aspect, the probe structure includes an electrically insulating carrier having one or more contact structures traversing a plane thereof. Each contact structure includes an elastomeric material having an electrically conductive layer running along at least one surface thereof continuously through the plane of the carrier. The probe structure includes one or more other contact structures adapted for connection to a test apparatus.
摘要翻译： 提供了一种用于电子设备的探针结构。 一方面，探针结构包括具有穿过其平面的一个或多个接触结构的电绝缘载体。 每个接触结构包括具有连续穿过载体平面的至少一个表面延伸的导电层的弹性体材料。 探针结构包括适于连接到测试装置的一个或多个其它接触结构。
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公开(公告)号：US20070298626A1
公开(公告)日：2007-12-27
申请号：US11718279
申请日：2005-09-30
申请人： Gareth Hougham , Ali Afzali , Steven Cordes , Paul Coteus , Matthew Farinelli , Sherif Goma , Alphonso Lanzetta , Daniel Morris , Joanna Rosner , Nisha Yohannan
发明人： Gareth Hougham , Ali Afzali , Steven Cordes , Paul Coteus , Matthew Farinelli , Sherif Goma , Alphonso Lanzetta , Daniel Morris , Joanna Rosner , Nisha Yohannan
IPC分类号： H01R13/24
CPC分类号： H01R9/00 , B33Y80/00 , G01R1/06738 , G01R1/07314 , G01R3/00 , H01R13/2414 , H05K7/1061 , Y10T29/49002
摘要： Techniques for forming enhanced electrical connections are provided. In one aspect, an electrical connecting device comprises an electrically insulating carrier having one or more contact structures traversing a plane thereof. Each contact structure comprises an elastomeric material having an electrically conductive layer running along at least one surface thereof continuously through the plane of the carrier.
摘要翻译： 提供了用于形成增强的电连接的技术。 一方面，电连接装置包括具有穿过其平面的一个或多个接触结构的电绝缘载体。 每个接触结构包括具有连续穿过载体平面的至少一个表面延伸的导电层的弹性体材料。
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