公开(公告)号：US06684501B2

公开(公告)日：2004-02-03

申请号：US10105698

申请日：2002-03-25

申请人： Michael J. Ellsworth, Jr. ,  Egidio Marotta ,  Budy D. Notohardjono ,  Roger R. Schmidt ,  Prabjit Singh

发明人： Michael J. Ellsworth, Jr. ,  Egidio Marotta ,  Budy D. Notohardjono ,  Roger R. Schmidt ,  Prabjit Singh

IPC分类号： H05K720

CPC分类号： F28F21/02 ,  F28F3/02 ,  H01L23/3672 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

摘要： A design and method for fabricating a foil heat sink including a fin body, wherein the fin body includes a plurality of heat sink fins having a fin head and a fin foot and wherein the plurality of heat sink fins are disposed in a parallel fashion so as to form a plurality of horizontal channels between the plurality of heat sink fins, a fin support, wherein the fin support includes a plurality of fin support structures disposed between the plurality of heat sink fins so as to separate the plurality of heat sink fins and wherein the plurality of fin support structures are disposed adjacent to the fin head so as to form a plurality of vertical channels between the plurality of heat sink fins, and a fin base, wherein the fin base includes a plurality of fin spacers disposed between the plurality of heat sink fins so as to separate the plurality of heat sink fins and wherein the plurality of fin spacers are disposed so as to be adjacent to the fin foot.

摘要翻译： 一种用于制造包括翅片体的箔散热器的设计和方法，其中所述鳍体包括多个散热鳍片，散热鳍片具有翅片头和鳍脚，并且其中所述多个散热鳍片以平行方式设置， 以在所述多个散热鳍片之间形成多个水平通道，翅片支撑件，其中所述翅片支撑件包括设置在所述多个散热鳍片之间的多个翅片支撑结构，以分离所述多个散热鳍片，并且其中 所述多个翅片支撑结构设置成与所述翅片头相邻，以便在所述多个散热鳍片之间形成多个垂直通道，以及翅片基座，其中所述翅片基座包括多个翅片间隔件， 散热翅片以分离多个散热鳍片，并且其中所述多个翅片间隔件设置成与鳍脚相邻。

公开(公告)号：US06788085B2

公开(公告)日：2004-09-07

申请号：US09902964

申请日：2001-07-11

申请人： Budy D. Notohardjono ,  Roger R. Schmidt

发明人： Budy D. Notohardjono ,  Roger R. Schmidt

IPC分类号： G01R3102

CPC分类号： G01R1/06761 ,  G01R1/07357

摘要： The material and geometric properties of an electrical probe contact are combined to produce an electrical contact which is capable of self-alignment over many thousands of uses. The probe contact moves substantially only in a vertical direction and provides a consistent contact force with corresponding electrical contact pads on a semiconductor wafer. The probe contacts are configured in an array of a large plurality of individual contacts which extend from a base to which they are attached through apertures in an overlying mask spaced apart from the base.

摘要翻译： 电探针接触件的材料和几何特性被组合以产生能够在数千种用途上进行自对准的电触点。 探针接触基本上仅在垂直方向上移动并且提供与半导体晶片上的对应电接触焊盘一致的接触力。 探针触点构造成大量多个单独触头的阵列，该多个单独的触点从与底座间隔开的上覆掩模中的孔穿过的底座延伸穿过。

公开(公告)号：US06499717B1

公开(公告)日：2002-12-31

申请号：US09722961

申请日：2000-11-27

申请人： Donald W. Porter ,  Mark A. Marnell ,  Steven J. Mazzuca ,  Budy D. Notohardjono ,  Roger R. Schmidt

发明人： Donald W. Porter ,  Mark A. Marnell ,  Steven J. Mazzuca ,  Budy D. Notohardjono ,  Roger R. Schmidt

