公开(公告)号：US20120032194A1

公开(公告)日：2012-02-09

申请号：US12853219

申请日：2010-08-09

申请人： Chih-Hung WEI ,  Ming-Chang Wu ,  Chih-Yang Hsu ,  Ding-Yuan Jheng ,  Ming-Yu Hsu

发明人： Chih-Hung WEI ,  Ming-Chang Wu ,  Chih-Yang Hsu ,  Ding-Yuan Jheng ,  Ming-Yu Hsu

IPC分类号： H01L33/50

CPC分类号： H01L25/0753 ,  H01L33/508 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

摘要： A lighting module with high rending property includes a substrate, a plurality of first light emitting diode (LED) chips, a plurality of second LED chips and a wavelength conversion layer. The first LED chips are deposed on the substrate and electrically connected to the substrate. The second LED chips are deposed on the substrate and electrically connected to the substrate. The wavelength conversion layer seals the first LED chips and the second LED chips. The light emitted from the LED chips and the light emitted from the wavelength conversion layer caused by an excitation by the LED chips are mixing to form warm white light with high color rending property. The number ratio of the first LED chips to the second LED chips deposed on the substrate is 2:1.

摘要翻译： 具有高折射特性的照明模块包括基板，多个第一发光二极管（LED）芯片，多个第二LED芯片和波长转换层。 第一LED芯片被放置在基板上并电连接到基板。 第二LED芯片被放置在基板上并电连接到基板。 波长转换层密封第一LED芯片和第二LED芯片。 从LED芯片发出的光和由LED芯片的激发引起的从波长转换层发射的光被混合，形成具有高色彩特性的暖白光。 在基板上排列的第一LED芯片与第二LED芯片的数量比为2：1。

公开(公告)号：US20100096658A1

公开(公告)日：2010-04-22

申请号：US12254049

申请日：2008-10-20

申请人： Ming-Chang Wu ,  Chih-Yang Hsu ,  Ming-Yu Hsu ,  Chih-Hung Wei

发明人： Ming-Chang Wu ,  Chih-Yang Hsu ,  Ming-Yu Hsu ,  Chih-Hung Wei

IPC分类号： H01L33/00

CPC分类号： H01L33/505 ,  H01L33/486 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

摘要： An improved structure of light emitting diode comprises that a copper clad laminate is made with a rectangular type slot thereon and a ring type slot on the outside boundary to enclose the rectangular type slot, while side wall of the slot form a natural guide angle with the surface of the copper clad laminate to further form an island type platform; a conductor being made between rectangular type slot and ring type slot is penetrated through the copper clad laminate and externally enclosed by the insulator thereby allowing conductor to be insulated; a light emitting diode chip is installed thereon; a fluorescent glue is optionally installed on the light emitting diode with a covering range smaller than the natural guiding angle of the rectangular type slot, wherein the copper clad laminate is installed on the printed circuit board.

摘要翻译： 发光二极管的改进结构包括：覆铜层压板在其上形成矩形型槽，在外边界上形成环形槽，以封闭矩形型槽，而槽的侧壁形成与 覆铜层压板的表面进一步形成岛型平台; 在矩形槽和环形槽之间形成的导体穿过铜包覆层压板并由绝缘体外部包围，从而允许导体绝缘; 在其上安装发光二极管芯片; 荧光胶可选地安装在发光二极管上，覆盖范围小于矩形型槽的自然引导角，其中覆铜层压板安装在印刷电路板上。

公开(公告)号：US07812624B1

公开(公告)日：2010-10-12

申请号：US12471627

申请日：2009-05-26

申请人： Chih-Hung Wei ,  Ming-Chang Wu ,  Chih-Yang Hsu ,  Chih-Lung Wu ,  Ding-Yuan Jheng

发明人： Chih-Hung Wei ,  Ming-Chang Wu ,  Chih-Yang Hsu ,  Chih-Lung Wu ,  Ding-Yuan Jheng

IPC分类号： G01R31/302

CPC分类号： G01R31/2635 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

摘要： A testing method for a LED module and its associated elements includes the steps of: providing a LED module on which a plurality of light-emitting diodes is arranged; providing an integration detector, and mounting it above the LED module; providing an electrically conducting means having a plurality of conductive terminals and an electronic signal connector electrically connected to the conductive terminals; electrically connecting the light-emitting diodes with the conductive terminals; using the electronic signal connector to change the ON/OFF states of the electrical signals of the light-emitting diodes and the conductive terminals; and detecting the photo-electrical properties of each light-emitting diode via the integration detector.

