摘要:
An optical disk apparatus according to the invention comprises a housing, a tray retractably mounted in the housing, and a bezel 10 adapted to close an opening of the housing 2 when the tray is accommodated in the housing 2. An electrically conductive metallic member 15 is disposed in at least one of main flat portions in the bezel 10. When the tray is accommodated in the housing, at least one surface of the conductive metallic member 15 is in contact with the housing.
摘要:
Row faulty bit storage memory corresponding to a spare row circuit and a column faulty bit storage memory corresponding to a spare column circuit are provided independently of each other, and faulty bits of these faulty bit storage memories are counted by a row faulty bit counter and a column faulty bit counter, respectively. Repairability of the faulty row and repairability of the faulty column are determined using the row faulty bit storage memory and the column faulty bit storage memory. A time required for determining repairability of the faulty bit of a semiconductor memory is reduced, and a storage capacity of the faulty bit storage memory is reduced.
摘要:
A semiconductor memory device with a redundant configuration according to the present invention includes a roll call circuit which turns an output signal of a sense amplifier compulsorily to a signal of a predetermined logical level when a portion constituting the redundant configuration is accessed, and turns an output signal of the output control circuit to that of the same predetermined logical level when a write instruction is given outside a normal level. Whether a spare memory cell is accessed can be checked in every output and the redundant configuration can operate with stability.
摘要:
A body contact layer 18 is formed on the side of a recessed structure 17 as well as in the bottom of the recessed structure 17, so that a contact area between the body contact layer 18 and a well layer 12 is increased and the amount of dopant implanted to the body contact layer 18 is suppressed.
摘要:
A first delay circuit for delaying a data signal IND output from a memory circuit and a second delay circuit for delaying a strobe signal INS, and a latch circuit for latching data according to the outputs of the first and the second delay circuits are provided as a test circuit inside a DDR SDRAM. A tester can observe results of latching by the latch circuit to facilitate determination whether the data signal and the strobe signal have a correlation adapted to a standard. Accordingly, such a DDR SDRAM can be provided that is capable of conducting an examination whether the device meets a tDQSQ standard defining a correlation between the strobe signal DQS and the data signal DQ with ease.
摘要:
In a semiconductor device including banks A and B, testing and redundancy analysis of the bank B are first carried out by using a conventional tester, and redundancy replacement is carried out. Then, the bank A is tested by a BIST circuit and the test result of each bit is written to the bank B. By using the bank B as a memory for defect analysis, a tester connected to the semiconductor device while testing the bank A does not need a large capacity analysis memory. Thus, an inexpensive redundancy analysis system can be provided.
摘要:
A body contact layer 18 is formed on the side of a recessed structure 17 as well as in the bottom of the recessed structure 17, so that a contact area between the body contact layer 18 and a well layer 12 is increased and the amount of dopant implanted to the body contact layer 18 is suppressed.
摘要:
The present invention provides a semiconductor apparatus having high reliability with respect to a withstand voltage, leakage characteristics, etc. by disposing a structure of preventing stress occurring by metal wiring from directly acting on a trench relating to the semiconductor apparatus having a trench gate. The semiconductor apparatus of the invention includes a semiconductor substrate including a semiconductor layer having a predetermined impurity concentration, a trench gate formed in the semiconductor layer by filling a stripe-shaped trench by a conductor layer on which surface and interface a gate oxide film is formed, an insulating film covering a surface of the semiconductor layer and having a source contact opening, a source region formed in the semiconductor layer, a source electrode formed on the surface of the semiconductor layer so as to electrically connect to the source region through the source contact opening, a gate peripheral wiring connected to the trench gate at a peripheral edge part of the trench gate, a gate electrode separately formed from the source electrode, formed above the surface of the semiconductor layer and connected to the gate peripheral wiring and a drain electrode formed on an surface of the semiconductor substrate opposite to the surface of the semiconductor layer, wherein the trench gate is formed so as to avoid a corner portion of the source contact opening of the source electrode.
摘要:
A pair of left and right rockers are arranged along a vehicle longitudinal direction at lower portions of two vehicle lateral direction ends of a body. A floor cross-member is provided at each of two vehicle lateral direction end portions of a cross member, which is arranged along the vehicle lateral direction at a lower portion of the body. A lower side joining flange of each rocker and a vehicle lateral direction outer side end portion of a bottom wall portion of each floor cross-member are joined together by a mount bracket. With the rocker and/or the floor cross-member, the mount bracket forms a closed cavity, of which a vehicle lateral direction outer side portion extends beneath a rocker inner. A nut is provided in the closed cavity for joining the body with a body mount, which is fixed to a chassis frame.
摘要:
An apparatus to be inspected is mounted on one surface of a socket board. An auxiliary inspecting apparatus for adjusting timing of write signals transmitted from a semiconductor inspecting apparatus is mounted on the other surface of the socket board. Input/output (I/O) pins of the auxiliary inspecting apparatus are connected to corresponding I/O pins of the inspected device via through holes in the socket board on a one-to-one basis. This semiconductor inspecting method is thus capable of easily suppressing the delay difference between a plurality of signals output from the semiconductor inspecting apparatus.