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公开(公告)号：US07828047B2
公开(公告)日：2010-11-09
申请号：US12003542
申请日：2007-12-28
申请人： Ryuuji Miyazaki , Masumi Suzuki , Minoru Hirano
发明人： Ryuuji Miyazaki , Masumi Suzuki , Minoru Hirano
IPC分类号： F28D15/00
CPC分类号： H01L23/427 , F28D15/0266 , H01L2924/0002 , H01L2924/00
摘要： A cooling unit has a heat receiving unit that receives heat from a body radiating heat; a radiator disposed at a distance from the heat receiving unit and radiating recovered heat; a liquid coolant transporting heat generated at the heat receiving unit to the radiator; and a hollow tube disposed so that the liquid coolant circulates between the heat receiving unit and the radiator, a circulating flow of the liquid coolant formed by an elevating force of air bubbles generated from the heat received at the heat receiving unit, the radiator having an air pocket forming one part of the circulation path of the liquid coolant together with the hollow tube and capable of collecting the air bubbles.
摘要翻译： 冷却单元具有从体内散发热量的热量接收单元， 散热器，其设置在与所述受热单元一定距离处，并且散热回收的热量; 将在所述热接收单元处产生的热量的热量输送到所述散热器; 以及中空管，其设置成使得所述液体冷却剂在所述受热单元和所述散热器之间循环，所述液体冷却剂的循环流由通过在所述受热单元处接收的热产生的气泡的升高力而形成，所述散热器具有 空气袋与中空管一起形成液体冷却剂的循环路径的一部分并且能够收集气泡。
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公开(公告)号：US06507493B2
公开(公告)日：2003-01-14
申请号：US09791777
申请日：2001-02-26
IPC分类号： H05K720
摘要： The present invention relates to a heat dissipation structure for a notebook type computer, capable of effectively dissipating heat generated from a high temperature element (such as a CPU). The heat dissipation structure comprises a main body, a display device and a hinge shaft for coupling the main body with the display device, wherein the hinge shaft is arranged above the main body at a distance therefrom, and a heat dissipation means is provided in the main body.
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公开(公告)号：US06717808B2
公开(公告)日：2004-04-06
申请号：US09791838
申请日：2001-02-26
IPC分类号： H05K720
CPC分类号： G06F1/203 , G02F1/133382 , G06F1/20
摘要： The present invention relates to a heat dissipation structure for a notebook type computer, capable of effectively dissipating heat generated from a high temperature element (such as a CPU). The heat dissipation structure comprises a main body, a display device and a hinge shaft for coupling the main body with the display device, wherein the hinge shaft is arranged above the main body at a distance therefrom, and a heat dissipation means is provided in the main body.
摘要翻译： 本发明涉及一种笔记本式计算机的散热结构，能够有效地散发由高温元件（CPU）产生的热量。 散热结构包括主体，显示装置和用于将主体与显示装置连接的铰链轴，其中铰链轴设置在与主体相距一定距离的上方，并且散热装置设置在 主体。
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公开(公告)号：US06385043B1
公开(公告)日：2002-05-07
申请号：US09688857
申请日：2000-10-17
IPC分类号： H05K720
CPC分类号： G06F1/203 , G02F1/133382 , G06F1/20
摘要： The present invention relates to a heat dissipation structure for a notebook type computer, capable of effectively dissipating heat generated from a high temperature element (such as a CPU). The heat dissipation structure comprises a main body, a display device and a hinge shaft for coupling the main body with the display device, wherein the hinge shaft is arranged above the main body at a distance therefrom, and a heat dissipation means is provided in the main body.
摘要翻译： 本发明涉及一种笔记本式计算机的散热结构，能够有效地散发由高温元件（CPU）产生的热量。 散热结构包括主体，显示装置和用于将主体与显示装置连接的铰链轴，其中铰链轴设置在与主体相距一定距离的上方，并且散热装置设置在 主体。
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公开(公告)号：US06219236B1
公开(公告)日：2001-04-17
申请号：US09448496
申请日：1999-11-24
申请人： Minoru Hirano , Masumi Suzuki
发明人： Minoru Hirano , Masumi Suzuki
IPC分类号： H05K720
CPC分类号： H01L23/467 , H01L23/40 , H01L23/4006 , H01L2924/0002 , H05K7/20436 , H05K7/20472 , H05K7/20509 , H01L2924/00
摘要： It is an object of the present invention to provide a cooling system capable of simultaneously cooling the electronic parts on a multichip module that is arranged so as to provide a predetermined function, wherein the cooling system can be easily and quickly attached to and detached from the module when necessary. The present invention is to provide a cooling system for cooling a multichip module MCM having a predetermined function, on the substrate B of which a plurality of electronic parts including heat generating parts P are mounted, the cooling system for cooling a multichip module comprising: a radiating body 1 capable of covering upper portions of the plurality of electronic parts P while a predetermined clearance is formed between the radiating body 1 and the electronic parts P; a sheet S made of silicon rubber arranged in the clearance, for thermally connecting the upper surfaces of the electronic parts and the radiating member; and a screw N for detachably connecting the radiating body with the substrate B of the multichip module MCM.
