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公开(公告)号：US20090184232A1
公开(公告)日：2009-07-23
申请号：US12367937
申请日：2009-02-09
申请人： Michael Kubiak , Oliver Bard , Gerald Kloiber , Gero Zimmermann , Peter Balzer
发明人： Michael Kubiak , Oliver Bard , Gerald Kloiber , Gero Zimmermann , Peter Balzer
CPC分类号： G01J1/04 , B60H1/0075 , G01J1/02 , G01J1/0266 , G01J1/0437 , G01J1/4228 , G01J2001/4266
摘要： The invention pertains to a solar sensor that includes a first modulator that is transparent to electromagnetic waves within a spectrum, and an additional modulator that is at best slightly transparent to the electromagnetic waves within the spectrum. The additional modulator features a belt-shaped region of varying widths that is arranged on the outside of the first modulator and partially covers the first modulator, and a photodetector that receives the electromagnetic waves and is covered by the first modulator.
摘要翻译： 本发明涉及一种太阳能传感器，其包括对光谱内的电磁波透明的第一调制器，以及对该光谱内的电磁波至多稍微透明的附加调制器。 附加调制器具有布置在第一调制器的外部并部分地覆盖第一调制器的不同宽度的带状区域，以及接收电磁波并被第一调制器覆盖的光电检测器。
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公开(公告)号：US20080135726A1
公开(公告)日：2008-06-12
申请号：US10590088
申请日：2005-02-25
申请人： Peter Balzer , Oliver Bard , Gerald Kloiber , Michael Kubiak , Gero Zimmermann
发明人： Peter Balzer , Oliver Bard , Gerald Kloiber , Michael Kubiak , Gero Zimmermann
IPC分类号： G01J1/44
CPC分类号： G01J1/06 , G01J1/0266 , G01J1/04 , G01J1/0407 , G01J2001/0276
摘要： A light sensor for recording the position of a light source includes a photo detector and a light modulator. The light modulator is configured to modulate the quantity of light hitting the photo detector based on an incident angle (α) of the light from the light source on the sensor.
摘要翻译： 用于记录光源位置的光传感器包括光检测器和光调制器。 光调制器被配置为基于来自传感器上的光源的光的入射角（α）来调制击中光电检测器的光量。
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公开(公告)号：US07906751B2
公开(公告)日：2011-03-15
申请号：US12367937
申请日：2009-02-09
申请人： Michael Kubiak , Oliver Bard , Gerald Kloiber , Gero Zimmermann , Peter Balzer
发明人： Michael Kubiak , Oliver Bard , Gerald Kloiber , Gero Zimmermann , Peter Balzer
CPC分类号： G01J1/04 , B60H1/0075 , G01J1/02 , G01J1/0266 , G01J1/0437 , G01J1/4228 , G01J2001/4266
摘要： The invention pertains to a solar sensor that includes a first modulator that is transparent to electromagnetic waves within a spectrum, and an additional modulator that is at best slightly transparent to the electromagnetic waves within the spectrum. The additional modulator features a belt-shaped region of varying widths that is arranged on the outside of the first modulator and partially covers the first modulator, and a photodetector that receives the electromagnetic waves and is covered by the first modulator.
摘要翻译： 本发明涉及一种太阳能传感器，其包括对光谱内的电磁波透明的第一调制器，以及对该光谱内的电磁波至多稍微透明的附加调制器。 附加调制器具有布置在第一调制器的外部并部分地覆盖第一调制器的不同宽度的带状区域，以及接收电磁波并被第一调制器覆盖的光电检测器。
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公开(公告)号：US07642493B2
公开(公告)日：2010-01-05
申请号：US10590088
申请日：2005-02-25
申请人： Peter Balzer , Oliver Bard , Gerald Kloiber , Michael Kubiak , Gero Zimmermann
发明人： Peter Balzer , Oliver Bard , Gerald Kloiber , Michael Kubiak , Gero Zimmermann
CPC分类号： G01J1/06 , G01J1/0266 , G01J1/04 , G01J1/0407 , G01J2001/0276
摘要： A light sensor for recording the position of a light source includes a photo detector and a light modulator. The light modulator is configured to modulate the quantity of light hitting the photo detector based on an incident angle (α) of the light from the light source on the sensor.
摘要翻译： 用于记录光源位置的光传感器包括光检测器和光调制器。 光调制器被配置为基于来自传感器上的光源的光的入射角（α）来调制击中光电检测器的光量。
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公开(公告)号：US09028143B2
公开(公告)日：2015-05-12
申请号：US13267475
申请日：2011-10-06
申请人： Oliver Bard , Wolfgang Grundmann , Michael Kubiak
发明人： Oliver Bard , Wolfgang Grundmann , Michael Kubiak
CPC分类号： G01K1/08 , G01D11/245 , G01K1/14 , G01K1/16
摘要： A sensor arrangement includes at least two sensor components. Each sensor component includes a housing with at least one sensor element. The housings each include at least one connecting device. The at least one connecting device can be used to mechanically connect the at least two sensor components to one another.
