公开(公告)号：US20060275951A1

公开(公告)日：2006-12-07

申请号：US11487880

申请日：2006-07-17

申请人： Michael Warner ,  Masud Beroz ,  David Light ,  Delin Li ,  Dennis Castillo ,  Hung-ming Wang ,  John Smith

发明人： Michael Warner ,  Masud Beroz ,  David Light ,  Delin Li ,  Dennis Castillo ,  Hung-ming Wang ,  John Smith

IPC分类号： H01L21/00

CPC分类号： H01L24/10 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L23/5389 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05572 ,  H01L2224/13 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/8193 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/05644 ,  H01L2924/00014 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/05124

摘要： A microelectronic assembly includes a first microelectronic element having a first face and contacts accessible at the first face, and a layer of a dielectric material having a bottom surface contacting the first microelectronic element, a top surface facing away from the first microelectronic element and holes extending between the top and bottom faces in alignment with the contacts on the first microelectronic element. The assembly includes conductive protrusions extending through the holes to the contacts, the conductive protrusions projecting beyond the top surface of the dielectric layer. The assembly also has a second microelectronic element having a first surface with conductive elements being accessible at the first surface thereof, the second microelectronic element being assembled with the first microelectronic element so that the contacts of the second microelectronic element are connected with the conductive protrusions and the top surface of the dielectric layer is spaced from the first surface of the second microelectronic element.

摘要翻译： 微电子组件包括具有第一面和在第一面可接触的触点的第一微电子元件和具有接触第一微电子元件的底表面的电介质材料层，背离第一微电子元件的顶表面和延伸 在顶面和底面之间，与第一微电子元件上的触点对齐。 组件包括延伸穿过孔到触头的导电突起，导电突出部突出超过电介质层的顶表面。 组件还具有第二微电子元件，其具有第一表面，其导电元件在其第一表面处可访问，第二微电子元件与第一微电子元件组装，使得第二微电子元件的触点与导电突起连接， 电介质层的顶表面与第二微电子元件的第一表面间隔开。

公开(公告)号：US07098074B2

公开(公告)日：2006-08-29

申请号：US10699328

申请日：2003-10-31

申请人： Michael Warner ,  Masud Beroz ,  David Light ,  Delin Li ,  Dennis Castillo ,  Hung-ming Wang ,  John W. Smith

发明人： Michael Warner ,  Masud Beroz ,  David Light ,  Delin Li ,  Dennis Castillo ,  Hung-ming Wang ,  John W. Smith

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L24/10 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L23/5389 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05572 ,  H01L2224/13 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/8193 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/05644 ,  H01L2924/00014 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/05124

摘要： A method is disclosed for making a microelectronic package. A material is applied to a first major surface of a microelectronic element to reduce the heights of protrusions projecting from the first major surface. The microelectronic element is assembled to a microelectronic component. A method of forming protrusions and an assembly incorporating the microelectronic element having protrusions is also disclosed.

摘要翻译： 公开了一种制造微电子封装的方法。 将材料施加到微电子元件的第一主表面以减小从第一主表面突出的突起的高度。 微电子元件组装到微电子元件上。 还公开了一种形成突起的方法和包括具有突起的微电子元件的组件。

公开(公告)号：US07152311B2

公开(公告)日：2006-12-26

申请号：US10032886

申请日：2001-12-26

申请人： Masud Beroz ,  Thomas H. DiStefano ,  Matthew T. Hendrickson ,  David Light ,  John W. Smith

发明人： Masud Beroz ,  Thomas H. DiStefano ,  Matthew T. Hendrickson ,  David Light ,  John W. Smith

IPC分类号： B23P19/04

CPC分类号： H01L24/86 ,  B29C2043/5825 ,  H01L21/67144 ,  H01L2224/7965 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/30105 ,  Y10S269/909 ,  Y10T29/53265 ,  Y10T29/53435 ,  Y10T428/23 ,  Y10T428/239 ,  H01L2924/00

摘要： A flexible sheet used in manufacture of microelectronic components is held on a frame formed from a rigid material so that the frame maintains the sheet under tension during processing and thereby stabilizes the dimensions of the sheet. The frame may be formed from a rigid, light-transmissive material such as a glass, and the bond between the frame and sheet may be made or released by light transmitted through the frame. Preferred features of the framed sheet minimize entrapment of processing liquids such as etch solutions, thereby minimizing carryover of processing solutions between steps. The frame may have contact openings which permit engagement of a metallic layer on the sheet by an electrode carrying electroplating or etching current without disturbing the main portion of the sheet where features are to be formed or treated.