IPC分类号： F25B4500

CPC分类号： F16L37/08 ,  F16L29/00 ,  F16L2201/40 ,  F25B41/003 ,  Y10T137/87273

摘要： A method of use and apparatus for a quick connect coupling in a fluid system as disclosed herein. The quick connect coupling includes a female coupling assembly and a male coupling assembly. The female coupling assembly includes a female cone housing nestable with a female cone. At least one female flow hole is formed in each of the female cone housing and female cone. The male coupling assembly has a male cone housing nestable with a male cone. At least one male flow hole is formed in each of the male cone housing, and the male cone. The at least one female flow hole rotatably misaligns to seal in a manner that fluid is contained from leaking past the female coupling assembly. The at least one male flow hole rotatably misaligns to seal in a manner that fluid is contained from leaking past the male coupling assembly. The male coupling assembly is removably rotatably insertable into the female cone. The female coupling assembly and the male coupling assembly rotatably fluidly couple to create a fluid flow path through the quick connect coupling. The female coupling assembly and the male coupling assembly rotatably fluidly uncouple, thereby sealing the fluid flow path through the quick connect coupling. The male coupling assembly and the female coupling assembly are removably uncoupleable.

摘要翻译： 本文公开的流体系统中的快速连接联接的使用方法和装置。 快速连接联接器包括阴联接组件和阳联接组件。 阴联接组件包括可与母锥体嵌套的阴锥体壳体。 在每个阴锥体壳体和阴锥体中形成至少一个凹形流动孔。 阳联接组件具有可与阳锥嵌套的阳锥体壳体。 在每个阳锥体壳体和阳锥体中形成至少一个阳性流动孔。 所述至少一个阴式流动孔可旋转地不对准以密封，以使流体容纳在经过阴联接组件的情况下泄漏。 所述至少一个阳性流动孔可旋转地不对准以使流体容纳在阳联接组件之外的泄漏的方式密封。 阳联接组件可拆卸地可旋转地插入到阴锥体中。 阴联接组件和阳联接组件可旋转地流体耦合以产生通过快速连接联接件的流体流动路径。 阴联接组件和阳联接组件可旋转地流体分离，从而通过快速连接联接器密封流体流动路径。 阳联接组件和阴联接组件可移除地不可分离。

公开(公告)号：US06639803B1

公开(公告)日：2003-10-28

申请号：US10193534

申请日：2002-07-11

申请人： Joseph P. Corrado ,  Budy D. Notohardjono ,  Roger R. Schmidt

发明人： Joseph P. Corrado ,  Budy D. Notohardjono ,  Roger R. Schmidt

IPC分类号： H05K720

CPC分类号： H01L23/4006 ,  H01L23/3672 ,  H01L2023/4062 ,  H01L2023/4087 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink device interconnect including a mounting device, having a mounting device top, a board stiffener, wherein the board stiffener is disposed so as to be communicated with the mounting device and a heat sink device compressingly disposed between the mounting device top and the board stiffener, wherein the heat sink device includes a top plate, a bottom plate and a heat sink fin compressingly disposed between the top plate and the bottom plate. A method for implementing a heat sink device interconnect including obtaining an electronic module, a printed circuit board and a heat sink device interconnect having a heat sink device, an interconnect device, a mounting device and a board stiffener, arranging the electronic module, the printed circuit board and the heat sink device interconnect such that the electronic module and the printed circuit board is disposed between the board stiffener and the heat sink device and adjusting the mounting device so as to cause the electronic module to become compressingly associated with the printed circuit board.

