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公开(公告)号：US20080094085A1
公开(公告)日：2008-04-24
申请号：US11718283
申请日：2005-09-30
申请人： Gareth Hougham , Ali Afzali , Steven Cordes , Paul Coteus , Matthew Farinelli , Sherif Goma , Alphonso Lanzetta , Daniel Morris , Joanna Rosner , Nisha Yohannan
发明人： Gareth Hougham , Ali Afzali , Steven Cordes , Paul Coteus , Matthew Farinelli , Sherif Goma , Alphonso Lanzetta , Daniel Morris , Joanna Rosner , Nisha Yohannan
CPC分类号： H01R9/00 , B33Y80/00 , G01R1/06738 , G01R1/07314 , G01R3/00 , H01R13/2414 , H05K7/1061 , Y10T29/49002
摘要： A probe structure for an electronic device is provided. In one aspect, the probe structure includes an electrically insulating carrier having one or more contact structures traversing a plane thereof. Each contact structure includes an elastomeric material having an electrically conductive layer running along at least one surface thereof continuously through the plane of the carrier. The probe structure includes one or more other contact structures adapted for connection to a test apparatus.
摘要翻译： 提供了一种用于电子设备的探针结构。 一方面，探针结构包括具有穿过其平面的一个或多个接触结构的电绝缘载体。 每个接触结构包括具有连续穿过载体平面的至少一个表面延伸的导电层的弹性体材料。 探针结构包括适于连接到测试装置的一个或多个其它接触结构。
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公开(公告)号：US20070298626A1
公开(公告)日：2007-12-27
申请号：US11718279
申请日：2005-09-30
申请人： Gareth Hougham , Ali Afzali , Steven Cordes , Paul Coteus , Matthew Farinelli , Sherif Goma , Alphonso Lanzetta , Daniel Morris , Joanna Rosner , Nisha Yohannan
发明人： Gareth Hougham , Ali Afzali , Steven Cordes , Paul Coteus , Matthew Farinelli , Sherif Goma , Alphonso Lanzetta , Daniel Morris , Joanna Rosner , Nisha Yohannan
IPC分类号： H01R13/24
CPC分类号： H01R9/00 , B33Y80/00 , G01R1/06738 , G01R1/07314 , G01R3/00 , H01R13/2414 , H05K7/1061 , Y10T29/49002
摘要： Techniques for forming enhanced electrical connections are provided. In one aspect, an electrical connecting device comprises an electrically insulating carrier having one or more contact structures traversing a plane thereof. Each contact structure comprises an elastomeric material having an electrically conductive layer running along at least one surface thereof continuously through the plane of the carrier.
摘要翻译： 提供了用于形成增强的电连接的技术。 一方面，电连接装置包括具有穿过其平面的一个或多个接触结构的电绝缘载体。 每个接触结构包括具有连续穿过载体平面的至少一个表面延伸的导电层的弹性体材料。
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公开(公告)号：US20070087588A1
公开(公告)日：2007-04-19
申请号：US11561273
申请日：2006-11-17
申请人： Gareth Hougham , Keith Fogel , Joanna Rosner , Paul Lauro , Sherif Goma , Joseph Zinter
发明人： Gareth Hougham , Keith Fogel , Joanna Rosner , Paul Lauro , Sherif Goma , Joseph Zinter
IPC分类号： H01R12/00
CPC分类号： H05K7/1069 , H01L23/49827 , H01L2924/0002 , H01L2924/09701 , H01R12/52 , H05K3/326 , H05K3/4092 , H05K3/42 , H05K2201/10378 , H05K2203/308 , Y10T29/49147 , Y10T29/49151 , Y10T29/49155 , Y10T29/49156 , Y10T29/49204 , Y10T29/49222 , H01L2924/00
摘要： An interposer having one or more hollow electrical contact buttons disposed in a carrier. The interposer is formed by disposing sacrificial posts in vias of the carrier. The electrical contact buttons are formed on the sacrificial posts by a metallizing process in desired pattern using a mask. The sacrificial posts are made of a material that thermally decomposes upon application of heat without altering the carrier or the electrical contact buttons.
摘要翻译： 具有设置在载体中的一个或多个中空电触点按钮的插入器。 中间层通过在载体的通孔中设置牺牲柱而形成。 通过使用掩模的期望图案的金属化处理在牺牲柱上形成电接触按钮。 牺牲柱由在施加热量时热分解而不改变载体或电触点按钮的材料制成。
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公开(公告)号：US20060009050A1
公开(公告)日：2006-01-12
申请号：US11220324
申请日：2005-09-06
申请人： Gareth Hougham , Keith Fogel , Joanna Rosner , Paul Lauro , Sherif Goma , Joseph Zinter
发明人： Gareth Hougham , Keith Fogel , Joanna Rosner , Paul Lauro , Sherif Goma , Joseph Zinter
IPC分类号： H01R12/00
CPC分类号： H05K7/1069 , H01L23/49827 , H01L2924/0002 , H01L2924/09701 , H01R12/52 , H05K3/326 , H05K3/4092 , H05K3/42 , H05K2201/10378 , H05K2203/308 , Y10T29/49147 , Y10T29/49151 , Y10T29/49155 , Y10T29/49156 , Y10T29/49204 , Y10T29/49222 , H01L2924/00
摘要： An interposer having one or more hollow electrical contact buttons disposed in a carrier. The interposer is formed by disposing sacrificial posts in vias of the carrier. The electrical contact buttons are formed on the sacrificial posts by a metallizing process in desired pattern using a mask. The sacrificial posts are made of a material that thermally decomposes upon application of heat without altering the carrier or the electrical contact buttons.
