公开(公告)号：US20060275951A1

公开(公告)日：2006-12-07

申请号：US11487880

申请日：2006-07-17

申请人： Michael Warner ,  Masud Beroz ,  David Light ,  Delin Li ,  Dennis Castillo ,  Hung-ming Wang ,  John Smith

发明人： Michael Warner ,  Masud Beroz ,  David Light ,  Delin Li ,  Dennis Castillo ,  Hung-ming Wang ,  John Smith

IPC分类号： H01L21/00

CPC分类号： H01L24/10 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L23/5389 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05572 ,  H01L2224/13 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/8193 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/05644 ,  H01L2924/00014 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/05124

摘要： A microelectronic assembly includes a first microelectronic element having a first face and contacts accessible at the first face, and a layer of a dielectric material having a bottom surface contacting the first microelectronic element, a top surface facing away from the first microelectronic element and holes extending between the top and bottom faces in alignment with the contacts on the first microelectronic element. The assembly includes conductive protrusions extending through the holes to the contacts, the conductive protrusions projecting beyond the top surface of the dielectric layer. The assembly also has a second microelectronic element having a first surface with conductive elements being accessible at the first surface thereof, the second microelectronic element being assembled with the first microelectronic element so that the contacts of the second microelectronic element are connected with the conductive protrusions and the top surface of the dielectric layer is spaced from the first surface of the second microelectronic element.

摘要翻译： 微电子组件包括具有第一面和在第一面可接触的触点的第一微电子元件和具有接触第一微电子元件的底表面的电介质材料层，背离第一微电子元件的顶表面和延伸 在顶面和底面之间，与第一微电子元件上的触点对齐。 组件包括延伸穿过孔到触头的导电突起，导电突出部突出超过电介质层的顶表面。 组件还具有第二微电子元件，其具有第一表面，其导电元件在其第一表面处可访问，第二微电子元件与第一微电子元件组装，使得第二微电子元件的触点与导电突起连接， 电介质层的顶表面与第二微电子元件的第一表面间隔开。

公开(公告)号：US06737265B2

公开(公告)日：2004-05-18

申请号：US10242017

申请日：2002-09-12

申请人： Masud Beroz ,  Joseph Fjelstad ,  Belgacem Haba ,  Christopher M. Pickett ,  John Smith

发明人： Masud Beroz ,  Joseph Fjelstad ,  Belgacem Haba ,  Christopher M. Pickett ,  John Smith

IPC分类号： C12M100

CPC分类号： H01L24/02 ,  H01L2221/68359 ,  H01L2221/68381 ,  H01L2224/02313 ,  H01L2224/02319 ,  H01L2224/02331 ,  H01L2224/02333 ,  H01L2224/02335 ,  H01L2224/0235 ,  H01L2224/02377 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/13024 ,  H01L2224/48091 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/94 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/00015 ,  H01L2224/03 ,  H01L2924/00 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599

摘要： Releasable leads having an elongated fixed portion extend over a surface defined by a dielectric material of a component or by a semiconductor body. A semiconductor element having a conductive structure connected to a set of contacts is also disclosed. A method of making the conductive structure is disclosed.

摘要翻译： 具有细长固定部分的可释放引线在由部件的介电材料或半导体本体限定的表面上延伸。 还公开了具有连接到一组触点的导电结构的半导体元件。 公开了制造导电结构的方法。

公开(公告)号：US06361959B1

公开(公告)日：2002-03-26

申请号：US09317675

申请日：1999-05-24

申请人： Masud Beroz ,  Joseph Fjelstad ,  Belgacem Haba ,  Christopher M. Pickett ,  John Smith

发明人： Masud Beroz ,  Joseph Fjelstad ,  Belgacem Haba ,  Christopher M. Pickett ,  John Smith

IPC分类号： C12Q154

CPC分类号： C12Q1/00 ,  C12Q1/54 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： Electrically conductive elements such as terminals and leads are held on a support structure by a degradable connecting layer such as a adhesive degradable by heat or radiant energy. After connecting these elements to a microelectronic element such as a chip or wafer, the conductive elements are released from the support structure by degrading the connecting layer. The support structure desirably has a predictable, isotropic coefficient of thermal expansion and such coefficient of thermal expansion may be close to that of silicon to minimize the effect of the temperature changes. The conductive elements may be mounted on a plurality of individual tiles rather than on an unitary sheet covering an entire wafer to minimize dimensional changes when the dielectric is released from the support structure.

