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188 条记录 (耗时 0.038 秒)

    Foil heat sink and a method for fabricating same
    1.
    发明授权
    Foil heat sink and a method for fabricating same 失效
    箔散热器及其制造方法

    公开(公告)号：US06684501B2

    公开(公告)日：2004-02-03

    申请号：US10105698

    申请日：2002-03-25

    申请人： Michael J. Ellsworth, Jr. ,  Egidio Marotta ,  Budy D. Notohardjono ,  Roger R. Schmidt ,  Prabjit Singh

    发明人： Michael J. Ellsworth, Jr. ,  Egidio Marotta ,  Budy D. Notohardjono ,  Roger R. Schmidt ,  Prabjit Singh

    IPC分类号： H05K720

    CPC分类号： F28F21/02 ,  F28F3/02 ,  H01L23/3672 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

    摘要： A design and method for fabricating a foil heat sink including a fin body, wherein the fin body includes a plurality of heat sink fins having a fin head and a fin foot and wherein the plurality of heat sink fins are disposed in a parallel fashion so as to form a plurality of horizontal channels between the plurality of heat sink fins, a fin support, wherein the fin support includes a plurality of fin support structures disposed between the plurality of heat sink fins so as to separate the plurality of heat sink fins and wherein the plurality of fin support structures are disposed adjacent to the fin head so as to form a plurality of vertical channels between the plurality of heat sink fins, and a fin base, wherein the fin base includes a plurality of fin spacers disposed between the plurality of heat sink fins so as to separate the plurality of heat sink fins and wherein the plurality of fin spacers are disposed so as to be adjacent to the fin foot.

    摘要翻译： 一种用于制造包括翅片体的箔散热器的设计和方法，其中所述鳍体包括多个散热鳍片，散热鳍片具有翅片头和鳍脚，并且其中所述多个散热鳍片以平行方式设置， 以在所述多个散热鳍片之间形成多个水平通道，翅片支撑件，其中所述翅片支撑件包括设置在所述多个散热鳍片之间的多个翅片支撑结构，以分离所述多个散热鳍片，并且其中 所述多个翅片支撑结构设置成与所述翅片头相邻，以便在所述多个散热鳍片之间形成多个垂直通道，以及翅片基座，其中所述翅片基座包括多个翅片间隔件， 散热翅片以分离多个散热鳍片，并且其中所述多个翅片间隔件设置成与鳍脚相邻。

    Self-aligning wafer burn-in probe
    3.
    发明授权
    Self-aligning wafer burn-in probe 失效
    自对准晶圆老化探头

    公开(公告)号：US06788085B2

    公开(公告)日：2004-09-07

    申请号：US09902964

    申请日：2001-07-11

    申请人： Budy D. Notohardjono ,  Roger R. Schmidt

    发明人： Budy D. Notohardjono ,  Roger R. Schmidt

    IPC分类号： G01R3102

    CPC分类号： G01R1/06761 ,  G01R1/07357

    摘要： The material and geometric properties of an electrical probe contact are combined to produce an electrical contact which is capable of self-alignment over many thousands of uses. The probe contact moves substantially only in a vertical direction and provides a consistent contact force with corresponding electrical contact pads on a semiconductor wafer. The probe contacts are configured in an array of a large plurality of individual contacts which extend from a base to which they are attached through apertures in an overlying mask spaced apart from the base.

    摘要翻译： 电探针接触件的材料和几何特性被组合以产生能够在数千种用途上进行自对准的电触点。 探针接触基本上仅在垂直方向上移动并且提供与半导体晶片上的对应电接触焊盘一致的接触力。 探针触点构造成大量多个单独触头的阵列，该多个单独的触点从与底座间隔开的上覆掩模中的孔穿过的底座延伸穿过。

    System and method of use for a refrigerant quick-connect coupling
    4.
    发明授权
    System and method of use for a refrigerant quick-connect coupling 失效
    用于制冷剂快速连接联轴器的系统和方法

    公开(公告)号：US06499717B1

    公开(公告)日：2002-12-31

    申请号：US09722961

    申请日：2000-11-27

    申请人： Donald W. Porter ,  Mark A. Marnell ,  Steven J. Mazzuca ,  Budy D. Notohardjono ,  Roger R. Schmidt

    发明人： Donald W. Porter ,  Mark A. Marnell ,  Steven J. Mazzuca ,  Budy D. Notohardjono ,  Roger R. Schmidt

    IPC分类号： F25B4500

    CPC分类号： F16L37/08 ,  F16L29/00 ,  F16L2201/40 ,  F25B41/003 ,  Y10T137/87273

    摘要： A method of use and apparatus for a quick connect coupling in a fluid system as disclosed herein. The quick connect coupling includes a female coupling assembly and a male coupling assembly. The female coupling assembly includes a female cone housing nestable with a female cone. At least one female flow hole is formed in each of the female cone housing and female cone. The male coupling assembly has a male cone housing nestable with a male cone. At least one male flow hole is formed in each of the male cone housing, and the male cone. The at least one female flow hole rotatably misaligns to seal in a manner that fluid is contained from leaking past the female coupling assembly. The at least one male flow hole rotatably misaligns to seal in a manner that fluid is contained from leaking past the male coupling assembly. The male coupling assembly is removably rotatably insertable into the female cone. The female coupling assembly and the male coupling assembly rotatably fluidly couple to create a fluid flow path through the quick connect coupling. The female coupling assembly and the male coupling assembly rotatably fluidly uncouple, thereby sealing the fluid flow path through the quick connect coupling. The male coupling assembly and the female coupling assembly are removably uncoupleable.