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公开(公告)号：US20050106902A1
公开(公告)日：2005-05-19
申请号：US10715288
申请日：2003-11-17
申请人： Gareth Hougham , Keith Fogel , Joanna Rosner , Paul Lauro , Sherif Goma , Joseph Zinter
发明人： Gareth Hougham , Keith Fogel , Joanna Rosner , Paul Lauro , Sherif Goma , Joseph Zinter
CPC分类号： H05K7/1069 , H01L23/49827 , H01L2924/0002 , H01L2924/09701 , H01R12/52 , H05K3/326 , H05K3/4092 , H05K3/42 , H05K2201/10378 , H05K2203/308 , Y10T29/49147 , Y10T29/49151 , Y10T29/49155 , Y10T29/49156 , Y10T29/49204 , Y10T29/49222 , H01L2924/00
摘要： An interposer having one or more hollow electrical contact buttons disposed in a carrier. The interposer is formed by disposing sacrificial posts in vias of the carrier. The electrical contact buttons are formed on the sacrificial posts by a metallizing process in desired pattern using a mask. The sacrificial posts are made of a material that thermally decomposes upon application of heat without altering the carrier or the electrical contact buttons.
摘要翻译： 具有设置在载体中的一个或多个中空电触点按钮的插入器。 中间层通过在载体的通孔中设置牺牲柱而形成。 通过使用掩模的期望图案的金属化处理在牺牲柱上形成电接触按钮。 牺牲柱由在施加热量时热分解而不改变载体或电触点按钮的材料制成。
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公开(公告)号：US20060105607A1
公开(公告)日：2006-05-18
申请号：US10988220
申请日：2004-11-12
申请人： Gareth Hougham , Russell Budd , Punit Chiniwalla , Paul Coteus , Alphonso Lanzetta , Frank Libsch
发明人： Gareth Hougham , Russell Budd , Punit Chiniwalla , Paul Coteus , Alphonso Lanzetta , Frank Libsch
IPC分类号： H01R13/62
CPC分类号： G02B6/43
摘要： Integrated optoelectronic chips or collections of chips on a module that have both electrical as well as optical interconnects offer many advantages in speed, power consumption and heat generation. Mixed signal types, however, pose significant packaging challenges. This invention describes a land grid array (LGA) interposer which can simultaneously connect electrical and optical signals from a module to a printed circuit board.
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7.发明申请Silicon chip carrier with conductive through-vias and method for fabricating same 有权具有导电通孔的硅芯片载体及其制造方法公开(公告)号：US20050121768A1
公开(公告)日：2005-06-09
申请号：US10729254
申请日：2003-12-05
申请人： Daniel Edelstein , Paul Andry , Leena Buchwalter , Jon Casey , Sherif Goma , Raymond Horton , Gareth Hougham , Michael Lane , Xiao Liu , Chirag Patel , Edmund Sprogis , Michelle Steen , Brian Sundlof , Cornelia Tsang , George Walker
发明人： Daniel Edelstein , Paul Andry , Leena Buchwalter , Jon Casey , Sherif Goma , Raymond Horton , Gareth Hougham , Michael Lane , Xiao Liu , Chirag Patel , Edmund Sprogis , Michelle Steen , Brian Sundlof , Cornelia Tsang , George Walker
IPC分类号： H01L21/48 , H01L21/768 , H01L23/498 , H01L23/48 , H01L21/4763
CPC分类号： H01L23/49883 , H01L21/486 , H01L21/76898 , H01L23/49827 , H01L2224/16 , H01L2924/01004 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/09701 , H01L2924/10253 , H01L2924/15311 , H01L2924/3011 , H01L2924/3025 , H01L2924/00
摘要： A carrier structure and method for fabricating a carrier structure with through-vias each having a conductive structure with an effective coefficient of thermal expansion which is less than or closely matched to that of the substrate, and having an effective elastic modulus value which is less than or closely matches that of the substrate. The conductive structure may include concentric via fill areas having differing materials disposed concentrically therein, a core of the substrate material surrounded by an annular ring of conductive material, a core of CTE-matched non-conductive material surrounded by an annular ring of conductive material, a conductive via having an inner void with low CTE, or a full fill of a conductive composite material such as a metal-ceramic paste which has been sintered or fused.
