公开(公告)号：US6111628A

公开(公告)日：2000-08-29

申请号：US035063

申请日：1998-03-05

申请人： Motoji Shiota ,  Kiyoshi Inada ,  Hirokazu Yoshida

发明人： Motoji Shiota ,  Kiyoshi Inada ,  Hirokazu Yoshida

IPC分类号： G02F1/1345 ,  G02F1/13 ,  H01L21/60 ,  H05K1/11 ,  H05K3/32

CPC分类号： H01L24/83 ,  G02F1/13452 ,  H01L24/12 ,  H01L24/16 ,  H01L24/28 ,  H01L24/81 ,  H05K3/323 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K1/111 ,  H05K2201/0367 ,  H05K2201/09709 ,  H05K2201/10674

摘要： A liquid crystal display device according to the present invention includes a substrate provided with a line pattern, and a circuit element electrically connected to the line pattern via a conductive layer. The line pattern has at least one bonding pad. The circuit element has at least one electrode pad. The at least one electrode pad has a plurality of bump electrodes provided thereon. The at least one electrode pad is electrically connected to the at least one bonding pad via the conductive layer which is provided between the plurality of bump electrodes and the bonding pad facing the plurality of bump electrodes, where the conductive layer is an insulative material having conductive particles dispersed throughout.

摘要翻译： 根据本发明的液晶显示装置包括具有线图案的基板和经由导电层电连接到线图案的电路元件。 线图案具有至少一个接合垫。 电路元件具有至少一个电极焊盘。 所述至少一个电极焊盘具有设置在其上的多个凸起电极。 所述至少一个电极焊盘经由所述导电层电连接到所述至少一个焊盘，所述导电层设置在所述多个凸起电极和所述焊盘之间，所述焊盘面对所述多个凸块电极，其中所述导电层是具有导电性的绝缘材料 颗粒分散在整个

公开(公告)号：US5608559A

公开(公告)日：1997-03-04

申请号：US350406

申请日：1994-12-06

申请人： Kiyoshi Inada ,  Motoji Shiota ,  Hirokazu Yoshida ,  Yasunobu Tagusa

发明人： Kiyoshi Inada ,  Motoji Shiota ,  Hirokazu Yoshida ,  Yasunobu Tagusa

IPC分类号： G02F1/13 ,  H01L23/498 ,  H05K1/09 ,  H05K3/36 ,  G02F1/1343

CPC分类号： G02F1/13452 ,  H01L23/49866 ,  H01L2224/73204 ,  H05K1/09 ,  H05K3/361

摘要： A display board has wirings on a surface thereof for transmitting a signal received from outside at a peripheral portion of the display board to a display area of the display board. Each wiring has a first conductive film formed of a first material and disposed on the surface of the display board, a second conductive film which is formed of a second material satisfying a condition that a surface of the second conductive film is less prone to oxidation than a surface of the first conductive film and which is disposed on a part of the first conductive film, and a transparent conductive film which is an oxide film and which is disposed on at least the second conductive film. Those first conductive film, second conductive film and transparent film constitute a three-layered structure portion of the wiring.

摘要翻译： 显示板在其表面上具有布线，用于将从显示板的周边部分的外部接收的信号发送到显示板的显示区域。 每个布线具有由第一材料形成并设置在显示板的表面上的第一导电膜，第二导电膜由第二材料形成，第二导电膜满足第二导电膜的表面不易氧化的条件， 所述第一导电膜的表面设置在所述第一导电膜的一部分上，以及透明导电膜，所述透明导电膜为氧化膜，并且设置在至少所述第二导电膜上。 第一导电膜，第二导电膜和透明膜构成布线的三层结构部分。

公开(公告)号：US07005741B2

公开(公告)日：2006-02-28

申请号：US10283212

申请日：2002-10-30

申请人： Atsushi Ono ,  Yasunori Chikawa ,  Makoto Kanda ,  Norimitsu Nie ,  Satoru Tone ,  Motoji Shiota ,  Akio Inohara ,  Hirokazu Yoshida

发明人： Atsushi Ono ,  Yasunori Chikawa ,  Makoto Kanda ,  Norimitsu Nie ,  Satoru Tone ,  Motoji Shiota ,  Akio Inohara ,  Hirokazu Yoshida

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/10 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05572 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/1411 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/05541 ,  H01L2224/05005

摘要： A semiconductor device includes a semiconductor substrate, a plurality of electrode pads aligned on the semiconductor substrate, and a plurality of bump electrodes placed on each electrode pad, wherein the plurality of bump electrodes on the electrode pad are aligned in a direction orthogonal to a direction where the electrode pads are aligned. A manufacturing method of the semiconductor device includes the steps of patterning a photoresist which serves as a bump electrode forming use mask on the semiconductor substrate having formed thereon the electrode pads and forming a bump electrode in a perpendicular straight wall shape to be thinner than the photoresist by plating the bump electrode forming use metal to the electrode pad.

