公开(公告)号：US4610858A

公开(公告)日：1986-09-09

申请号：US713901

申请日：1985-03-20

申请人： Mitsunori Yamada ,  Masaji Ishii ,  Akira Miyai ,  Yukihiko Nakajima ,  Shinsei Sato

发明人： Mitsunori Yamada ,  Masaji Ishii ,  Akira Miyai ,  Yukihiko Nakajima ,  Shinsei Sato

IPC分类号： B01D3/32 ,  C01B33/04 ,  C01B33/107

CPC分类号： C01B33/10773 ,  B01D3/322 ,  C01B33/043

摘要： A chlorosilane disproportionation catalyst comprising a tertiary amine of the formula: ##STR1## where each R represents an aliphatic hydrocarbon group and the sum of carbon atoms in the three aliphatic hydrocarbon groups as R is 12 or more, and a tertiary amine hydrochloride of the formula: ##STR2## where R is as defined above.

摘要翻译： 一种氯硅烷歧化催化剂，其包含下式的叔胺：其中每个R表示脂族烃基，并且作为R的三个脂族烃基中的碳原子总数为12或更大，以及叔胺盐酸盐 式（B）其中R如上定义。

公开(公告)号：US4112290A

公开(公告)日：1978-09-05

申请号：US736169

申请日：1976-10-27

申请人： Yukihiko Nakajima ,  Shuzou Watanabe ,  Akira Miyai ,  Masaji Ishii

发明人： Yukihiko Nakajima ,  Shuzou Watanabe ,  Akira Miyai ,  Masaji Ishii

IPC分类号： C23C14/26 ,  C23C13/12

CPC分类号： C23C14/26

摘要： An evaporation vessel for vacuum evaporation of electroconductive ceramic boat for use in the vacuum evaporation of a metallic or non-metallic substance by virtue of resistance heating, wherein the surface of the adjoining portion on the both sides of a cavity is lower than the top of the outside wall of the cavity.

摘要翻译： 用于通过电阻加热用于金属或非金属物质的真空蒸发的导电陶瓷舟皿的真空蒸发的蒸发容器，其中腔体两侧的相邻部分的表面低于 腔的外壁。

公开(公告)号：US4029466A

公开(公告)日：1977-06-14

申请号：US603140

申请日：1975-08-08

申请人： Masaji Ishii ,  Akio Mikogami ,  Akira Miyai

发明人： Masaji Ishii ,  Akio Mikogami ,  Akira Miyai

IPC分类号： C04B41/51 ,  C04B41/88 ,  C23C14/24 ,  F27B14/10 ,  F27B14/06

CPC分类号： C04B41/5133 ,  C04B41/88 ,  C23C14/243

摘要： Metal is evaporated in a container which comprises an electrically conductive ceramic base whose surface in contact with the molten metal is coated with a film comprising, a main component selected from the group consisting of titanium carbide, zirconium carbide, hafnium carbide, vanadium carbide, niobium carbide, tantalum carbide, chromium carbide, molybdenum carbide, tungsten carbide, tungsten metal, tantalum metal and molybdenum metal.

摘要翻译： 金属在容器中蒸发，该容器包括导电陶瓷基底，其与熔融金属接触的表面涂覆有包括选自碳化钛，碳化锆，碳化铪，碳化钒，铌的主要成分的膜 碳化物，碳化钽，碳化铬，碳化钼，碳化钨，钨金属，钽金属和钼金属。

公开(公告)号：US4168565A

公开(公告)日：1979-09-25

申请号：US898401

申请日：1978-04-20

申请人： Masaji Ishii ,  Shuzo Watanabe ,  Akira Miyai ,  Hideo Hiraoka

发明人： Masaji Ishii ,  Shuzo Watanabe ,  Akira Miyai ,  Hideo Hiraoka

IPC分类号： H01J1/13 ,  H01J9/04

CPC分类号： H01J9/04 ,  H01J1/13

摘要： A method for manufacturing a thermionic cathode is provided which comprises cutting a bar from a multi-layer structure having a first layer of thermoelectron emissive compound and a third layer of metal of high melting point, a second layer of reaction barrier being interposed between said first and third layers, the bar being cut in a direction substantially perpendicular to that of the layers, sharpening the end of the first layer of the bar and then providing current terminals with the third layer of the bar. According to the method of the invention, a thermionic cathode capable of emitting stable electron beams of high intensity for a long period of time can be manufactured.