摘要翻译： 一种载体结构和方法，用于制造具有通孔的载流子结构，每个导通孔具有导电结构，其有效热膨胀系数小于或接近于基板的热膨胀系数，并且具有小于或等于 或者与衬底的密切匹配。 导电结构可以包括同心的通孔填充区域，其具有同心设置的不同材料，由导电材料的环形环包围的衬底材料的芯，由导电材料的环形环包围的CTE匹配的非导电材料的芯， 具有低CTE的内部空隙的导电通孔，或已经烧结或熔合的诸如金属 - 陶瓷浆料的导电复合材料的完整填充物。
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8.发明申请Silicon chip carrier with conductive through-vias and method for fabricating same 审中-公开具有导电通孔的硅芯片载体及其制造方法公开(公告)号：US20060027934A1
公开(公告)日：2006-02-09
申请号：US11242221
申请日：2005-10-03
申请人： Daniel Edelstein , Paul Andry , Leena Buchwalter , Jon Casey , Sherif Goma , Raymond Horton , Gareth Hougham , Michael Lane , Xiao Liu , Chirag Patel , Edmund Sprogis , Michelle Steen , Brian Sundlof , Cornelia Tsang , George Walker , Yu-Ting Cheng , Kenneth Ocheltree , Robert Montoye
发明人： Daniel Edelstein , Paul Andry , Leena Buchwalter , Jon Casey , Sherif Goma , Raymond Horton , Gareth Hougham , Michael Lane , Xiao Liu , Chirag Patel , Edmund Sprogis , Michelle Steen , Brian Sundlof , Cornelia Tsang , George Walker , Yu-Ting Cheng , Kenneth Ocheltree , Robert Montoye
IPC分类号： H01L23/48
CPC分类号： H01L23/49883 , H01L21/486 , H01L21/76898 , H01L23/49827 , H01L2224/16 , H01L2924/01004 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/09701 , H01L2924/10253 , H01L2924/15311 , H01L2924/3011 , H01L2924/3025 , H01L2924/00
摘要： A carrier structure and method for fabricating a carrier structure with through-vias each having a conductive structure with an effective coefficient of thermal expansion which is less than or closely matched to that of the substrate, and having an effective elastic modulus value which is less than or closely matches that of the substrate. The conductive structure may include concentric via fill areas having differing materials disposed concentrically therein, a core of the substrate material surrounded by an annular ring of conductive material, a core of CTE-matched non-conductive material surrounded by an annular ring of conductive material, a conductive via having an inner void with low CTE, or a full fill of a conductive composite material such as a metal-ceramic paste which has been sintered or fused.
摘要翻译： 一种载体结构和方法，用于制造具有通孔的载流子结构，每个导通孔具有导电结构，其有效热膨胀系数小于或接近于基板的热膨胀系数，并且具有小于或等于 或者与衬底的密切匹配。 导电结构可以包括同心的通孔填充区域，其具有同心设置的不同材料，由导电材料的环形环包围的衬底材料的芯，由导电材料的环形环包围的CTE匹配的非导电材料的芯， 具有低CTE的内部空隙的导电通孔，或已经烧结或熔合的诸如金属 - 陶瓷浆料的导电复合材料的完整填充物。
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公开(公告)号：US20080020601A1
公开(公告)日：2008-01-24
申请号：US11865458
申请日：2007-10-01
申请人： Gareth Hougham , Brian Beaman , Evan Colgan , Paul Coteus , Stefano Oggioni , Enrique Vargas
发明人： Gareth Hougham , Brian Beaman , Evan Colgan , Paul Coteus , Stefano Oggioni , Enrique Vargas
IPC分类号： H01R12/00
CPC分类号： H01R12/714 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H05K3/326 , H05K3/4007 , H05K7/1061 , H05K2201/0133 , H05K2201/0367 , H05K2201/09481 , H05K2201/09745 , H05K2201/10378 , H05K2201/10734 , Y10T29/49002 , Y10T29/49121 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49147 , Y10T29/49149 , Y10T29/49151 , Y10T29/49155 , Y10T29/49158 , Y10T29/49165 , Y10T29/49204 , Y10T29/49208 , Y10T29/49213 , Y10T29/49218 , Y10T29/49222 , H01L2924/00
摘要： A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.
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公开(公告)号：US20080020600A1
公开(公告)日：2008-01-24
申请号：US11865293
申请日：2007-10-01
申请人： Gareth Hougham , Brian Beaman , Evan Colgan , Paul Coteus , Stefano Oggioni , Enrique Vargas
发明人： Gareth Hougham , Brian Beaman , Evan Colgan , Paul Coteus , Stefano Oggioni , Enrique Vargas
IPC分类号： H01R12/14
CPC分类号： H01R12/714 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H05K3/326 , H05K3/4007 , H05K7/1061 , H05K2201/0133 , H05K2201/0367 , H05K2201/09481 , H05K2201/09745 , H05K2201/10378 , H05K2201/10734 , Y10T29/49002 , Y10T29/49121 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49147 , Y10T29/49149 , Y10T29/49151 , Y10T29/49155 , Y10T29/49158 , Y10T29/49165 , Y10T29/49204 , Y10T29/49208 , Y10T29/49213 , Y10T29/49218 , Y10T29/49222 , H01L2924/00
摘要： A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.
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