公开(公告)号：US20090285261A1

公开(公告)日：2009-11-19

申请号：US12122682

申请日：2008-05-17

申请人： Michael J. Casey ,  Ivor G. Barber ,  Gregory S. Winn ,  Julie L. Beatty ,  Daniel G. Deisz

发明人： Michael J. Casey ,  Ivor G. Barber ,  Gregory S. Winn ,  Julie L. Beatty ,  Daniel G. Deisz

IPC分类号： G01K7/16 ,  G01K1/00 ,  G01K7/00

CPC分类号： G01K1/026 ,  G01K7/015

摘要： A temperature monitoring circuit for an integrated circuit on a monolithic chip, the temperature monitoring circuit comprising a temperature sensor disposed on the monolithic chip, a system monitor disposed on the monolithic chip, and electrically conductive traces for electrically connecting the temperature sensor to the system monitor. In this manner, the temperature on the monolithic chip can be monitored by the integrated circuit itself, and appropriate action can be programmed to occur upon attaining various set points or conditions.

摘要翻译： 一种用于单片芯片上的集成电路的温度监控电路，所述温度监视电路包括设置在所述单片芯片上的温度传感器，设置在所述单片芯片上的系统监视器和用于将所述温度传感器电连接到所述系统监视器的导电迹线 。 以这种方式，单片芯片上的温度可以由集成电路本身监控，并且可以在获得各种设定点或条件时对适当的动作进行编程。

公开(公告)号：US5801072A

公开(公告)日：1998-09-01

申请号：US615388

申请日：1996-03-14

申请人： Ivor G. Barber

发明人： Ivor G. Barber

IPC分类号： H01L21/56 ,  H01L23/057 ,  H01L23/31 ,  H01L23/538 ,  H01L21/44

CPC分类号： H01L23/057 ,  H01L21/563 ,  H01L23/3121 ,  H01L23/5384 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/19041

摘要： A method of assembling flip chips in a package. Solder bumps are attached to a first flip chip and to a second flip chip. A package substrate having first and second opposing sides is provided, and the first flip chip is electrically connected to the first side of the package substrate using the solder bumps attached to the first flip chip. The second flip chip is also electrically connected to the second side of the package substrate using the solder bumps attached to the second flip chip. The position of the second flip chip is substantially opposed to and aligned with the position of the first flip chip. The first and second flip chips are under filled with a heat conductive epoxy. The first flip chip is encapsulated against the first side of the package substrate, and the second flip chip is encapsulated against the second side of the package substrate. Solder balls are attached to the first side of the package insert. By attaching the flip chips to opposite sides of the package substrate, balancing the structure of the overall package, bending stress is reduced due to the flip chips having similar thermal coefficients of expansion. Additional benefits include improved electrical performance, reduced weight, and reduced size of the packaged circuit.

摘要翻译： 一种在封装中组装倒装芯片的方法。 焊接凸块连接到第一倒装芯片和第二倒装芯片。 提供具有第一和第二相对侧的封装衬底，并且使用附接到第一倒装芯片的焊料凸块将第一倒装芯片电连接到封装衬底的第一侧。 第二倒装芯片也使用附接到第二倒装芯片的焊料凸块电连接到封装衬底的第二侧。 第二倒装芯片的位置基本上与第一倒装芯片的位置相对并对齐。 第一和第二倒装芯片正在填充导热环氧树脂。 第一倒装芯片被封装在封装衬底的第一侧上，并且第二倒装芯片被封装在封装衬底的第二侧上。 焊球附接到包装插入件的第一侧。 通过将倒装芯片附接到封装基板的相对侧，平衡整个封装的结构，由于具有相似热膨胀系数的倒装芯片，弯曲应力降低。 额外的优点包括改进的电气性能，减轻重量和减小封装电路的尺寸。

公开(公告)号：US06943446B2

公开(公告)日：2005-09-13

申请号：US10290953

申请日：2002-11-08

申请人： John P. McCormick ,  Ivor G. Barber ,  Kumar Nagarajan

发明人： John P. McCormick ,  Ivor G. Barber ,  Kumar Nagarajan

IPC分类号： H01L21/768 ,  H01L23/00 ,  H01L23/522 ,  H01L23/532 ,  H01L23/58 ,  H01L23/34 ,  H01L23/48 ,  H01L23/52

CPC分类号： H01L23/585 ,  H01L21/76877 ,  H01L23/5226 ,  H01L23/5329 ,  H01L23/562 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/01019 ,  H01L2224/05647 ,  H01L2924/00014

摘要： An integrated circuit having electrically conductive vias with a diameter of between about one micron and about fifty microns. Prior art vias have a diameter of between no less than 0.3 microns to no more than 0.8 microns. In this manner, stresses such as those that press down upon the top surface of the integrated circuit can be absorbed by the large vias and transferred past fragile layers, such as low k layers, so that the fragile layers are not damaged by the stresses.

摘要翻译： 一种集成电路，其具有直径在约1微米至约50微米之间的导电通孔。 现有技术的通孔具有不小于0.3微米至不超过0.8微米的直径。 以这种方式，诸如压在集成电路的顶表面上的那些应力可以被大的通孔吸收并传递过去的脆弱层，例如低k层，使得易碎层不被应力损坏。

公开(公告)号：US06673708B1

公开(公告)日：2004-01-06

申请号：US10397065

申请日：2003-03-25

申请人： Ivor G. Barber ,  Zafer S. Kutlu

发明人： Ivor G. Barber ,  Zafer S. Kutlu

IPC分类号： H01L2144

CPC分类号： H01L21/563 ,  H01L23/3121 ,  H01L23/36 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/0102 ,  H01L2924/00

摘要： An integrated circuit structure and a method for packaging an integrated circuit are described. The integrated structure includes an integrated circuit that is inverted and solder bump mounted to a substrate. An underfill is used to encapsulate the solder bumps and form a rigid support layer between the integrated circuit and the substrate. A heatspreader, which has larger planar dimensions than the integrated circuit, is centrally attached to an upper surface of the integrated circuit with a thermally conductive material. Lateral portions of the heatspreader extending beyond the edges of the integrated circuit are attached to the substrate and sides of the integrated circuit by a thermally conductive underfill material. The thermally conductive underfill material thus employed, among other things, provides a robust mechanical support to the heatspreader and integrated circuit structure and eliminates the need for additional support structures such as conventional stiffener rings.