摘要翻译： 诸如端子和引线的导电元件通过可降解的连接层（例如通过热或辐射能降解的粘合剂）保持在支撑结构上。 在将这些元件连接到诸如芯片或晶片的微电子元件之后，通过降低连接层而将导电元件从支撑结构释放。 支撑结构理想地具有可预测的各向同性热膨胀系数，并且这种热膨胀系数可能接近于硅的热膨胀系数以最小化温度变化的影响。 导电元件可以安装在多个单独的瓦片上，而不是在覆盖整个晶片的整体片材上安装，以便当电介质从支撑结构释放时最小化尺寸变化。

公开(公告)号：US20050155223A1

公开(公告)日：2005-07-21

申请号：US11043354

申请日：2005-01-26

申请人： Joseph Fjelstad ,  Masud Beroz ,  John Smith ,  Belgacem Haba

发明人： Joseph Fjelstad ,  Masud Beroz ,  John Smith ,  Belgacem Haba

IPC分类号： H01L21/44 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01R43/02 ,  H05K3/34

CPC分类号： H01L24/29 ,  H01L23/49811 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/50 ,  H01L24/73 ,  H01L24/78 ,  H01L24/83 ,  H01L24/85 ,  H01L24/86 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/05553 ,  H01L2224/05599 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/49431 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/78 ,  H01L2224/83138 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/8393 ,  H01L2224/85186 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85399 ,  H01L2224/8593 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06558 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10161 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49169 ,  Y10T29/49179 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： A method of making a microelectronic assembly includes juxtaposing a first element having conductive leads thereon with a second element having contacts thereon, and wire bonding the conductive leads on the first element to the contacts on the second element so that elongated bonding wires extend between the conductive leads and the contacts. After the wire bonding step, the first and second elements are moved through a preselected displacement relative to one another so as to deform the bonding wires.

摘要翻译： 制造微电子组件的方法包括：在其上具有导电引线的第一元件与其上具有触点的第二元件并置，并将第一元件上的导电引线接合到第二元件上的触点，使得细长的接合线在导电 领导和联系人。 在引线接合步骤之后，第一和第二元件相对于彼此移动通过预选位移，以使接合线变形。

公开(公告)号：US20140174847A1

公开(公告)日：2014-06-26

申请号：US14139030

申请日：2013-12-23

申请人： John Smith

发明人： John Smith

IPC分类号： H04R1/02

CPC分类号： H04R1/02 ,  H04R1/026 ,  H04R1/2846 ,  H04R1/2884

摘要： A speaker enclosure and method of building same is provided for redirecting standing waves outside the enclosure. The enclosure includes an exterior and an interior comprised of a body having six interior surfaces defining the interior. One of the surfaces has a speaker opening and another of the surfaces has a tuned port opening and defines four corners opposite the speaker opening. An element having an acoustically reflective surface faces the interior and is positioned in a plane that intersects and is inclined with respect to each of the interior surfaces that form the corner. A handle system that includes an attachment means is mounted to the exterior of the enclosure. A rotatable and detachable handle is mounted to the attachment means.

摘要翻译： 提供一种扬声器外壳及其构造方法，用于将驻波重定向在外壳外部。 外壳包括外部和内部，其由具有限定内部的六个内表面的主体构成。 一个表面具有扬声器开口，另一个表面具有调谐端口开口，并且限定与扬声器开口相对的四个角。 具有声反射表面的元件面向内部并且位于与形成角部的每个内表面相交并相对于每个内表面倾斜的平面中。 包括附接装置的把手系统安装在外壳的外部。 可旋转和可拆卸的手柄安装到附接装置。

公开(公告)号：US08618798B2

公开(公告)日：2013-12-31

申请号：US12935202

申请日：2009-03-27

申请人： Samuel Somasundaram ,  Andreas Jakobsson ,  Michael Rowe ,  John Smith ,  Naveed Razzaq Butt ,  Erik Gudmundson ,  Kaspar Althoefer

发明人： Samuel Somasundaram ,  Andreas Jakobsson ,  Michael Rowe ,  John Smith ,  Naveed Razzaq Butt ,  Erik Gudmundson ,  Kaspar Althoefer

IPC分类号： G01V3/00

CPC分类号： G01R33/441 ,  G01N24/08 ,  G01N24/10 ,  G01R33/4616 ,  G01R33/4625 ,  G01R33/5608

摘要： A method of testing a sample comprising the steps of: applying an excitation to the sample; detecting a response signal from the sample; processing a first part and a second part of the response signal; and determining from the second part of the response signal information with which to enhance the first part of the response signal.

摘要翻译： 一种测试样品的方法，包括以下步骤：向样品施加激发; 检测来自样品的响应信号; 处理响应信号的第一部分和第二部分; 并从响应信号的第二部分确定用于增强响应信号的第一部分的信息。

公开(公告)号：US08574000B1

公开(公告)日：2013-11-05

申请号：US13455252

申请日：2012-04-25

申请人： John Smith

发明人： John Smith

IPC分类号： H01R13/58

CPC分类号： H01R13/562 ,  H01R13/501 ,  H01R24/64

摘要： A protective sleeve disposed around a cable and a connector which are connected includes a cable sleeve and a plurality of resilient elements. The cable sleeve includes a bushing, a first ring, and a second ring. The front of the bushing is connected to the connector. The first ring and the second ring are disposed around the cable. The resilient elements are formed by extending the second ring and spaced apart from each other to form an opening for penetration by the cable. The caliber of the opening is less than the caliber of the second ring. Accordingly, the resilient elements are conducive to the positioning of the cable while the cable is penetrating the rings.