    摘要翻译： 本文公开的流体系统中的快速连接联接的使用方法和装置。 快速连接联接器包括阴联接组件和阳联接组件。 阴联接组件包括可与母锥体嵌套的阴锥体壳体。 在每个阴锥体壳体和阴锥体中形成至少一个凹形流动孔。 阳联接组件具有可与阳锥嵌套的阳锥体壳体。 在每个阳锥体壳体和阳锥体中形成至少一个阳性流动孔。 所述至少一个阴式流动孔可旋转地不对准以密封，以使流体容纳在经过阴联接组件的情况下泄漏。 所述至少一个阳性流动孔可旋转地不对准以使流体容纳在阳联接组件之外的泄漏的方式密封。 阳联接组件可拆卸地可旋转地插入到阴锥体中。 阴联接组件和阳联接组件可旋转地流体耦合以产生通过快速连接联接件的流体流动路径。 阴联接组件和阳联接组件可旋转地流体分离，从而通过快速连接联接器密封流体流动路径。 阳联接组件和阴联接组件可移除地不可分离。

    Compliant heat sink device/mounting system interconnect and a method of implementing same
    5.
    发明授权
    Compliant heat sink device/mounting system interconnect and a method of implementing same 有权
    兼容的散热设备/安装系统互连及其实现方法

    公开(公告)号：US06639803B1

    公开(公告)日：2003-10-28

    申请号：US10193534

    申请日：2002-07-11

    申请人： Joseph P. Corrado ,  Budy D. Notohardjono ,  Roger R. Schmidt

    发明人： Joseph P. Corrado ,  Budy D. Notohardjono ,  Roger R. Schmidt

    IPC分类号： H05K720

    CPC分类号： H01L23/4006 ,  H01L23/3672 ,  H01L2023/4062 ,  H01L2023/4087 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat sink device interconnect including a mounting device, having a mounting device top, a board stiffener, wherein the board stiffener is disposed so as to be communicated with the mounting device and a heat sink device compressingly disposed between the mounting device top and the board stiffener, wherein the heat sink device includes a top plate, a bottom plate and a heat sink fin compressingly disposed between the top plate and the bottom plate. A method for implementing a heat sink device interconnect including obtaining an electronic module, a printed circuit board and a heat sink device interconnect having a heat sink device, an interconnect device, a mounting device and a board stiffener, arranging the electronic module, the printed circuit board and the heat sink device interconnect such that the electronic module and the printed circuit board is disposed between the board stiffener and the heat sink device and adjusting the mounting device so as to cause the electronic module to become compressingly associated with the printed circuit board.

    摘要翻译： 一种散热装置互连件，包括具有安装装置顶部的安装装置，板加强件，其中所述板加强件设置成与所述安装装置连通，以及压缩地设置在所述安装装置顶部和所述板之间的散热装置 加强件，其中所述散热装置包括压板地设置在所述顶板和所述底板之间的顶板，底板和散热片。 一种用于实现散热装置互连的方法，包括获得电子模块，印刷电路板和具有散热装置的互连装置，互连装置，安装装置和板加强件，布置电子模块，印刷 电路板和散热装置互连，使得电子模块和印刷电路板设置在板加强件和散热装置之间并调节安装装置，以使电子模块与印刷电路板压缩相关联 。

    COOLING APPARATUS AND COOLED ELECTRONIC MODULE WITH A THERMALLY CONDUCTIVE RETURN MANIFOLD STRUCTURE SEALED TO THE PERIPHERY OF A SURFACE TO BE COOLED
    8.
    发明申请
    COOLING APPARATUS AND COOLED ELECTRONIC MODULE WITH A THERMALLY CONDUCTIVE RETURN MANIFOLD STRUCTURE SEALED TO THE PERIPHERY OF A SURFACE TO BE COOLED 审中-公开
    冷却装置和冷却电子模块，具有密封的冷却回路管状结构，密封到要冷却的表面的外围

    公开(公告)号：US20080278913A1

    公开(公告)日：2008-11-13

    申请号：US12178033

    申请日：2008-07-23

    申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, JR. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, JR. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    IPC分类号： H05K7/20

    CPC分类号： F28C3/08 ,  F28F7/00 ,  H01L23/4735 ,  H01L2224/73253 ,  Y10S165/908

    摘要： A cooled electronic module and method of fabrication are provided employing a cooling apparatus for removing heat from one or more electronic devices disposed on a substrate. The cooling apparatus includes a supply manifold structure having a plurality of inlet orifices for injecting coolant onto a surface to be cooled, and a return manifold structure. The return manifold structure, which is fabricated of a thermally conductive material, has a base surface sealed to the surface to be cooled along a periphery thereof employing a thermally conductive, coolant-tight seal. The return manifold structure provides at least one return passageway for exhausting coolant after impinging on the surface to be cooled, wherein coolant exhausting through the at least one passageway cools the return manifold structure, thereby facilitating further cooling of the surface to be cooled in a region where the base surface is sealed to the surface to be cooled.