摘要翻译： 一种散热装置互连件，包括具有安装装置顶部的安装装置，板加强件，其中所述板加强件设置成与所述安装装置连通，以及压缩地设置在所述安装装置顶部和所述板之间的散热装置 加强件，其中所述散热装置包括压板地设置在所述顶板和所述底板之间的顶板，底板和散热片。 一种用于实现散热装置互连的方法，包括获得电子模块，印刷电路板和具有散热装置的互连装置，互连装置，安装装置和板加强件，布置电子模块，印刷 电路板和散热装置互连，使得电子模块和印刷电路板设置在板加强件和散热装置之间并调节安装装置，以使电子模块与印刷电路板压缩相关联 。

公开(公告)号：US09043035B2

公开(公告)日：2015-05-26

申请号：US13305967

申请日：2011-11-29

申请人： Timothy J. Chainer ,  Milnes P. David ,  Madhusudan K. Iyengar ,  Pritish R. Parida ,  Roger R. Schmidt ,  Mark D. Schultz

发明人： Timothy J. Chainer ,  Milnes P. David ,  Madhusudan K. Iyengar ,  Pritish R. Parida ,  Roger R. Schmidt ,  Mark D. Schultz

IPC分类号： G06F19/00 ,  G05D7/06 ,  G06F1/20 ,  G11B33/14 ,  H05K7/20 ,  G06F1/32

CPC分类号： G05D7/0635 ,  G06F1/20 ,  G06F1/206 ,  G06F1/3206 ,  G11B33/144 ,  H05K7/20281 ,  H05K7/20781 ,  H05K7/2079 ,  H05K7/20836 ,  Y02D10/16

摘要： Cooling apparatuses and methods are provided which include one or more coolant-cooled structures associated with an electronics rack, a coolant loop coupled in fluid communication with one or more passages of the coolant-cooled structure(s), one or more heat exchange units coupled to facilitate heat transfer from coolant within the coolant loop, and N controllable components associated with the coolant loop or the heat exchange unit(s), wherein N≧1. The N controllable components facilitate circulation of coolant through the coolant loop or transfer of heat from the coolant via the heat exchange unit(s). A controller is coupled to the N controllable components, and dynamically adjusts operation of the N controllable components, based on Z input parameters and one or more specified constraints, to provide a specified cooling to the coolant-cooled structure(s), while limiting energy consumed by the N controllable components, wherein Z≧1.

摘要翻译： 提供了冷却装置和方法，其包括与电子机架相关联的一个或多个冷却剂冷却结构，与冷却剂冷却结构的一个或多个通道流体连通的冷却剂回路，一个或多个热交换单元 以促进从冷却剂回路内的冷却剂的热传递，以及与冷却剂回路或热交换单元相关联的N个可控部件，其中N≥1。 N个可控部件促使冷却剂循环通过冷却剂回路或通过热交换单元从冷却剂传递热量。 控制器耦合到N个可控组件，并且基于Z输入参数和一个或多个指定的约束来动态调整N个可控组件的操作，以向冷却剂冷却的结构提供特定的冷却，同时限制能量 由N个可控部件消耗，其中Z≥1。

公开(公告)号：US08913384B2

公开(公告)日：2014-12-16

申请号：US13527947

申请日：2012-06-20

申请人： Milnes P. David ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Bejoy J. Kochuparambil ,  Pritish R. Parida ,  Roger R. Schmidt ,  Mark E. Steinke

发明人： Milnes P. David ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Bejoy J. Kochuparambil ,  Pritish R. Parida ,  Roger R. Schmidt ,  Mark E. Steinke

IPC分类号： H05K7/20 ,  H05K13/00

CPC分类号： H05K7/20745 ,  H05K7/2079 ,  H05K13/00

摘要： Cooling apparatuses and coolant-cooled electronic systems are provided which include thermal transfer structures configured to engage with a spring force one or more electronics cards with docking of the electronics card(s) within a respective socket(s) of the electronic system. A thermal transfer structure of the cooling apparatus includes a thermal spreader having a first thermal conduction surface, and a thermally conductive spring assembly coupled to the conduction surface of the thermal spreader and positioned and configured to reside between and physically couple a first surface of an electronics card to the first surface of the thermal spreader with docking of the electronics card within a socket of the electronic system. The thermal transfer structure is, in one embodiment, metallurgically bonded to a coolant-cooled structure and facilitates transfer of heat from the electronics card to coolant flowing through the coolant-cooled structure.

