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公开(公告)号:US08541799B2
公开(公告)日:2013-09-24
申请号:US13113081
申请日:2011-05-23
申请人: Min-Tsun Hsieh , Wen-Liang Tseng , Lung-Hsin Chen , Chih-Yung Lin , Ching-Lien Yeh , Chi-Wei Liao
发明人: Min-Tsun Hsieh , Wen-Liang Tseng , Lung-Hsin Chen , Chih-Yung Lin , Ching-Lien Yeh , Chi-Wei Liao
IPC分类号: H01L33/00
CPC分类号: H01L33/58 , H01L33/54 , H01L2933/005 , H01L2933/0083
摘要: A light-emitting element package includes a package member for encapsulating a light-emitting element. A plurality of photonic crystal patterns is formed on the package member. A distribution density of the photonic crystal patterns corresponds to light distribution of the light-emitting element. Each photonic crystal pattern consists of a plurality of photonic crystals.
摘要翻译: 发光元件封装包括用于封装发光元件的封装构件。 在封装构件上形成多个光子晶体图案。 光子晶体图案的分布密度对应于发光元件的光分布。 每个光子晶体图案由多个光子晶体组成。
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公开(公告)号:US08270444B2
公开(公告)日:2012-09-18
申请号:US12900676
申请日:2010-10-08
申请人: Min-Tsun Hsieh , Wen-Liang Tseng , Lung-Hsin Chen , Chih-Yung Lin
发明人: Min-Tsun Hsieh , Wen-Liang Tseng , Lung-Hsin Chen , Chih-Yung Lin
CPC分类号: H01L25/0756 , H01L25/167 , H01L33/50 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01S5/4025 , H01L2924/00012 , H01L2924/00014
摘要: A side emitting semiconductor package includes a two-sided electric circuit formed on a silicon substrate of the package, and a plurality of semiconductor light emitting devices bonded on two bilateral surfaces of the electric circuit to provide a surface mounted device with two light emitting sides.
摘要翻译: 侧面发射半导体封装包括形成在封装的硅衬底上的双面电路和接合在电路的两个双面上的多个半导体发光器件,以提供具有两个发光侧的表面安装器件。
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公开(公告)号:US08344406B2
公开(公告)日:2013-01-01
申请号:US12970976
申请日:2010-12-17
申请人: Min-Tsun Hsieh , Wen-Liang Tseng , Lung-Hsin Chen , Chih-Yung Lin , Ching-Lien Yeh , Chi-Wei Liao , Jian-Shihn Tsang
发明人: Min-Tsun Hsieh , Wen-Liang Tseng , Lung-Hsin Chen , Chih-Yung Lin , Ching-Lien Yeh , Chi-Wei Liao , Jian-Shihn Tsang
IPC分类号: H01L33/00
CPC分类号: H01L33/486 , H01L33/46 , H01L33/60 , H01L33/647 , H01L2224/48091 , H01L2224/48227 , H01L2224/48237 , H01L2924/01322 , H01L2924/10253 , H01L2924/00014 , H01L2924/00
摘要: In a light emitting device package and manufacturing method thereof, a multi-layer structure is allocated upon a substrate, of which at least two films with different refractive indices are alternately stacked together.
摘要翻译: 在发光器件封装及其制造方法中,将多层结构分配在基板上,其中至少两个具有不同折射率的膜交替堆叠在一起。
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公开(公告)号:USD644189S1
公开(公告)日:2011-08-30
申请号:US29375805
申请日:2010-09-28
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公开(公告)号:USD642998S1
公开(公告)日:2011-08-09
申请号:US29380580
申请日:2010-12-08
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公开(公告)号:USD642995S1
公开(公告)日:2011-08-09
申请号:US29375808
申请日:2010-09-28
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公开(公告)号:USD642994S1
公开(公告)日:2011-08-09
申请号:US29375804
申请日:2010-09-28
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公开(公告)号:USD642545S1
公开(公告)日:2011-08-02
申请号:US29375806
申请日:2010-09-28
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公开(公告)号:USD640212S1
公开(公告)日:2011-06-21
申请号:US29375807
申请日:2010-09-28
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公开(公告)号:US08384276B2
公开(公告)日:2013-02-26
申请号:US13167704
申请日:2011-06-24
IPC分类号: H01J1/02
CPC分类号: F21V29/004 , F21K9/233 , F21V7/0083 , F21V13/04 , F21V17/102 , F21V29/773 , F21Y2105/10 , F21Y2115/10
摘要: An LED lamp structure includes a heat sink and a base. The heat sink includes a first receiving cavity, a second receiving cavity opposite to the first receiving cavity and a partition. A light board having LED modules is mounted on the partition. The partition defines two first threaded through holes therein. The base has two positioning protrusions engaging in two positioning grooves of the heat sink. Thus, second screw holes of two screw pillars of the base are aligned at the first screw holes of the partition of the heat sink. Screws are used to threadedly engage in the first screw holes, the second screw holes and third screw holes in the light board to thereby assemble the heat sink, the base and the light board together.
摘要翻译: LED灯结构包括散热器和基座。 散热器包括第一接收腔,与第一接收腔相对的第二接收腔和隔板。 具有LED模块的灯板安装在隔板上。 隔板在其中限定了两个第一螺纹通孔。 基座具有两个定位突起,该突起与散热器的两个定位槽啮合。 因此,基座的两个螺柱的第二螺钉孔在散热器的隔板的第一螺钉孔处对准。 螺丝用于螺纹接合灯板中的第一螺钉孔,第二螺钉孔和第三螺钉孔,从而将散热器,基座和灯板组装在一起。
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