    摘要翻译： 使用冷却装置提供冷却的电子模块和制造方法，用于从设置在基板上的一个或多个电子装置移除热量。 冷却装置包括供给歧管结构，其具有用于将冷却剂喷射到待冷却的表面上的多个入口孔和回流歧管结构。 由导热材料制成的回流歧管结构具有使用导热的冷却剂密封密封在其周围的待冷却表面的基面。 返回歧管结构提供至少一个返回通道，用于在撞击待冷却表面之后排出冷却剂，其中通过至少一个通道的冷却剂排出冷却回流歧管结构，从而有助于进一步冷却待冷却表面 其中基面被密封到待冷却的表面。

    Hybrid cooling system for a multi-component electronics system
    9.
    发明授权
    Hybrid cooling system for a multi-component electronics system 有权
    用于多组件电子系统的混合冷却系统

    公开(公告)号：US07405936B1

    公开(公告)日：2008-07-29

    申请号：US12055455

    申请日：2008-03-26

    申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    IPC分类号： H05K7/20 ,  F28F7/00

    CPC分类号： H05K7/20736 ,  F28F1/20 ,  F28F1/22 ,  H05K7/20009 ,  H05K7/20554 ,  H05K7/20772

    摘要： A hybrid cooling system and method of fabrication are provided for a multi-component electronics system. The cooling system includes an air moving device for establishing air flow across at least one primary and at least one secondary heat generating component to be cooled; and a liquid-based cooling subsystem including at least one cold plate, physically coupled to the at least one primary heat generating component, and a thermally conductive coolant-carrying tube in fluid communication with the at least one cold plate. A thermally conductive auxiliary structure is coupled to the coolant-carrying tube and includes a plurality of thermally conductive fins extending from a surface thereof. The plurality of thermally conductive fins are disposed at least partially over the at least one secondary heat generating component to be cooled, and provide supplemental cooling of at least a portion of the air flow established across the multiple components of the electronics system.

    摘要翻译： 为多组件电子系统提供混合冷却系统和制造方法。 该冷却系统包括用于建立穿过要被冷却的至少一个主要和至少一个次要发热部件的空气流的空气移动装置; 以及液体冷却子系统，其包括物理耦合到所述至少一个主发热部件的至少一个冷板和与所述至少一个冷板流体连通的导热冷却剂供给管。 导热辅助结构联接到冷却剂承载管并且包括从其表面延伸的多个导热翅片。 多个导热翅片至少部分地设置在待冷却的至少一个二次发热组件上，并且为跨越电子系统的多个部件建立的空气流的至少一部分提供补充冷却。

    Cooling apparatus for an electronics subsystem employing a coolant flow drive apparatus between coolant flow paths
    10.
    发明授权
    Cooling apparatus for an electronics subsystem employing a coolant flow drive apparatus between coolant flow paths 有权
    在冷却剂流动路径之间使用冷却剂流动驱动装置的电子系统的冷却装置

    公开(公告)号：US07274566B2

    公开(公告)日：2007-09-25

    申请号：US11008732

    申请日：2004-12-09

    申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    IPC分类号： H05K7/20 ,  F04B17/00

    CPC分类号： H05K7/2079

    摘要： A coolant flow drive apparatus is provided for facilitating removal of heat from a cooling structure coupled to a heat generating electronics component. The coolant flow drive apparatus includes a turbine in fluid communication with a primary coolant flowing within a primary coolant flow loop, and a pump in fluid communication with a secondary coolant within a secondary coolant flow path. The secondary fluid flow path is separate from the primary coolant flow path. The flow drive apparatus further includes a magnetic coupling between the turbine and the pump, wherein the turbine drives the pump through the magnetic coupling to pump secondary coolant through the secondary coolant flow path.

    摘要翻译： 提供冷却剂流动驱动装置，用于便于从耦合到发热电子部件的冷却结构移除热量。 冷却剂流动驱动装置包括与在主冷却剂流动回路内流动的主要冷却剂流体连通的涡轮机，以及与次级冷却剂流动路径内的二级冷却剂流体连通的泵。 次级流体流动路径与主冷却剂流动路径分离。 流动驱动装置还包括在涡轮机和泵之间的磁耦合，其中涡轮机通过磁耦合驱动泵以将二级冷却剂泵送通过次级冷却剂流动路径。