摘要翻译： 本发明的目的是提供一种冷却系统，其能够同时冷却多芯片模块上的电子部件，该多芯片模块被布置成提供预定功能，其中冷却系统可以容易且快速地附接到 模块必要时。 本发明提供一种用于冷却具有预定功能的多芯片模块MCM的冷却系统，该冷却系统在其上安装有包括发热部件P的多个电子部件的基板B上，用于冷却多芯片模块的冷却系统包括： 在辐射体1和电子部件P之间形成有规定的间隙的情况下，能够覆盖多个电子部件P的上部的散热体1; 布置在所述间隙中的由硅橡胶制成的片材S，用于热连接所述电子部件和所述散热构件的上表面; 以及用于将散热体与多芯片模块MCM的基板B可拆卸地连接的螺钉N.
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公开(公告)号：US07337829B2
公开(公告)日：2008-03-04
申请号：US10407464
申请日：2003-04-07
申请人： Ryuuji Miyazaki , Masumi Suzuki , Minoru Hirano
发明人： Ryuuji Miyazaki , Masumi Suzuki , Minoru Hirano
CPC分类号： H01L23/427 , F28D15/0266 , H01L2924/0002 , H01L2924/00
摘要： A cooling unit has a heat receiving unit that receives heat from a body radiating heat; a radiator disposed at a distance from the heat receiving unit and radiating recovered heat; a liquid coolant transporting heat generated at the heat receiving unit to the radiator; and a hollow tube disposed so that the liquid coolant circulates between the heat receiving unit and the radiator, a circulating flow of the liquid coolant formed by an elevating force of air bubbles generated from the heat received at the heat receiving unit, the radiator having an air pocket forming one part of the circulation path of the liquid coolant together with the hollow tube and capable of collecting the air bubbles.
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公开(公告)号：US06781846B1
公开(公告)日：2004-08-24
申请号：US09482518
申请日：2000-01-14
申请人： Masumi Suzuki , Minoru Hirano
发明人： Masumi Suzuki , Minoru Hirano
IPC分类号： H05K114
CPC分类号： H05K5/0269 , G06F1/203 , G06F2200/201
摘要： An IC card adapted to be removably inserted into a slot of an IC card mountable device, including a card housing formed like a substantially rectangular card with an inside space defined therein, the card housing having a plurality of openings through a wall of the card housing; a printed wiring board accommodated in the card housing; and a plurality of electronic components mounted on the printed wiring board.
摘要翻译： 一种适于可拆卸地插入到IC卡可安装装置的槽中的IC卡，包括形成为具有限定在其中的内部空间的大致矩形卡的卡壳体，卡壳体具有穿过卡壳体的壁的多个开口 ; 容纳在卡壳体中的印刷线路板; 以及安装在印刷电路板上的多个电子部件。
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8.发明授权Method of controlling cooling device in portable electronic and cooling device therefor 失效控制便携式电子冷却装置中的冷却装置的方法公开(公告)号：US06454362B1
公开(公告)日：2002-09-24
申请号：US09475773
申请日：1999-12-30
申请人： Tadashi Katsui , Keizo Takemura , Minoru Hirano , Masumi Suzuki , Yoshiaki Udagawa , Masuo Ohnishi , Kenichi Fujii
发明人： Tadashi Katsui , Keizo Takemura , Minoru Hirano , Masumi Suzuki , Yoshiaki Udagawa , Masuo Ohnishi , Kenichi Fujii
IPC分类号： H01H3514
CPC分类号： G06F1/203 , G06F1/206 , G06F2200/201 , Y02D10/16
摘要： A cooling device for a portable electronic comprises a radiation plate and a fin for radiating the heat from the CPU. When the plug of an external power. supply is attached to the body of the portable electronic, the CPU may operate at a high clock frequency. The cooling device achieves a high cooling performance by operating a ventilation fan directed to the fin, for example. When the plug is removed from the body of the portable electronic, the CPU may operate at a low clock frequency. Power consumption can be reduced, so that the electric power stored in the built-in battery can be saved. The duration time of the operation can be extended. Calorific power generated at the CPU can also be reduced, so that the cooling device is adapted to suppress the rise in the temperature of the CPU without operation of the ventilation fan.