摘要翻译： 提供一种用于制造热离子阴极的方法，其包括从具有第一层热电子发射化合物层和第三层高熔点金属的多层结构切割条，第二层反应阻挡层插入在所述第一层 和第三层，所述条在基本上垂直于所述层的方向上切割，使所述条的所述第一层的末端锐化，然后向所述条的第三层提供电流端子。 根据本发明的方法，可以制造能够长时间发射高强度电子束的热离子阴极。

公开(公告)号：US4482839A

公开(公告)日：1984-11-13

申请号：US341078

申请日：1982-01-20

申请人： Tetsuya Wada ,  Masaji Ishii ,  Akira Miyai ,  Hirotoshi Hagiwara

发明人： Tetsuya Wada ,  Masaji Ishii ,  Akira Miyai ,  Hirotoshi Hagiwara

IPC分类号： H01J1/14 ,  H01J1/148 ,  H01J1/15 ,  H01J1/18 ,  H01J9/04 ,  H01J19/06 ,  H01K1/04

CPC分类号： H01J9/04 ,  H01J1/148 ,  H01J1/15

摘要： A thermionic emission cathode comprises a cathode tip made of an alkaline earth metal or rare earth metal hexaboride, a metallic support for supporting a base of said cathode tip and a reaction barrier layer comprising colloidal carbon and a reaction barrier material which bonds said cathode tip and said metallic support in one body.

摘要翻译： 热电子发射阴极包括由碱土金属或稀土金属六硼化物制成的阴极尖端，用于支撑所述阴极尖端的基底的金属支撑体和包含胶体碳的反应阻挡层和将所述阴极尖端和 金属支架在一体内。

公开(公告)号：US4137476A

公开(公告)日：1979-01-30

申请号：US798243

申请日：1977-05-18

申请人： Masaji Ishii ,  Shuzo Watanabe ,  Akira Miyai ,  Hideo Hiraoka

发明人： Masaji Ishii ,  Shuzo Watanabe ,  Akira Miyai ,  Hideo Hiraoka

IPC分类号： H01J1/13 ,  H01J1/16 ,  H01J19/10

CPC分类号： H01J1/13

摘要： A thermionic cathode for an electron beam device is provided which comprises a first layer of thermoelectron emissive compound sharpened towards a point, a third layer of metal of high melting point and a second layer of reaction barrier interposed between the first and third layers, current terminals being attached to said third layer. According to the invention, a thermionic cathode capable of emitting stable electron beams of high intensity for a long period of time can be manufactured.

摘要翻译： 提供了一种用于电子束装置的热离子阴极，其包括朝向点锐化的第一层热电子发射化合物，高熔点金属第三层和介于第一和第三层之间的第二反应栅层，电流端子 附着于所述第三层。 根据本发明，可以制造能够长时间发射高强度电子束的热离子阴极。

公开(公告)号：US5354415A

公开(公告)日：1994-10-11

申请号：US584

申请日：1993-01-04

申请人： Yasuhito Fushii ,  Miyuki Nakamura ,  Yukihiko Nakajima ,  Kazuo Kato ,  Akira Miyai ,  Kazuyuki Hiruta

发明人： Yasuhito Fushii ,  Miyuki Nakamura ,  Yukihiko Nakajima ,  Kazuo Kato ,  Akira Miyai ,  Kazuyuki Hiruta

IPC分类号： H05K1/03 ,  H05K3/06 ,  H05K3/26 ,  H05K3/38 ,  C23F1/00

CPC分类号： H05K3/06 ,  C04B37/026 ,  H05K3/26 ,  H05K3/38 ,  C04B2235/6565 ,  C04B2235/6581 ,  C04B2235/96 ,  C04B2237/12 ,  C04B2237/121 ,  C04B2237/122 ,  C04B2237/124 ,  C04B2237/125 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/407 ,  C04B2237/52 ,  C04B2237/525 ,  C04B2237/704 ,  C04B2237/706 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K2201/0355 ,  H05K2201/0761 ,  H05K2203/0789

摘要： Method for forming a ceramic circuit board by forming a metal circuit pattern on a ceramic board through an active metal ingredient-containing brazing material and removing an unnecessary part of the brazing material by chemical liquor treatment.

摘要翻译： 通过在陶瓷板上形成金属电路图形并通过含有活性金属成分的钎焊材料形成陶瓷电路板并通过化学液体处理除去不需要的部分钎焊材料的方法。

公开(公告)号：US07207105B2

公开(公告)日：2007-04-24

申请号：US11049856

申请日：2005-02-04

申请人： Akira Miyai ,  Yukihiko Nakajima ,  Hideki Hirotsuru ,  Ryozo Nonogaki ,  Takuya Okada ,  Masahiro Ibukiyama

发明人： Akira Miyai ,  Yukihiko Nakajima ,  Hideki Hirotsuru ,  Ryozo Nonogaki ,  Takuya Okada ,  Masahiro Ibukiyama

IPC分类号： H05K3/36

CPC分类号： H01L23/142 ,  H01L23/15 ,  H01L23/3735 ,  H01L2924/0002 ,  H05K1/053 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49158 ,  Y10T29/49984 ,  Y10T428/24917 ,  H01L2924/00

摘要： A substrate for mounting an electronic component, includes a baseplate having a main surface formed with or without a recess. A ceramic substrate is provided on the main surface of the baseplate and has a smaller size than the baseplate. A metal layer is provided to cover both of the baseplate and the ceramic substrate. The metal layer has a surface remote from the baseplate and the ceramic substrate is made flat, the baseplate is made of a metal-ceramic composite of a metallic material and a ceramic material, and the metallic material in the composite and the metal layer have different compositions. Thus, an integral ceramic circuit board, which is resistant to repeated thermal stress and is superior in reliability can be realized.