摘要翻译： LED模块及其相关元件的测试方法包括以下步骤：提供其上布置有多个发光二极管的LED模块; 提供集成检测器，并将其安装在LED模块上方; 提供具有多个导电端子和电连接到导电端子的电子信号连接器的导电装置; 将发光二极管与导电端子电连接; 使用电子信号连接器来改变发光二极管和导电端子的电信号的ON / OFF状态; 并通过积分检测器检测每个发光二极管的光电特性。

公开(公告)号：US20090256222A1

公开(公告)日：2009-10-15

申请号：US12081268

申请日：2008-04-14

申请人： Chih-Yang Hsu

发明人： Chih-Yang Hsu

IPC分类号： H01L21/00 ,  H01L31/00

CPC分类号： H01L31/0203 ,  H01L27/14618 ,  H01L27/14685 ,  H01L2224/48227 ,  H01L2924/181 ,  H01L2924/00012

摘要： A packaging method for an image sensing device is disclosed. The packaging method includes the steps of a) providing an annular dam on a substrate; b) mounting an image sensing module, having a light-receiving region exposed, inside the annular dam on the substrate; c) connecting the image sensing module and the substrate via a plurality of bonding wires; d) forming a barrier around the light-receiving region on the image sensing module; e) filling an adhesive between the barrier and the annular dam with the plurality of bonding wires being encapsulated; f) forming a transparent lid above the light-receiving region; and g) cutting off the annular dam.

摘要翻译： 公开了一种用于图像感测装置的封装方法。 包装方法包括以下步骤：a）在基底上提供环形坝; b）将具有曝光的光接收区域的图像感测模块安装在基板上的环形坝内; c）经由多个接合线连接图像感测模块和基板; d）在图像感测模块上的光接收区域周围形成屏障; e）在所述阻挡层和所述环形坝之间填充粘合剂，所述多个接合线被封装; f）在光接收区域上方形成透明盖; g）切断环形坝。

公开(公告)号：US20100295099A1

公开(公告)日：2010-11-25

申请号：US12848621

申请日：2010-08-02

申请人： Chi-Chih HUANG ,  Chih-Yang Hsu

发明人： Chi-Chih HUANG ,  Chih-Yang Hsu

IPC分类号： H01L31/112 ,  H01L31/10 ,  H01L31/02

CPC分类号： H01L31/0203 ,  H01L27/14618 ,  H01L2224/48091 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2924/00

摘要： An image sensing device and packaging method thereof is disclosed. The packaging method includes the steps of a) providing an image sensing module, having a light-receiving region exposed, on a first substrate; b) forming a plurality of first contacts around the light-receiving region on the image sensing module; c) providing a second substrate, having a plurality of second contacts corresponding to the plurality of first contacts and an opening for allowing the light-receiving region to be exposed while the second substrate is placed over the image sensing module, the plurality of second contacts being disposed around the opening; d) connecting the plurality of first contacts and the plurality of second contacts; and e) disposing a transparent lid above the light-receiving region, on a side of the second substrate which is opposite to the plurality of second contacts.

摘要翻译： 公开了一种图像感测装置及其封装方法。 包装方法包括以下步骤：a）在第一基板上提供具有曝光的光接收区域的图像感测模块; b）在图像感测模块上形成围绕光接收区域的多个第一触点; c）提供第二基板，具有对应于多个第一触点的多个第二触点和用于允许在第二基板放置在图像感测模块上方的情况下使受光区域露出的开口，多个第二触点 围绕开口设置; d）连接多个第一触点和多个第二触点; 以及e）在所述第二基板的与所述多个第二触点相对的一侧上，在所述光接收区域的上方设置透明盖。

公开(公告)号：US20100025795A1

公开(公告)日：2010-02-04

申请号：US12222083

申请日：2008-08-01

申请人： Chi-Chih Huang ,  Chih-Yang Hsu

发明人： Chi-Chih Huang ,  Chih-Yang Hsu

IPC分类号： H01L31/0203 ,  H01L31/18

CPC分类号： H01L31/0203 ,  H01L27/14618 ,  H01L2224/48091 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2924/00

摘要： An image sensing device and packaging method thereof is disclosed. The packaging method includes the steps of a) providing an image sensing module, having a light-receiving region exposed, on a first substrate; b) forming a plurality of first contacts around the light-receiving region on the image sensing module; c) providing a second substrate, having a plurality of second contacts corresponding to the plurality of first contacts and an opening for allowing the light-receiving region to be exposed while the second substrate is placed over the image sensing module, the plurality of second contacts being disposed around the opening; d) connecting the plurality of first contacts and the plurality of second contacts; and e) disposing a transparent lid above the light-receiving region, on a side of the second substrate which is opposite to the plurality of second contacts.

公开(公告)号：US20090215216A1

公开(公告)日：2009-08-27

申请号：US12071424

申请日：2008-02-21

申请人： Chi-Chih Huang ,  Chih-Yang Hsu

发明人： Chi-Chih Huang ,  Chih-Yang Hsu

IPC分类号： H01L21/00

CPC分类号： H01L27/14618 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A packaging method for an image sensing device is disclosed. The packaging method includes the steps of a) mounting an image sensing module, having a light-receiving region exposed, on a substrate; b) connecting the image sensing module and the substrate via a plurality of bonding wires; c) forming a protecting layer on the light-receiving region of the image sensing module; d) forming a molding layer to seal the plurality of bonding wires; e) flattening the protecting layer and the molding layer; f) removing the protecting layer to expose the light-receiving region of the image sensing module; and g) forming a transparent lid.

