摘要:
Provided is a display module cabinet having the slim front frame width and improved design and keeping strength against breakage. In addition, provided is the cabinet having the elegant rear cover, which reduces costs and time in assembling the display device. The cabinet includes a front cover and a rear cover. The front cover includes a front frame portion defining an opening and a side frame portion extended backward from the front frame portion and including a thick portion and a thin portion that are sequentially formed. The rear cover includes a rear portion and a peripheral portion extended forward from the rear portion and including a thick portion and a thin portion that are sequentially formed. A protruding portion is extended backward from the thick portion of the front cover so as to be interposed between the thin portion of the rear cover and the display module. A protruding portion is extended forward from the thick portion of the rear cover so as to be interposed between the thin portion of the front cover and the display module.
摘要:
A stand of display device is provided. The stand of a display device includes a hinge assembly to which a display device is pivotally coupled, a hinge body supporting unit to which the hinge assembly is detachably coupled, and a base unit detachably coupled to the hinge body supporting unit to support the display device on a supporting surface. Accordingly, the display device is made with a relatively small number of parts, and the manufacturing cost can be reduced. And the distribution cast can be reduced.
摘要:
Methods for forming flip chip interconnection, in which the bump interconnect is defined at least in part by an underfill. The underfill includes a material that is thermally cured; that is, raising the temperature of the underfill material can result in progressive curing of the underfill through stages including a gel stage and a fully cured stage. According to the invention, during at least an early stage in the process the semiconductor chip is carried by a thermode, which is employed to control the temperature of the assembly in a specified way. Also, flip chip interconnections and flip chip packages made according to the methods of invention.
摘要:
This present application describes a therapeutic agent for treating acute or chronic graft-versus-host disease using clonal marrow stem cells (cMSCs) as active ingredient.
摘要:
This present application describes a therapeutic agent for treating acute or chronic graft-versus-host disease using clonal marrow stem cells (cMSCs) as active ingredient.
摘要:
This present application describes a therapeutic agent for treating acute or chronic graft-versus-host disease using clonal marrow stem cells (cMSCs) as active ingredient.
摘要:
Methods for forming flip chip interconnection, in which the bump interconnect is defined at least in part by an underfill. The underfill includes a material that is thermally cured; that is, raising the temperature of the underfill material can result in progressive curing of the underfill through stages including a gel stage and a fully cured stage. According to the invention, during at least an early stage in the process the semiconductor chip is carried by a thermode, which is employed to control the temperature of the assembly in a specified way. Also, flip chip interconnections and flip chip packages made according to the methods of invention.
摘要:
Provided are a hinge and a stand for a display device. The hinge includes a rotary body fixed to a display device; a support fixed to a base; a key bracket inserted in the rotary body; a hole formed inside the key bracket; and a rotary shaft inserted to the hole and the support and being a rotation axis of the rotary body. Thus, the hinge and stand may be manufactured at low costs because a small number of components are used. Also, the hinge structure effectively stands against the external vibration because no screw is used during an assembling process, and forming an exterior of the hinge in itself eliminates need to use a separate component for the exterior, thereby reducing the manufacturing costs of the stand.
摘要:
A height adjusting structure for a stand of a display device is provided. The stand includes a guide rail, base, supporting unit, and guide unit. The guide rail is fixedly installed to a rear surface of the display device. The base is supported on a horizontal surface. The supporting unit extends upward from the base. The guide unit is fixedly installed on the supporting unit, to be guided and moved along the guide rail. The height adjusting structure uses a minimum number of parts, is easy to assemble, is highly resistant to external shocks, is able to securely support a display device, operates quieter, and has improved operating reliability.