摘要翻译： 用于安装电子部件的基板包括具有形成有或不具有凹部的主表面的基板。 陶瓷基板设置在基板的主表面上并且具有比基板更小的尺寸。 提供金属层以覆盖基板和陶瓷基板。 金属层具有远离基板的表面，陶瓷基板平坦，基板由金属材料和陶瓷材料的金属 - 陶瓷复合材料制成，复合材料和金属层中的金属材料具有不同的 组合物。 因此，可以实现耐受重复的热应力并且可靠性优异的整体陶瓷电路板。

公开(公告)号：US07130174B2

公开(公告)日：2006-10-31

申请号：US10432351

申请日：2001-11-28

申请人： Akira Miyai ,  Yukihiko Nakajima ,  Hideki Hirotsuru ,  Ryozo Nonogaki ,  Takuya Okada ,  Masahiro Ibukiyama

发明人： Akira Miyai ,  Yukihiko Nakajima ,  Hideki Hirotsuru ,  Ryozo Nonogaki ,  Takuya Okada ,  Masahiro Ibukiyama

IPC分类号： H02H3/00

CPC分类号： H01L23/142 ,  H01L23/15 ,  H01L23/3735 ,  H01L2924/0002 ,  H05K1/053 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49158 ,  Y10T29/49984 ,  Y10T428/24917 ,  H01L2924/00

摘要： A substrate for mounting an electronic component, including a baseplate having a main surface formed with or without a recess. A ceramic substrate is provided on the main surface of the baseplate and has a smaller size than the baseplate. A metal layer is provided to cover both of the baseplate and the ceramic substrate. The metal layer has a surface remote from the baseplate and the ceramic substrate is made flat, the baseplate is made of a metal-ceramic composite of a metallic material and a ceramic material, and the metallic material in the composite and the metal layer have different compositions. Thereby, an integral ceramic circuit board, which is resistant to repeated thermal stress and is superior in reliability, can be realized.

摘要翻译： 一种用于安装电子部件的基板，包括具有形成有或不具有凹部的主表面的基板。 陶瓷基板设置在基板的主表面上并且具有比基板更小的尺寸。 提供金属层以覆盖基板和陶瓷基板。 金属层具有远离基板的表面，陶瓷基板平坦，基板由金属材料和陶瓷材料的金属 - 陶瓷复合材料制成，复合材料和金属层中的金属材料具有不同的 组合物。 由此，能够实现耐受重复的热应力且可靠性优异的集成陶瓷电路基板。

公开(公告)号：US20050167792A1

公开(公告)日：2005-08-04

申请号：US11049856

申请日：2005-02-04

申请人： Akira Miyai ,  Yukihiko Nakajima ,  Hideki Hirotsuru ,  Ryozo Nonogaki ,  Takuya Okada ,  Masahiro Ibukiyama

发明人： Akira Miyai ,  Yukihiko Nakajima ,  Hideki Hirotsuru ,  Ryozo Nonogaki ,  Takuya Okada ,  Masahiro Ibukiyama

IPC分类号： H01L23/14 ,  H01L23/15 ,  H01L23/373 ,  H05K1/05 ,  H01L23/495

CPC分类号： H01L23/142 ,  H01L23/15 ,  H01L23/3735 ,  H01L2924/0002 ,  H05K1/053 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49158 ,  Y10T29/49984 ,  Y10T428/24917 ,  H01L2924/00

摘要： A substrate for mounting an electronic component, includes a baseplate having a main surface formed with or without a recess. A ceramic substrate is provided on the main surface of the baseplate and has a smaller size than the baseplate. A metal layer is provided to cover both of the baseplate and the ceramic substrate. The metal layer has a surface remote from the baseplate and the ceramic substrate is made flat, the baseplate is made of a metal-ceramic composite of a metallic material and a ceramic material, and the metallic material in the composite and the metal layer have different compositions. Thus, an integral ceramic circuit board, which is resistant to repeated thermal stress and is superior in reliability can be realized.

摘要翻译： 用于安装电子部件的基板包括具有形成有或不具有凹部的主表面的基板。 陶瓷基板设置在基板的主表面上并且具有比基板更小的尺寸。 提供金属层以覆盖基板和陶瓷基板。 金属层具有远离基板的表面，陶瓷基板平坦，基板由金属材料和陶瓷材料的金属 - 陶瓷复合材料制成，复合材料和金属层中的金属材料具有不同的 组合物。 因此，可以实现耐受重复的热应力并且可靠性优异的整体陶瓷电路板。