公开(公告)号：US07205659B2

公开(公告)日：2007-04-17

申请号：US10777804

申请日：2004-02-12

申请人： Masud Beroz ,  David Light

发明人： Masud Beroz ,  David Light

IPC分类号： H01L23/48

CPC分类号： H01L24/81 ,  H01L2224/13111 ,  H01L2224/13609 ,  H01L2224/81801 ,  H01L2224/81907 ,  H01L2224/9205 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/351 ,  H05K3/3436 ,  H05K2201/10674 ,  H05K2201/10992 ,  H05K2203/162 ,  H05K2203/176 ,  Y02P70/613 ,  H01L2924/00

摘要： A microelectronic assembly includes a first microelectronic element having a contact bearing face and at least one contact accessible at the contact bearing face, and a second microelectronic element opposing the first microelectronic element, the second microelectronic element having a first surface including at least one lead extending over the first surface. The microelectronic assembly includes the first fusible material engaging the at least one contact of the first microelectronic element, and a second fusible material engaging the at least one lead, whereby one of the first and second fusible materials has a higher melting temperature and one of the first and second fusible materials has a lower melting temperature. The first and second microelectronic elements are juxtaposed with one another so that the first and second fusible materials are in substantial alignment with one another, with one of the first and second fusible materials in a liquid state and one of the first and second fusible materials in a solid state.

摘要翻译： 微电子组件包括第一微电子元件，其具有接触支承面和在接触支承面处可访问的至少一个触点，以及与第一微电子元件相对的第二微电子元件，第二微电子元件具有第一表面，第一表面包括至少一个引线延伸 在第一个表面。 微电子组件包括与第一微电子元件的至少一个触点接合的第一可熔材料和与该至少一个引线接合的第二可熔材料，其中第一和第二熔融材料之一具有较高的熔化温度， 第一和第二可熔材料具有较低的熔化温度。 第一和第二微电子元件彼此并置，使得第一和第二可熔材料彼此基本对齐，其中第一和第二可熔材料中的一个处于液体状态，第一和第二可熔材料中的一个在 固态。

公开(公告)号：US06338982B1

公开(公告)日：2002-01-15

申请号：US09688397

申请日：2000-10-16

申请人： Masud Beroz ,  Thomas H. DiStefano ,  Matthew T. Hendrickson ,  David Light ,  John W. Smith

发明人： Masud Beroz ,  Thomas H. DiStefano ,  Matthew T. Hendrickson ,  David Light ,  John W. Smith

IPC分类号： H01L2102

CPC分类号： H01L24/86 ,  B29C2043/5825 ,  H01L21/67144 ,  H01L2224/7965 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/30105 ,  Y10S269/909 ,  Y10T29/53265 ,  Y10T29/53435 ,  Y10T428/23 ,  Y10T428/239 ,  H01L2924/00

摘要： A flexible sheet used in manufacture of microelectronic components is held on a frame formed from a rigid material so that the frame maintains the sheet under tension during processing and thereby stabilizes the dimensions of the sheet. The frame may be formed from a rigid, light-transmissive material such as a glass, and the bond between the frame and sheet may be made or released by light transmitted through the frame. Preferred features of the framed sheet minimize entrapment of processing liquids such as etch solutions, thereby minimizing carryover of processing solutions between steps. The frame may have contact openings which permit engagement of a metallic layer on the sheet by an electrode carrying electroplating or etching current without disturbing the main portion of the sheet where features are to be formed or treated.