摘要翻译： 公开了一种用于图像感测装置的封装方法。 包装方法包括以下步骤：a）将具有曝光的光接收区域的图像感测模块安装在基板上; b）通过多根接合线连接图像感测模块和基板; c）在图像感测模块的光接收区域上形成保护层; d）形成模制层以密封所述多根接合线; e）使保护层和模制层变平; f）去除保护层以暴露图像感测模块的光接收区域; 和g）形成透明盖。

公开(公告)号：US07811861B2

公开(公告)日：2010-10-12

申请号：US12222083

申请日：2008-08-01

申请人： Chi-Chih Huang ,  Chih-Yang Hsu

发明人： Chi-Chih Huang ,  Chih-Yang Hsu

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L31/0203 ,  H01L27/14618 ,  H01L2224/48091 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2924/00

摘要： An image sensing device and packaging method thereof is disclosed. The packaging method includes the steps of a) providing an image sensing module, having a light-receiving region exposed, on a first substrate; b) forming a plurality of first contacts around the light-receiving region on the image sensing module; c) providing a second substrate, having a plurality of second contacts corresponding to the plurality of first contacts and an opening for allowing the light-receiving region to be exposed while the second substrate is placed over the image sensing module, the plurality of second contacts being disposed around the opening; d) connecting the plurality of first contacts and the plurality of second contacts; and e) disposing a transparent lid above the light-receiving region, on a side of the second substrate which is opposite to the plurality of second contacts.

摘要翻译： 公开了一种图像感测装置及其封装方法。 包装方法包括以下步骤：a）在第一基板上提供具有曝光的光接收区域的图像感测模块; b）在图像感测模块上形成围绕光接收区域的多个第一触点; c）提供第二基板，具有对应于多个第一触点的多个第二触点和用于允许在第二基板放置在图像感测模块上方的情况下使受光区域露出的开口，多个第二触点 围绕开口设置; d）连接多个第一触点和多个第二触点; 以及e）在所述第二基板的与所述多个第二触点相对的一侧上，在所述光接收区域的上方设置透明盖。

公开(公告)号：US08084790B2

公开(公告)日：2011-12-27

申请号：US12848621

申请日：2010-08-02

申请人： Chi-Chih Huang ,  Chih-Yang Hsu

发明人： Chi-Chih Huang ,  Chih-Yang Hsu

IPC分类号： H01L27/148 ,  H01L29/768 ,  H01L31/00

CPC分类号： H01L31/0203 ,  H01L27/14618 ,  H01L2224/48091 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2924/00

摘要： An image sensing device and packaging method thereof is disclosed. The packaging method includes the steps of a) providing an image sensing module, having a light-receiving region exposed, on a first substrate; b) forming a plurality of first contacts around the light-receiving region on the image sensing module; c) providing a second substrate, having a plurality of second contacts corresponding to the plurality of first contacts and an opening for allowing the light-receiving region to be exposed while the second substrate is placed over the image sensing module, the plurality of second contacts being disposed around the opening; d) connecting the plurality of first contacts and the plurality of second contacts; and e) disposing a transparent lid above the light-receiving region, on a side of the second substrate which is opposite to the plurality of second contacts.

摘要翻译： 公开了一种图像感测装置及其封装方法。 包装方法包括以下步骤：a）在第一基板上提供具有曝光的光接收区域的图像感测模块; b）在图像感测模块上形成围绕光接收区域的多个第一触点; c）提供第二基板，具有对应于多个第一触点的多个第二触点和用于允许在第二基板放置在图像感测模块上方的情况下露出光接收区域的开口，多个第二触点 围绕开口设置; d）连接多个第一触点和多个第二触点; 以及e）在所述第二基板的与所述多个第二触点相对的一侧上，在所述光接收区域的上方设置透明盖。

公开(公告)号：US20090224344A1

公开(公告)日：2009-09-10

申请号：US12073594

申请日：2008-03-07

申请人： Chi-Chih Huang ,  Chih-Yang Hsu

发明人： Chi-Chih Huang ,  Chih-Yang Hsu

IPC分类号： H01L31/0203 ,  H01L31/18

CPC分类号： H01L27/14618 ,  H01L27/14683 ,  H01L2224/48091 ,  H01L2924/16235 ,  H01L2924/00014

摘要： A packaging method for an image sensing device is disclosed. The packaging method includes the steps of a) providing a wafer having at least an image sensing module with a light-receiving region exposed; b) forming a barrier around the light-receiving region on the image sensing module; c) dicing the wafer for forming an individual device with the image sensing module; and d) forming a transparent lid supported by the barrier above the light-receiving region of the image sensing module.

摘要翻译： 公开了一种用于图像感测装置的封装方法。 包装方法包括以下步骤：a）提供至少具有曝光的受光区域的图像感测模块的晶片; b）在图像感测模块上的光接收区域周围形成屏障; c）用所述图像感测模块切割用于形成单个装置的所述晶片; 以及d）在所述图像感测模块的光接收区域的上方形成由所述屏障支撑的透明盖。