摘要翻译： 提供冷却装置和冷却剂冷却的电子系统，其包括热传递结构，其被配置成与弹簧力接合一个或多个电子卡，其中电子卡在电子系统的相应插座内对接。 冷却装置的热传递结构包括具有第一热传导表面的散热器和耦合到散热器的导电表面的导热弹簧组件，并被定位和配置成驻留在物理上耦合电子器件的第一表面 卡到散热器的第一表面，使电子卡在电子系统的插座内对接。 在一个实施例中，热传递结构是冶金结合到冷却剂冷却结构，并且有助于将热量从电子卡传递到流过冷却剂冷却结构的冷却剂。

公开(公告)号：US08880225B2

公开(公告)日：2014-11-04

申请号：US13276247

申请日：2011-10-18

申请人： Madhusudan K. Iyengar ,  Roger R. Schmidt

发明人： Madhusudan K. Iyengar ,  Roger R. Schmidt

IPC分类号： G05D23/19 ,  H05K7/20

CPC分类号： H05K7/20836 ,  G05D23/1932

摘要： A method, system, and computer program product for controlling data center cooling. In an example embodiment the method includes calculating, using a processor, an over-provisioning factor, where the over-provisioning factor is a function of a ratio of a rated cooling power to a calculated cooling power of a set of cooling units, the set of cooing units comprising at least one cooling unit. The method proceeds by adjusting the data-center cooling until the over-provisioning factor is substantially equal to a target over-provisioning factor.

摘要翻译： 一种用于控制数据中心冷却的方法，系统和计算机程序产品。 在示例实施例中，该方法包括使用处理器计算过度供应因子，其中过度供应因子是额定冷却功率与一组冷却单元的计算的冷却功率的比率的函数，该组 包括至少一个冷却单元的冷却单元。 该方法通过调整数据中心冷却来进行，直到过度供应因子基本上等于目标过度供应因子。

公开(公告)号：US20140071626A1

公开(公告)日：2014-03-13

申请号：US13613753

申请日：2012-09-13

申请人： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, JR. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, JR. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： F28D15/02 ,  B21D53/02 ,  H05K7/20 ,  F28D7/00

CPC分类号： H05K7/20309 ,  B23P15/26 ,  F28D9/0025 ,  F28D15/02 ,  F28F3/046 ,  F28F3/12 ,  F28F9/02 ,  H05K7/203 ,  H05K7/20809 ,  Y10T29/4935 ,  Y10T29/49359 ,  Y10T29/49396

摘要： A vapor condenser is provided which includes a three-dimensional folded structure which defines, at least in part, a set of coolant-carrying channels and a set of vapor condensing channels, with the coolant-carrying channels being interleaved with and extending parallel to the vapor condensing channels. The folded structure includes a thermally conductive sheet with multiple folds in the sheet. One side of the sheet is a vapor condensing surface, and the opposite side of the sheet is a coolant-cooled surface, with at least a portion of the coolant-cooled surface defining the coolant-carrying channels, and being in contact with coolant within the coolant-carrying channels. The vapor condenser further includes, in one embodiment, a top plate, and first and second end manifolds which are coupled to opposite ends of the folded structure and in fluid communication with the coolant-carrying channels to facilitate flow of coolant through the coolant-carrying channels.