公开(公告)号：US06217972B1

公开(公告)日：2001-04-17

申请号：US09173797

申请日：1998-10-16

申请人： Masud Beroz ,  Thomas H. DiStefano ,  Matthew T. Hendrickson ,  David Light ,  John W. Smith

发明人： Masud Beroz ,  Thomas H. DiStefano ,  Matthew T. Hendrickson ,  David Light ,  John W. Smith

IPC分类号： B32B104

CPC分类号： H01L24/86 ,  B29C2043/5825 ,  H01L21/67144 ,  H01L2224/7965 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/30105 ,  Y10S269/909 ,  Y10T29/53265 ,  Y10T29/53435 ,  Y10T428/23 ,  Y10T428/239 ,  H01L2924/00

摘要： A flexible sheet used in manufacture of microelectronic components is held on a frame formed from a rigid material so that the frame maintains the sheet under tension during processing and thereby stabilizes the dimensions of the sheet. The frame may be formed from a rigid, light-transmissive material such as a glass, and the bond between the frame and sheet may be made or released by light transmitted through the frame. Preferred features of the framed sheet minimize entrapment of processing liquids such as etch solutions, thereby minimizing carryover of processing solutions between steps. The frame may have contact openings which permit engagement of a metallic layer on the sheet by an electrode carrying electroplating or etching current without disturbing the main portion of the sheet where features are to be formed or treated.

摘要翻译： 用于制造微电子部件的柔性片被保持在由刚性材料形成的框架上，使得框架在处理期间将片材保持在张力下，从而稳定片材的尺寸。 框架可以由诸如玻璃的刚性透光材料形成，并且框架和片材之间的结合可以由透射通过框架的光制成或释放。 框架板的优选特征使得诸如蚀刻溶液的处理液体的捕获最小化，从而最小化步骤之间的处理溶液的携带。 框架可以具有接触开口，其允许通过携带电镀或蚀刻电流的电极在片材上接合金属层，而不会干扰要形成或处理特征的片材的主要部分。

公开(公告)号：US07309447B2

公开(公告)日：2007-12-18

申请号：US10771252

申请日：2004-02-03

申请人： David Light ,  Masud Beroz

发明人： David Light ,  Masud Beroz

IPC分类号： B44C1/22

CPC分类号： H01L21/568 ,  H01L23/3107 ,  H01L24/48 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/16145 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/85001 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method for making a reusable mold for forming a microelectronic element package. The method including the steps of removing material from portions of a base to form recesses in the base and then depositing a mask material on at least some portions of the base.

摘要翻译： 一种制造用于形成微电子元件封装的可重复使用的模具的方法。 该方法包括以下步骤：从基底的部分去除材料以在基底中形成凹部，然后在基底的至少一些部分上沉积掩模材料。

公开(公告)号：US06794202B2

公开(公告)日：2004-09-21

申请号：US09802834

申请日：2001-03-09

申请人： Masud Beroz ,  David Light

发明人： Masud Beroz ,  David Light

IPC分类号： H01L2166

CPC分类号： H01L24/81 ,  H01L2224/13111 ,  H01L2224/13609 ,  H01L2224/81801 ,  H01L2224/81907 ,  H01L2224/9205 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/351 ,  H05K3/3436 ,  H05K2201/10674 ,  H05K2201/10992 ,  H05K2203/162 ,  H05K2203/176 ,  Y02P70/613 ,  H01L2924/00

摘要： A method of making a microelectronic assembly includes providing a first microelectronic element having one or more conductive bumps, the conductive bumps including a first fusible material that transforms from a solid to a liquid at a first melting temperature, and providing a second microelectronic element having one or more conductive elements. The conductive bumps of the first microelectronic element are electrically interconnected with the conductive elements of the second microelectronic element using a second fusible material, the second fusible material having a second melting temperature that is lower than the first melting temperature of the first fusible material. During the electrically interconnecting step, the second fusible material is maintained at a temperature that is greater than or equal to the second melting temperature and less than the first melting temperature of the first fusible material. The method also includes testing the microelectronic assembly after the electrically interconnecting step while maintaining the second fusible material at a temperature that is greater than or equal to the second melting temperature.