摘要翻译： 连接在电缆和连接器周围的保护套包括电缆套和多个弹性元件。 电缆套管包括衬套，第一环和第二环。 衬套的前部连接到连接器。 第一环和第二环设置在电缆周围。 弹性元件通过延伸第二环并彼此间隔开以形成用于穿过电缆的开口而形成。 开口的口径小于第二圈的口径。 因此，当电缆穿透环时，弹性元件有利于电缆的定位。

公开(公告)号：US07897049B2

公开(公告)日：2011-03-01

申请号：US11749448

申请日：2007-05-16

申请人： Rajat S. Ghosh ,  Dennis Fulmer ,  Kevin Kitzman ,  John Smith

发明人： Rajat S. Ghosh ,  Dennis Fulmer ,  Kevin Kitzman ,  John Smith

IPC分类号： C02F1/62 ,  C02F1/70 ,  C02F101/18 ,  C02F101/22

CPC分类号： C02F1/705 ,  C02F1/283 ,  C02F1/286 ,  C02F2101/103 ,  C02F2101/18 ,  C02F2101/22 ,  C02F2103/16 ,  C02F2209/04 ,  Y10S210/904 ,  Y10S210/911 ,  Y10S210/912 ,  Y10S210/913

摘要： Systems and associated methods for treating contaminant-containing wastewater are provided. The systems generally include a reducing zone for reducing the oxidation-reduction potential of the water and a clean-up zone comprising zero valent iron for removing at least a portion of the contaminant from the contaminant-containing water. The systems are operable to remove one or more contaminants from the contaminant-containing water and are operable for extended durations without clogging due to the formation of iron hydroxides.

摘要翻译： 提供了处理含污染废水的系统和相关方法。 该系统通常包括用于降低水的氧化还原电位的还原区和包含用于从含污染物的水中去除至少一部分污染物的零价铁的净化区。 该系统可操作以从含污染物的水中除去一种或多种污染物，并且由于氢氧化铁的形成而可延长持续时间而不堵塞。

公开(公告)号：US07824738B2

公开(公告)日：2010-11-02

申请号：US11587857

申请日：2005-02-04

申请人： John Smith ,  Sharad Chandra

发明人： John Smith ,  Sharad Chandra

IPC分类号： B05D3/00

CPC分类号： C23C10/52 ,  C23C10/38 ,  C23C10/42 ,  C23C10/48 ,  C23C10/50

摘要： This invention relates to the simultaneous treatment of the internal and external surfaces of turbine blades or vanes. In particular it provides a process for coating an external and an internal surface of a turbine blade or vane with aluminium and chromium, respectively, at substantially the same time. The process comprises the following steps (i) and (ii) in either order: (i) applying to the external surface an aluminising compound comprising aluminium, a moderator, an energiser and a diluent; and (ii) applying to the internal surface a chromising compound comprising chromium, an energiser and a diluent. These steps are followed by (iii) heating the turbine blade or vane to form an aluminium layer on the external surface and a chromium layer on the internal surface. The invention also provides a suitable aluminising compound and a chromising compound per se.

摘要翻译： 本发明涉及同时处理涡轮叶片或叶片的内表面和外表面。 特别地，它提供了一种在大致相同的时间分别用铝和铬涂覆涡轮叶片或叶片的外表面和内表面的方法。 该方法按以下顺序包括以下步骤（i）和（ii）：（i）向外表面施加包含铝，慢化剂，激发剂和稀释剂的铝化合物; 和（ii）向内表面施加包含铬，能量器和稀释剂的铬化合物。 这些步骤之后是（iii）加热涡轮机叶片或叶片以在外表面上形成铝层，并在内表面上形成铬层。 本发明还提供合适的铝化合物和铬化合物本身。

公开(公告)号：US20080313597A1

公开(公告)日：2008-12-18

申请号：US11763016

申请日：2007-06-14

申请人： Alan William Brown ,  Simon K. Johnston ,  John Smith

发明人： Alan William Brown ,  Simon K. Johnston ,  John Smith

IPC分类号： G06F9/44

CPC分类号： G06Q10/06

摘要： A method author uses a method generator to create a customized project-specific method that includes first class decision elements. The decision elements are included in a meta model for a process framework, and describe actual decisions for a user to resolve. Once created, a method advisor uses the project-specific method to guide a user through architectural decisions by refining the project-specific method's process flow based upon the user's decisions. The refining includes removing activity elements and decision elements from the process flow that are not reachable by a path corresponding to the user's choice selection. The method advisor also stores the user's choice selections, along with considerations, conditions, and consequences, for the use to view at a later date.

摘要翻译： 方法作者使用方法生成器创建一个自定义的项目特定方法，其中包含一级决策元素。 决策元素包含在过程框架的元模型中，并描述用户要解决的实际决策。 一旦创建，方法顾问将使用项目特定的方法来指导用户通过架构决策，根据用户的决策改进项目特定方法的流程流程。 精炼包括从流程流中移除活动元素和决策元素，这些元素和决策元素不能通过与用户选择选择相对应的路径访问。 方法顾问还存储用户的选择选项以及注意事项，条件和后果，以供稍后查看。