摘要翻译： 传感器装置包括至少两个传感器部件。 每个传感器部件包括具有至少一个传感器元件的壳体。 所述壳体各自包括至少一个连接装置。 所述至少一个连接装置可用于将所述至少两个传感器部件彼此机械连接。
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公开(公告)号：US20120051393A1
公开(公告)日：2012-03-01
申请号：US13267475
申请日：2011-10-06
申请人： Oliver Bard , Wolfgang Grundmann , Michael Kubiak
发明人： Oliver Bard , Wolfgang Grundmann , Michael Kubiak
CPC分类号： G01K1/08 , G01D11/245 , G01K1/14 , G01K1/16
摘要： A sensor arrangement includes at least two sensor components, each comprising a housing with at least one sensor element. The housings each include at least one connecting device that can be used to mechanically connect the at least two sensor components to one another.
摘要翻译： 传感器装置包括至少两个传感器部件，每个传感器部件包括具有至少一个传感器元件的壳体。 壳体每个包括至少一个可用于将至少两个传感器部件彼此机械连接的连接装置。
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公开(公告)号：US20130070806A1
公开(公告)日：2013-03-21
申请号：US13635283
申请日：2011-03-22
申请人： Michael Kubiak , Wolfgang Grundmann
发明人： Michael Kubiak , Wolfgang Grundmann
IPC分类号： G01K13/02
CPC分类号： G01K13/02
摘要： A measuring probe has a housing for receiving a sensor element. The measuring probe can be inserted in an opening of a device for carrying a medium. The housing has a curved outer circumference line perpendicular to the insertion direction of the housing in the device.
摘要翻译： 测量探针具有用于接收传感器元件的壳体。 测量探针可以插入用于承载介质的装置的开口中。 壳体具有与装置中壳体的插入方向垂直的弯曲外周线。
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公开(公告)号：US09234807B2
公开(公告)日：2016-01-12
申请号：US13635283
申请日：2011-03-22
申请人： Michael Kubiak , Wolfgang Grundmann
发明人： Michael Kubiak , Wolfgang Grundmann
CPC分类号： G01K13/02
摘要： A measuring probe has a housing for receiving a sensor element. The measuring probe can be inserted in an opening of a device for carrying a medium. The housing has a curved outer circumference line perpendicular to the insertion direction of the housing in the device.
摘要翻译： 测量探针具有用于接收传感器元件的壳体。 测量探针可以插入用于承载介质的装置的开口中。 壳体具有与装置中壳体的插入方向垂直的弯曲外周线。
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9.发明授权公开(公告)号：US09177880B2
公开(公告)日：2015-11-03
申请号：US14127451
申请日：2012-07-26
申请人： Michael Kubiak
发明人： Michael Kubiak
IPC分类号： H01L23/045 , B81B7/00 , H01L29/84
CPC分类号： H01L23/045 , B81B7/007 , B81B2207/092 , B81B2207/096 , B81B2207/097 , H01L29/84 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/15153 , H01L2924/16195 , H01L2924/00014 , H01L2924/00
摘要： A housing for a semiconductor chip has an injection molded body, in which an accommodating area for accommodating the semiconductor chip is provided. The injection-molded body has at least one metallization for making electrical contact with the semiconductor chip.
摘要翻译： 用于半导体芯片的壳体具有注射成型体，其中设置有用于容纳半导体芯片的容纳区域。 注射成型体具有至少一个用于与半导体芯片电接触的金属化。
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10.发明申请公开(公告)号：US20140217523A1
公开(公告)日：2014-08-07
申请号：US14127451
申请日：2012-07-26
申请人： Michael Kubiak
发明人： Michael Kubiak
IPC分类号： H01L23/045 , H01L29/84
CPC分类号： H01L23/045 , B81B7/007 , B81B2207/092 , B81B2207/096 , B81B2207/097 , H01L29/84 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/15153 , H01L2924/16195 , H01L2924/00014 , H01L2924/00
摘要： A housing for a semiconductor chip has an injection molded body, in which an accommodating area for accommodating the semiconductor chip is provided. The injection-molded body has at least one metallization for making electrical contact with the semiconductor chip.
摘要翻译： 用于半导体芯片的壳体具有注射成型体，其中设置有用于容纳半导体芯片的容纳区域。 注射成型体具有至少一个用于与半导体芯片电接触的金属化。
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