摘要翻译： 一种制造微电子组件的方法包括提供具有一个或多个导电凸块的第一微电子元件，所述导电凸块包括在第一熔化温度下从固体转变为液体的第一可熔材料，以及提供具有一个 或更多导电元件。 第一微电子元件的导电凸块使用第二可熔材料与第二微电子元件的导电元件电互连，第二可熔材料具有低于第一可熔材料的第一熔化温度的第二熔化温度。 在电互连步骤期间，第二可熔材料保持在大于或等于第二熔融温度并小于第一熔融材料的第一熔化温度的温度。 该方法还包括在电互连步骤之后测试微电子组件，同时将第二可熔材料保持在大于或等于第二熔融温度的温度。

公开(公告)号：US07176506B2

公开(公告)日：2007-02-13

申请号：US10746810

申请日：2003-12-24

申请人： Masud Beroz ,  Michael Warner ,  Lee Smith ,  Glenn Urbish ,  Teck-Gyu Kang ,  Jae M. Park ,  Yoichi Kubota

发明人： Masud Beroz ,  Michael Warner ,  Lee Smith ,  Glenn Urbish ,  Teck-Gyu Kang ,  Jae M. Park ,  Yoichi Kubota

IPC分类号： H01L27/148

CPC分类号： G06F21/10 ,  G06F2221/2129 ,  H01F17/0033 ,  H01L23/24 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/36 ,  H01L23/3675 ,  H01L23/4334 ,  H01L23/49531 ,  H01L23/49575 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/49861 ,  H01L23/5387 ,  H01L23/552 ,  H01L23/645 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/50 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/16 ,  H01L2223/6611 ,  H01L2224/05569 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16145 ,  H01L2224/16235 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/4911 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/85207 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06572 ,  H01L2225/06579 ,  H01L2225/06582 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01061 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/19107 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/05599

摘要： A radio frequency chip package is formed by assembling a connecting element such as a circuit board or flexible circuit tape having chips thereon with a bottom plane element such as a lead frame incorporating a large thermally-conductive plate and leads projecting upwardly from the plane of the plate. The assembly step places the rear surfaces of the chips on the bottom side of the connecting element into proximity with the thermal conductor and joins the conductive traces on the connecting element with the leads. The resulting assembly is encapsulated, leaving terminals at the bottom ends of the leads exposed. The encapsulated assembly may be surface-mounted to a circuit board. The leads provide robust electrical connections between the connecting element and the circuit board.

摘要翻译： 射频芯片封装通过将诸如电路板的连接元件或其上具有芯片的柔性电路带与诸如引入框架的底部平面元件组合而形成，该引线框架包括大的导热板，并且从该平面 盘子。 组装步骤将芯片的后表面放置在连接元件的底侧，与导热体接近，并将连接元件上的导电迹线与导线连接。 所得的组件被封装，导致引线的底端处的端子被暴露。 封装的组件可以表面安装到电路板。 引线在连接元件和电路板之间提供牢固的电连接。

公开(公告)号：US20060113645A1

公开(公告)日：2006-06-01

申请号：US11327057

申请日：2006-01-06

申请人： Michael Warner ,  Belgacem Haba ,  Masud Beroz

发明人： Michael Warner ,  Belgacem Haba ,  Masud Beroz

IPC分类号： H01L23/495

摘要： Inductors are provided in chip assemblies such as in packaged semiconductor chips. The inductors may be incorporated in a chip carrier which forms part of the package, and may include, for example, spiral or serpentine inductors formed from traces on the chip carrier. The chip carrier may include a flap bearing the inductive element, and this flap may be bent to tilt the inductive element out of the plane of the chip carrier to reduce electromagnetic interaction between the inductive element and surrounding electrical components. Other inductors include solenoids formed in part by leads on the chip carrier as, for example, by displacing leads out of the plane of the chip carrier to form loops in vertically-extensive planes transverse to the plane of the chip carrier. Additional features provide trimming of the inductor to a desired inductance value during by breaking or connecting leads during assembly.