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公开(公告)号：US12030125B2
公开(公告)日：2024-07-09
申请号：US17434492
申请日：2020-03-02
发明人： Kei Anai , Shinichi Yamauchi , Jung-Lae Jo , Takahiko Sakaue
CPC分类号： B22F7/064 , B22F1/00 , B22F1/107 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/29147 , H01L2224/32058 , H01L2224/32245 , H01L2224/83192 , H01L2224/83203 , H01L2224/8384
摘要： A bonded body is provided including: a bonding layer containing Cu; and a semiconductor element bonded to the bonding layer. The bonding layer includes an extending portion laterally extending from a peripheral edge of the semiconductor element. In a cross-sectional view in a thickness direction, the extending portion rises from a peripheral edge of a bottom of the semiconductor element or from the vicinity of the peripheral edge of the bottom of the semiconductor element, and includes a side wall substantially spaced apart from a side of the semiconductor element. Preferably, the extending portion does not include any portion where the side wall and the side of the semiconductor element are in contact with each other. A method for manufacturing a bonded body is also provided.
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公开(公告)号：US20150262729A1
公开(公告)日：2015-09-17
申请号：US14433999
申请日：2013-11-08
CPC分类号： H01B1/22 , B05D7/14 , B22F1/0014 , B22F1/0074 , B22F1/025 , B22F2999/00 , H01B1/02 , H01B13/00 , Y10T428/12181 , B22F9/24
摘要： A silver-coated copper powder includes copper core particles and a silver coat layer located on the surface of the core particles. When S1 is a BET specific surface area (m2/g) of the silver-coated copper powder; S2 is a specific surface area (m2/g) calculated from a particle diameter D50 obtained by the analysis of a microscopic image of the silver-coated copper powder; and t is a thickness of the silver coat layer, the silver-coated copper powder satisfies Expression: (S1/S2)≦0.005×t+1.45. The silver-coated copper powder has a volume cumulative particle diameter D50L at a cumulative volume of 50 vol % as measured by laser diffraction-scattering method of 0.01 to 100 μm.
摘要翻译： 银涂覆铜粉包括铜芯颗粒和位于芯颗粒表面上的银涂层。 当S1为镀银铜粉末的BET比表面积（m2 / g）时， S2是通过分析银包覆铜粉末的显微镜图像获得的粒径D50计算的比表面积（m2 / g） 并且t是银涂层的厚度，镀银铜粉满足式（S1 / S2）＆nlE; 0.005×t + 1.45。 镀银铜粉末，通过激光衍射散射法测定的累积体积为50体积％的体积累积粒径D50L为0.01〜100μm。
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公开(公告)号：US09245662B2
公开(公告)日：2016-01-26
申请号：US13971318
申请日：2013-08-20
发明人： Akihiro Nara , Hiroyuki Iseki , Takahiko Sakaue
CPC分类号： H01B1/08 , C01P2002/60 , C01P2004/32 , C01P2004/62 , C01P2006/10 , C01P2006/40 , C01P2006/62 , C01P2006/63 , C01P2006/64 , C09C1/027 , C09C1/3054 , C09C1/3661 , C09C1/407 , C09D5/24 , H01B1/02
摘要： An electroconductive particle having a core particle and a tin oxide-containing coating layer on the core particle. The tin oxide of the coating layer has a crystallite size of 70 to 200 Å. The electroconductive particle preferably has a ratio of R3 to R1 of 1 to 250, wherein R1 and R3 are respective surface resistivities of electroconductive films formed of a coating composition containing the electroconductive particle and prepared by 1-hour dispersing and 3-hour dispersing, respectively. The coating layer preferably comprises dopant element-free, electroconductive tin oxide.
摘要翻译： 在核心颗粒上具有核心颗粒和含氧化锡的涂层的导电颗粒。 涂层的氧化锡的微晶尺寸为70〜200。 导电颗粒的R3与R1的比例优选为1〜250，其中R1和R3分别是由含有导电颗粒的涂料组合物形成并由1小时分散和3小时分散制备的导电膜的表面电阻率 。 涂层优选包含无掺杂剂元素的导电氧化锡。
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公开(公告)号：US20150144849A1
公开(公告)日：2015-05-28
申请号：US14412734
申请日：2013-06-19
CPC分类号： H01B1/026 , B22F1/025 , B22F9/24 , C22C9/02 , H01B1/22 , H01B13/0026 , Y10T428/12181
摘要： The disclosed composite copper particle includes a core particle including copper, and a coating layer including a copper-tin alloy and formed on the surface of the core particle, the composite copper particle having a particle diameter at 50% cumulative volume in the particle size distribution of 0.1 to 10.0 μm. The alloy is preferably CuSn. The ratio of tin to the the composite copper particle is preferably 3.0 to 12.0 mass %. The composite copper particle is suitably obtained by a method including a step of mixing a reducing agent for tin and an aqueous slurry containing a tin source compound and core particles which include copper, to form a coating layer including a copper-tin alloy on a surface of the core particles.
摘要翻译： 所公开的复合铜颗粒包括包含铜的芯颗粒和在芯颗粒的表面上形成的包含铜 - 锡合金的涂层，复合铜颗粒的粒径在累积体积上具有50％的粒度分布 为0.1〜10.0μm。 合金优选为CuSn。 锡与复合铜粒子的比例优选为3.0〜12.0质量％。 复合铜颗粒通过包括将锡的还原剂和含有锡源化合物的水性浆料和包含铜的核心颗粒混合的步骤的方法适当地获得，以在表面上形成包含铜 - 锡合金的涂层 的核心颗粒。
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