摘要翻译： 用于便携式电子的冷却装置包括辐射板和用于从CPU辐射热量的翅片。 当外插电源时。 电源连接到便携式电子的主体，CPU可以以高时钟频率工作。 例如，冷却装置通过操作指向翅片的通风扇来实现高冷却性能。 当插头从便携式电子的主体移除时，CPU可以以低时钟频率工作。 可以降低功耗，从而可以节省存储在内置电池中的电力。 可以延长操作的持续时间。 也可以减少在CPU产生的热量，从而冷却装置适于在不使用通风扇的情况下抑制CPU的温度上升。
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公开(公告)号：US5763950A
公开(公告)日：1998-06-09
申请号：US598331
申请日：1996-02-08
申请人： Akihiko Fujisaki , Junichi Ishimine , Masumi Suzuki , Masahiro Miyo , Shunichi Kikuchi , Minoru Hirano , Hitoshi Nori
发明人： Akihiko Fujisaki , Junichi Ishimine , Masumi Suzuki , Masahiro Miyo , Shunichi Kikuchi , Minoru Hirano , Hitoshi Nori
IPC分类号： H01L23/36 , H01L23/367 , H01L23/433 , H01L23/467 , H01L23/473 , H01L29/06 , H01L23/34
CPC分类号： H01L23/3672 , H01L23/3677 , H01L23/433 , H01L23/4336 , H01L23/467 , H01L23/473 , H01L2224/16 , H01L29/0657 , H01L2924/01004 , H01L2924/01019 , H01L2924/01068
摘要： A semiconductor element cooling apparatus adapted to cool at least one semiconductor element mounted on a circuit substrate. The semiconductor element cooling apparatus includes a first mechanism for generating a coolant flow by flowing a coolant over a top surface of the semiconductor element, and a second mechanism for obliquely obstructing the coolant flowing over the semiconductor element from an upstream side towards a downstream side of the coolant flow.
摘要翻译： 一种适于冷却安装在电路基板上的至少一个半导体元件的半导体元件冷却装置。 半导体元件冷却装置包括：第一机构，用于通过在半导体元件的顶表面上流动冷却剂来产生冷却剂流;以及第二机构，用于将流过半导体元件的冷却剂从上游侧向下游侧倾斜地阻塞 冷却液流动。
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公开(公告)号：US20080236797A1
公开(公告)日：2008-10-02
申请号：US12003542
申请日：2007-12-28
申请人： Ryuuji Miyazaki , Masumi Suzuki , Minoru Hirano
发明人： Ryuuji Miyazaki , Masumi Suzuki , Minoru Hirano
CPC分类号： H01L23/427 , F28D15/0266 , H01L2924/0002 , H01L2924/00
摘要： A cooling unit has a heat receiving unit that receives heat from a body radiating heat; a radiator disposed at a distance from the heat receiving unit and radiating recovered heat; a liquid coolant transporting heat generated at the heat receiving unit to the radiator; and a hollow tube disposed so that the liquid coolant circulates between the heat receiving unit and the radiator, a circulating flow of the liquid coolant formed by an elevating force of air bubbles generated from the heat received at the heat receiving unit, the radiator having an air pocket forming one part of the circulation path of the liquid coolant together with the hollow tube and capable of collecting the air bubbles.
摘要翻译： 冷却单元具有从体内散发热量的热量接收单元， 散热器，其设置在与所述受热单元一定距离处，并且散热回收的热量; 将在所述热接收单元处产生的热量的热量输送到所述散热器; 以及中空管，其设置成使得所述液体冷却剂在所述受热单元和所述散热器之间循环，所述液体冷却剂的循环流由通过在所述受热单元处接收的热产生的气泡的升高力而形成，所述散热器具有 空气袋与中空管一起形成液体冷却剂的循环路径的一部分并且能够收集气泡。
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