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    In-line furnace conveyors with integrated wafer retainers
    4.
    发明授权
    In-line furnace conveyors with integrated wafer retainers 失效
    具有集成晶片保持器的在线炉式输送机

    公开(公告)号：US08449238B2

    公开(公告)日：2013-05-28

    申请号：US11545906

    申请日：2006-10-11

    申请人： William P. Mulligan ,  Thomas Pass

    发明人： William P. Mulligan ,  Thomas Pass

    IPC分类号： B66C17/08

    CPC分类号： H01L21/67739 ,  H01L21/67706 ,  H01L21/6776

    摘要： In one embodiment, an in-line furnace includes a continuous conveyor configured to hold wafers at an angle relative to ground. The conveyor may have fixedly integrated wafer retainers configured to hold the wafers in slots. The conveyor may be formed by several segments that are joined together. Each of the segments may include a base and a set of wafer retainers formed thereon. The conveyor may be driven to move the wafers through a chamber of the furnace, where the wafers are thermally processed.

    摘要翻译： 在一个实施例中，在线炉包括连续输送机，其构造成以相对于地面成一定角度保持晶片。 输送机可以具有固定集成的晶片保持器，其被配置为将晶片保持在槽中。 输送机可以由几个连接在一起的部分形成。 每个段可以包括形成在其上的基座和一组晶片保持器。 可以驱动输送机以将晶片移动通过炉的腔室，其中晶片被热处理。

    Method of manufacturing solar cell
    5.
    发明授权
    Method of manufacturing solar cell 有权
    制造太阳能电池的方法

    公开(公告)号：US07883343B1

    公开(公告)日：2011-02-08

    申请号：US11692657

    申请日：2007-03-28

    申请人： William P. Mulligan ,  Michael J. Cudzinovic ,  Thomas Pass ,  David Smith ,  Neil Kaminar ,  Keith McIntosh ,  Richard M. Swanson

    发明人： William P. Mulligan ,  Michael J. Cudzinovic ,  Thomas Pass ,  David Smith ,  Neil Kaminar ,  Keith McIntosh ,  Richard M. Swanson

    IPC分类号： H01L21/00

    CPC分类号： H01L31/022441 ,  H01L31/0682 ,  H01L31/1804 ,  Y02E10/547 ,  Y02P70/521

    摘要： A solar cell that is readily manufactured using processing techniques which are less expensive than microelectronic circuit processing. In preferred embodiments, printing techniques are utilized in selectively forming masks for use in etching of silicon oxide and diffusing dopants and in forming metal contacts to diffused regions. In a preferred embodiment, p-doped regions and n-doped regions are alternately formed in a surface of the wafer through use of masking and etching techniques. Metal contacts are made to the p-regions and n-regions by first forming a seed layer stack that comprises a first layer such as aluminum that contacts silicon and functions as an infrared reflector, second layer such titanium tungsten that acts as diffusion barrier, and a third layer functions as a plating base. A thick conductive layer such as copper is then plated over the seed layer, and the seed layer between plated lines is removed. A front surface of the wafer is preferably textured by etching or mechanical abrasion with an IR reflection layer provided over the textured surface. A field layer can be provided in the textured surface with the combined effect being a very low surface recombination velocity.

    摘要翻译： 使用比微电子电路处理便宜的处理技术容易地制造的太阳能电池。 在优选实施例中，打印技术用于选择性地形成用于蚀刻氧化硅和扩散掺杂剂以及形成向扩散区域的金属接触的掩模。 在优选实施例中，通过使用掩模和蚀刻技术，在晶片的表面中交替地形成p掺杂区域和n掺杂区域。 通过首先形成包含与硅接触的第一层（例如铝）并用作红外反射器的第二层，作为扩散阻挡的第二层这样的钛钨，首先形成种子层堆叠，从而对p区和n区进行金属接触，以及 第三层起镀层的作用。 然后将诸如铜的厚导电层电镀在种子层上，并且移除电镀线之间的种子层。 晶片的前表面优选通过蚀刻或机械磨蚀而被纹理化，其中IR反射层设置在纹理表面上。 可以在纹理化表面中提供场层，其组合效果是非常低的表面复合速度。

    Substrate carrier for electroplating solar cells
    7.
    发明申请
    Substrate carrier for electroplating solar cells 有权
    电镀太阳能电池基板载体

    公开(公告)号：US20050061665A1

    公开(公告)日：2005-03-24

    申请号：US10912348

    申请日：2004-08-04

    申请人： Luca Pavani ,  Neil Kaminar ,  Pongsthorn Uralwong ,  Thomas Phu ,  Douglas Rose ,  Thomas Pass

    发明人： Luca Pavani ,  Neil Kaminar ,  Pongsthorn Uralwong ,  Thomas Phu ,  Douglas Rose ,  Thomas Pass

    IPC分类号： C25D17/06 ,  C25D17/08 ,  H01L20060101 ,  H01L21/288

    CPC分类号： C25D17/08 ,  H01L21/2885 ,  Y10S269/90

    摘要： A carrier for use in processing of a plurality of wafers or other substrates includes a support frame on which the wafers are mounted and in one embodiment at least one auxiliary frame for holding the substrates on the support frame. A plurality of clips extend from the auxiliary frame and engage the substrates in pressure engagement, and fasteners retain the auxiliary frame in position with respect to the support frame. In one embodiment two auxiliary frames can be employed for holding wafers on opposing surfaces of the support frame. The support frame has electrically non-conducting surfaces whereby the processing does not affect the support frame, and the auxiliary frame is made of electrically non- conductive material. The clips are electrically conductive and bridge current from the support frame to the wafers during plating operations. In another embodiment, auxiliary frame are not used and the wafer retention clips are mounted on the support frame. In use, the carrier can support a high number of units for processing with no significant mechanical stress being transferred to the wafers during loading and unloading from the carrier. The carriers and wafers can be transferred easily for different chemical baths and can be handled safely during rinsing and drying steps.

    摘要翻译： 用于处理多个晶片或其它基板的载体包括其上安装晶片的支撑框架，并且在一个实施例中，至少一个用于将基板保持在支撑框架上的辅助框架。 多个夹子从辅助框架延伸并且以压力接合方式接合基板，并且紧固件将辅助框架相对于支撑框架保持在适当的位置。 在一个实施例中，可以使用两个辅助框架来将晶片保持在支撑框架的相对表面上。 支撑框架具有非导电表面，由此处理不影响支撑框架，辅助框架由非导电材料制成。 在电镀操作期间，夹子是导电的并且桥接电流从支撑框架到晶片。 在另一个实施例中，不使用辅助框架，并且将晶片固定夹安装在支撑框架上。 在使用中，载体可以支撑大量用于加工的单元，在从载体装载和卸载期间，没有明显的机械应力转移到晶片。 载体和晶片可以容易地转移到不同的化学浴中，并且可以在漂洗和干燥步骤期间安全地处理。