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    Plastic ball grid array package with integral heatsink
    4.
    发明授权
    Plastic ball grid array package with integral heatsink 有权
    塑料球栅阵列封装，带集成散热片

    公开(公告)号：US08030756B2

    公开(公告)日：2011-10-04

    申请号：US11697433

    申请日：2007-04-06

    申请人： Taekeun Lee ,  Flynn Carson ,  Marcos Karnezos

    发明人： Taekeun Lee ,  Flynn Carson ,  Marcos Karnezos

    IPC分类号： H01L23/10

    CPC分类号： H01L21/565 ,  H01L23/3128 ,  H01L23/3142 ,  H01L23/4334 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

    摘要： A plastic ball grid array semiconductor package employs a metal heat spreader having supporting arms embedded in the molding cap, in which the embedded supporting arms are not directly affixed to the substrate or in which any supporting arm that is affixed to the substrate is affixed using a resilient material such as an elastomeric adhesive. Also, a process for forming the package includes steps of placing the heat spreader in a mold cavity, placing the substrate over the mold cavity such that the die support surface of the substrate contacts the supporting arms of the heat spreader, and injecting the molding material into the cavity to form the molding cap. The substrate is positioned in register over the mold cavity such that as the molding material hardens to form the mold cap the embedded heat spreader becomes fixed in the appropriate position in relation to the substrate.

    摘要翻译： 塑料球栅阵列半导体封装采用金属散热器，其具有嵌入在成型帽中的支撑臂，其中嵌入的支撑臂不直接固定到基板上，或者使用附接到基板的任何支撑臂 弹性粘合剂如弹性材料。 此外，用于形成包装的方法包括以下步骤：将散热器放置在模腔中，将基板放置在模腔上，使得基板的模具支撑表面接触散热器的支撑臂，并且将模制材料 进入模腔以形成模制帽。 基板被定位在模腔上，使得当模制材料硬化以形成模具盖时，嵌入式散热器相对于基板固定在适当的位置。

    Semiconductor multipackage module including tape substrate land grid array package stacked over ball grid array package
    7.
    发明授权
    Semiconductor multipackage module including tape substrate land grid array package stacked over ball grid array package 有权
    半导体多功能封装模块，包括堆叠在球栅阵列封装上的带状衬底焊盘栅格阵列封装

    公开(公告)号：US07589407B2

    公开(公告)日：2009-09-15

    申请号：US11396954

    申请日：2006-04-03

    申请人： Marcos Karnezos

    发明人： Marcos Karnezos

    IPC分类号： H01L23/02

    CPC分类号： H01L23/3128 ,  H01L23/49816 ,  H01L23/49861 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L25/0657 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

    摘要： A single metal layer tape substrate includes a patterned metal layer affixed to a patterned dielectric layer. The dielectric layer is patterned to provide openings exposing lands and bond sites on bond fingers on the land side of the metal layer. The metal layer is patterned to provide circuit traces as appropriate for interconnection with the die (on the die attach side) and with other elements (such as other packages in a multi-package module). Interconnection with a die is made by wire bonding to exposed traces on a die attach side of the metal layer, and bond fingers and lands for access to testing the package are provided on the opposite (land) side of the metal layer. In some embodiments a row of wire bond sites on the land side of adjacent bond fingers is exposed by a common opening in the dielectric layer, providing for a finer pitch interconnect and, accordingly, a higher interconnect density between stacked packages. Also a land grid array package having such a single metal layer tape substrate. Also, a multi-package module including such a single metal layer tape substrate land grid array package stacked over a ball grid array package. Methods for making the substrate are also disclosed.

    摘要翻译： 单个金属层带基板包括固定到图案化电介质层上的图案化金属层。 对电介质层进行图案化以提供在金属层的接地侧上的接合指状物上的接合区和接合位置的开口。 金属层被图案化以提供适合于与管芯（管芯附接侧）和其它元件（例如多封装模块中的其它封装）的互连的电路迹线。 通过引线接合到金属层的管芯附着侧上的暴露的迹线，并且在金属层的相对（平台）侧上设置用于接合测试封装的接合指状物和焊盘的区域来实现与管芯的互连。 在一些实施例中，相邻接合指的陆地侧上的一排引线接合位置被介电层中的公共开口暴露，从而提供更细的间距互连，并因此提供堆叠封装之间的更高互连密度。 还有一种具有这种单一金属层带基片的平面阵列阵列封装。 而且，包括堆叠在球栅阵列封装上的这样的单个金属层带衬底焊盘栅格阵列封装的多封装模块。 还公开了制备基底的方法。