摘要翻译： 描述了集成电路结构和用于封装集成电路的方法。 集成结构包括集成电路，其被倒置并焊接凸块安装到基板。 使用底部填充剂来封装焊料凸块并在集成电路和衬底之间形成刚性支撑层。 具有比集成电路更大的平面尺寸的散热器通过导热材料集中附接到集成电路的上表面。 延伸超过集成电路边缘的散热器的横向部分通过导热的底部填充材料附接到集成电路的基板和侧面。 因此采用的导热底层填充材料尤其对散热器和集成电路结构提供了坚固的机械支撑，并且消除了对诸如常规加强环之类的附加支撑结构的需要。

公开(公告)号：US06590292B1

公开(公告)日：2003-07-08

申请号：US09872327

申请日：2001-06-01

申请人： Ivor G. Barber ,  Zafer S. Kutlu

发明人： Ivor G. Barber ,  Zafer S. Kutlu

IPC分类号： H01L2348

CPC分类号： H01L21/563 ,  H01L23/3121 ,  H01L23/36 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/0102 ,  H01L2924/00

摘要： An integrated circuit structure and a method for packaging an integrated circuit are described. The integrated structure includes an integrated circuit that is inverted and solder bump mounted to a substrate. An underfill is used to encapsulate the solder bumps and form a rigid support layer between the integrated circuit and the substrate. A heatspreader, which has larger planar dimensions than the integrated circuit, is centrally attached to an upper surface of the integrated circuit with a thermally conductive material. Lateral portions of the heatspreader extending beyond the edges of the integrated circuit are attached to the substrate and sides of the integrated circuit by a thermally conductive underfill material. The thermally conductive underfill material thus employed, among other things, provides a robust mechanical support to the heatspreader and integrated circuit structure and eliminates the need for additional support structures such as conventional stiffener rings.

摘要翻译： 描述了集成电路结构和用于封装集成电路的方法。 集成结构包括集成电路，其被倒置并焊接凸块安装到基板。 使用底部填充剂来封装焊料凸块并在集成电路和衬底之间形成刚性支撑层。 具有比集成电路更大的平面尺寸的散热器通过导热材料集中附接到集成电路的上表面。 延伸超过集成电路边缘的散热器的横向部分通过导热的底部填充材料附接到集成电路的基板和侧面。 因此采用的导热底层填充材料尤其对散热器和集成电路结构提供了坚固的机械支撑，并且消除了对诸如常规加强环之类的附加支撑结构的需要。

公开(公告)号：US5723369A

公开(公告)日：1998-03-03

申请号：US615865

申请日：1996-03-14

申请人： Ivor G. Barber

发明人： Ivor G. Barber

IPC分类号： H01L21/60 ,  H01L23/31 ,  H01L23/498 ,  H01L21/44 ,  H01L21/48

CPC分类号： H01L24/81 ,  H01L23/3121 ,  H01L23/49816 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/181

摘要： To assemble a flip chip in a package, the back of the flip chip is coated with a heat conductive material and a heat conductive substrate is attached to the heat conductive material. Solder bumps are attached to the front of the flip chip and to a package substrate to mount the flip chip on the package, leaving a space between the flip chip and the package substrate. The space between the flip chip and the package substrate is under filled with a heat conductive media, and the flip chip is encapsulated against the package substrate with a peripheral mold such that at least a portion of the conductive substrate remains exposed. A final package is formed by electrical connectors attached to the package substrate.

摘要翻译： 为了在封装中组装倒装芯片，倒装芯片的背面涂覆有导热材料，导热基板附着在导热材料上。 焊接凸块附接到倒装芯片的前部和封装衬底，以将倒装芯片安装在封装上，在倒装芯片和封装衬底之间留下空间。 倒装芯片和封装衬底之间的空间充满了导热介质，并且倒装芯片利用外围模具封装在封装衬底上，使得至少一部分导电衬底保持暴露。 最终包装由附接到封装衬底的电连接器形成。

公开(公告)号：US5700723A

公开(公告)日：1997-12-23

申请号：US648350

申请日：1996-05-15

申请人： Ivor G. Barber

发明人： Ivor G. Barber

IPC分类号： H01L21/56 ,  H01L23/31 ,  H01L21/60

CPC分类号： H01L23/3121 ,  H01L21/565 ,  H01L2224/16

摘要： A method of packaging an integrated circuit. The integrated circuit is connected to a substrate, and a mold is applied to the substrate. The mold and the substrate define a cavity and at least one covered chase, and the integrated circuit is disposed within the cavity. A compound is injected into the cavity through one of the covered chases, underfilling and encapsulating the integrated circuit. In one embodiment the mold is then removed from the substrate. In an alternate embodiment the mold is fixedly applied to the substrate.

摘要翻译： 一种封装集成电路的方法。 集成电路连接到基板，并且将模具施加到基板。 模具和衬底限定空腔和至少一个覆盖的追逐，并且集成电路设置在腔内。 化合物通过其中一个被覆盖的追踪器注入空腔，底部填充和封装集成电路。 在一个实施例中，然后将模具从基底上移除。 在替代实施例中，模具固定地施加到基底上。