摘要:
A method for shorting, unshorting, and reshorting an electronic component such as an MR sensor provides a repeatable ESD protection scheme. A conductive line of an electrically conductive first shorting material is created between electrical leads operatively coupled to an electronic component for creating a short therebetween. The short is severed using a laser. The short is recreated by applying a second shorting material, which may or may not be the same as the first shorting material.
摘要:
A device according to one embodiment includes an electronic component such as an MR sensor, a pair of leads operatively coupled to the electronic component, and shorting material between the leads, the shorting material having been applied by a laser deposition process, the shorting material having been severed. A magnetic storage system according to another embodiment includes magnetic media; and at least one head for reading from and writing to the magnetic media, each head having: a sensor; and a writer coupled to the sensor. The system also includes a pair of pads or leads operatively coupled to the head; shorting material between the leads, the shorting material having been applied by a laser deposition process, the shorting material having been severed; a slider for supporting the head; and a control unit coupled to the head for controlling operation of the head.
摘要:
In devices for solder-ball bonding of a bonding pad of a slider of a head gimbal assembly to a lead pad of a lead, although a device that can perform (1) the supply of solder balls, (2) the positioning of a solder ball, (3) the blowing of nitrogen gas N2, and (4) the melting of the solder ball by laser radiation in one device is available, there are various problems that cannot improve the efficiency of laser radiation, maintenance, or operation efficiency, due to spatial restriction, difficulty of weight reduction, or fixed operation procedures. A solder-ball holder and an optical device are configured separately, and a vacuum pad is provided. A solder ball held in a solder-ball holding hole of the solder-ball holder is transported by the vacuum pad to a connecting portion of a head gimbal assembly, and solder reflow is carried out by the optical device.
摘要:
A method for forming a head gimbal assembly in which the head gimbal assembly and a frame are formed from a continuous piece of laminated material comprised of a first layer, a second layer and a third layer. A plurality of electrical lines are formed in the third layer of the head gimbal assembly and a plurality of electrical line extensions are formed in the third layer of the frame. The slider is positioned at an angle to the frame and a plurality of termination pads on the slider are bonded to the electrical lines. The frame is partially separated from the head gimbal assembly and the relative position of the slider to the head gimbal assembly is changed by an amount sufficient to separate the plurality of electrical lines from the plurality of electrical line extensions.
摘要:
A method for assembling a slider suspension assembly for use in a disk drive is disclosed. A ceramic slider with an attached recording head is placed on a suspension and is held in alignment by soldering the electrical connections while the epoxy placed between the slider and the suspension hardens. The method results in a much more economical process which does not require the number of expensive tools needed to carry out the conventional process.
摘要:
A suspension system comprises a multiple letter flexure, a load beam and an arm. The load beam extends from the tip of the suspension all the way back to the rear of the arm. Datum holes are located in the load beam such that during assembly all reference points are made from the single load beam piece.
摘要:
A method of making a solder connection between a slider pad and a suspension pad is provided by forming a solder bump on the solder pad at the slider level, affixing the slider to the suspension so that solder can be reflowed between the slider pad and the suspension pad and then employing a laser beam to reflow at least the solder bump to form a solder connection between the slider pad and the suspension pad. Various embodiments of the method are employed for forming the solder connection. Geometric features are also optionally incorporated in the suspension pad region of the integrated suspension that can be employed to bias the suspension pads against the solder bumps in the pre-reflow state.
摘要:
Disclosed is an improved slider-suspension electrical interconnect assembly and a method of manufacturing the same. The novel integrated suspension may be assembled from separate pieces, including a load beam, a flexure and a mounting plate. The load beam provides rigid structural support of the flexure. The flexure includes a flexible member and conductive leads integrally formed thereon. The flexible member has a gimbal area to which a slider is attached. At least one transducer is attached to the slider for reading data from and writing data to a disk surface. Each of the conductive leads terminates at one end on contact pads on the end face of the slider for electrical connection to the transducer. At the slider termination end, the conductive leads comprise an altered and an unaltered section. The altered section of the conductor has a lower yield strength than the conductor surrounding the altered section, and has a more uniform grain structure than the unaltered section. The altered, stress relieved section of the conductor is formed by treating the lead at the slider termination end with localized infrared radiation.
摘要:
A disk drive has an improved electrical interconnect assembly for coupling one or more conductive paths leading from a read/write head with the conductive terminals of a flexible cable. The improved interconnect assembly includes an interconnect tab with a plurality of interconnect pads attached thereto. The interconnect tab is connected to a suspension assembly containing a planar suspension member which is located and secured on the actuator arm such that the interconnect tab extends beyond the peripheral edge of the actuator arm. The interconnect tab is inclined toward the side of the actuator arm opposite the side on which the suspension assembly is mounted. The end of the inclined interconnect tab extends to a distance from the planar suspension member approximately equal to half the thickness of the actuator arm. The flexible conductive cable has conductive paths connected to an array of terminals which is oriented at an incline wherein each terminal is aligned with a corresponding interconnect pad. Each flexible cable terminal and corresponding interconnect pad defines an L-shaped joint that is electrically coupled by an electrically conductive fillet, thereby electrically interconnecting the read/write head to the flexible conductive cable. More than one suspension assembly utilizing this improved electrical interconnect assembly can be secured to a single actuator arm and multiple actuator arms can be used in a single disk drive. The interconnect assembly allows the disks to be spaced closer together by better utilization of the vertical space occupied by the actuator arms and disks.
摘要:
Iron based brazing alloys selected from particular alloys of the B-Si-Ni-Fe and B-Si-Ni-Cr-Fe systems are practical substitutes for AMS4777 alloy (3B 4Si 7Cr 3Fe 83Ni).
摘要翻译:选自B-Si-Ni-Fe和B-Si-Ni-Cr-Fe体系的特定合金的铁基钎焊合金是AMS4777合金(3B 4 Si 7Cr 3 Fe 83 Ni)的实际替代物。