摘要翻译： 提供了一种蒸汽冷凝器，其包括三维折叠结构，其至少部分地限定一组冷却剂传送通道和一组蒸气冷凝通道，其中冷却剂传送通道与 蒸汽冷凝通道。 折叠结构包括在片材中具有多个折叠的导热片。 片材的一侧是蒸汽冷凝表面，并且片材的相对侧是冷却剂冷却的表面，冷却剂冷却表面的至少一部分限定了冷却剂传送通道，并与冷却剂内部的冷却剂接触 冷却液承载通道。 蒸气冷凝器在一个实施例中还包括顶板，以及第一和第二端部歧管，其连接到折叠结构的相对端并与冷却剂承载通道流体连通以便于冷却剂流过冷却剂携带 频道

公开(公告)号：US20130000736A1

公开(公告)日：2013-01-03

申请号：US13172765

申请日：2011-06-29

申请人： Patrick A. Coico ,  David P. Graybill ,  Allan R. Hoeft ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Gerard V. Weber, JR.

发明人： Patrick A. Coico ,  David P. Graybill ,  Allan R. Hoeft ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Gerard V. Weber, JR.

IPC分类号： F17D3/00

CPC分类号： H05K7/20836 ,  F17D3/00 ,  H05K7/20 ,  H05K7/20181 ,  H05K7/20745 ,  Y10T137/0324 ,  Y10T137/6851

摘要： An air flow control assembly, system, and method for controlling air flow to a server rack. An example air flow control assembly includes a retractable barrier configured to block the air flow, at least partially, from passing through a perforated floor tile to the server rack. The air flow control assembly also includes a barrier mount configured to secure the retractable barrier proximate the perforated floor tile.

摘要翻译： 用于控制到服务器机架的空气流的气流控制组件，系统和方法。 示例性空气流量控制组件包括可缩回屏障，所述可伸缩屏障被配置为阻挡空气流，至少部分地阻止穿过穿孔的地板砖到服务器机架。 空气流量控制组件还包括被配置为将可伸缩的屏障固定在穿孔地板砖附近的阻挡安装座。

公开(公告)号：US07979250B2

公开(公告)日：2011-07-12

申请号：US11950747

申请日：2007-12-05

申请人： Matthew R. Archibald ,  Richard C. Chu ,  Hendrik F. Hamann ,  Madhusudan K. Iyengar ,  Roger R. Schmidt

发明人： Matthew R. Archibald ,  Richard C. Chu ,  Hendrik F. Hamann ,  Madhusudan K. Iyengar ,  Roger R. Schmidt

IPC分类号： G06F17/50 ,  G06G7/56 ,  G06G7/50 ,  H02B1/00 ,  G01K13/00 ,  G01K1/08 ,  G01K7/16 ,  G01K11/30 ,  G01K1/16 ,  G01N9/36

CPC分类号： G06F17/509 ,  G06F1/20 ,  G06F17/5004 ,  G06F2217/78 ,  G06F2217/80

摘要： A method is provided for facilitating installation of one or more electronics racks within a data center. The method includes: placing a plurality of thermal simulators in the data center in a data center layout to establish a thermally simulated data center, each thermal simulator simulating at least one of airflow intake or heated airflow exhaust of a respective electronics rack of a plurality of electronics racks to be installed in the data center; monitoring temperature within the thermally simulated data center at multiple locations, and verifying the data center layout if measured temperatures are within respective acceptable temperature ranges for the data center when containing the plurality of electronics racks; and establishing the plurality of electronics racks within the data center using the verified data center layout, the establishing including at least one of reconfiguring or replacing each thermal simulator with a respective electronics rack.

摘要翻译： 提供了一种便于在数据中心内安装一个或多个电子机架的方法。 该方法包括：将多个热模拟器放置在数据中心中的数据中心布局中，以建立热仿真数据中心，每个热模拟器模拟多个模拟数据中心的相应电子机架的气流吸入或加热气流排气中的至少一个 电子机架要安装在数据中心; 监测多个位置的热仿真数据中心内的温度，以及如果测量温度在包含多个电子机架时数据中心的可接受温度范围内，则验证数据中心布局; 以及使用已验证的数据中心布局在所述数据中心内建立所述多个电子机架，所述建立包括用相应的电子机架重新配置或替换每个热模拟器中的至少一个。