摘要翻译： 半导体器件包括半导体衬底，在半导体衬底上排列的多个电极焊盘和放置在每个电极焊盘上的多个凸起电极，其中电极焊盘上的多个凸起电极在与方向正交的方向上排列 其中电极焊盘对齐。 半导体器件的制造方法包括以下步骤：在其上形成有电极焊盘的半导体衬底上形成用作形成用途掩模的凸块电极的光致抗蚀剂，并且形成具有比光致抗蚀剂更薄的垂直直壁形状的凸块电极 通过将形成使用金属的凸块电极电镀到电极焊盘。

公开(公告)号：US06525422B1

公开(公告)日：2003-02-25

申请号：US08989328

申请日：1997-12-11

申请人： Atsushi Ono ,  Yasunori Chikawa ,  Makoto Kanda ,  Norimitsu Nie ,  Satoru Tone ,  Motoji Shiota ,  Akio Inohara ,  Hirokazu Yoshida

发明人： Atsushi Ono ,  Yasunori Chikawa ,  Makoto Kanda ,  Norimitsu Nie ,  Satoru Tone ,  Motoji Shiota ,  Akio Inohara ,  Hirokazu Yoshida

IPC分类号： H01L2348

CPC分类号： H01L24/10 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05572 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/1411 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/05541 ,  H01L2224/05005

摘要： A semiconductor device includes a semiconductor substrate, a plurality of electrode pads aligned on the semiconductor substrate, and a plurality of bump electrodes placed on each electrode pad, wherein the plurality of bump electrodes on the electrode pad are aligned in a direction orthogonal to a direction where the electrode pads are aligned. A manufacturing method of the semiconductor device includes the steps of patterning a photoresist which serves as a bump electrode forming use mask on the semiconductor substrate having formed thereon the electrode pads and forming a bump electrode in a perpendicular straight wall shape to be thinner than the photoresist by plating the bump electrode forming use metal to the electrode pad.

摘要翻译： 半导体器件包括半导体衬底，在半导体衬底上排列的多个电极焊盘和放置在每个电极焊盘上的多个凸起电极，其中电极焊盘上的多个凸起电极在与方向正交的方向上排列 其中电极焊盘对齐。 半导体器件的制造方法包括以下步骤：在其上形成有电极焊盘的半导体衬底上形成用作形成用途掩模的凸块电极的光致抗蚀剂，并且形成具有比光致抗蚀剂更薄的垂直直壁形状的凸块电极 通过将形成使用金属的凸块电极电镀到电极焊盘。

公开(公告)号：US06933607B2

公开(公告)日：2005-08-23

申请号：US10282054

申请日：2002-10-29

申请人： Atsushi Ono ,  Yasunori Chikawa ,  Makoto Kanda ,  Norimitsu Nie ,  Satoru Tone ,  Motoji Shiota ,  Akio Inohara ,  Hirokazu Yoshida

发明人： Atsushi Ono ,  Yasunori Chikawa ,  Makoto Kanda ,  Norimitsu Nie ,  Satoru Tone ,  Motoji Shiota ,  Akio Inohara ,  Hirokazu Yoshida

IPC分类号： H01L21/60 ,  H01L23/485 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/10 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05572 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/1411 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/05541 ,  H01L2224/05005

摘要： A semiconductor device includes a semiconductor substrate, a plurality of electrode pads aligned on the semiconductor substrate, and a plurality of bump electrodes placed on each electrode pad, wherein the plurality of bump electrodes on the electrode pad are aligned in a direction orthogonal to a direction where the electrode pads are aligned. A manufacturing method of the semiconductor device includes the steps of patterning a photoresist which serves as a bump electrode forming use mask on the semiconductor substrate having formed thereon the electrode pads and forming a bump electrode in a perpendicular straight wall shape to be thinner than the photoresist by plating the bump electrode forming use metal to the electrode pad.

摘要翻译： 半导体器件包括半导体衬底，在半导体衬底上排列的多个电极焊盘和放置在每个电极焊盘上的多个凸起电极，其中电极焊盘上的多个凸起电极在与方向正交的方向上排列 其中电极焊盘对齐。 半导体器件的制造方法包括以下步骤：在其上形成有电极焊盘的半导体衬底上形成用作形成用途掩模的凸块电极的光致抗蚀剂，并且形成具有比光致抗蚀剂更薄的垂直直壁形状的凸块电极 通过将形成使用金属的凸块电极电镀到电极焊盘。

公开(公告)号：US5016986A

公开(公告)日：1991-05-21

申请号：US337155

申请日：1989-04-12

申请人： Akihiro Kawashima ,  Hirokazu Yoshida ,  Yasunobu Tagusa ,  Kiyoshi Inada ,  Hideshi Makita ,  Yoshihisa Dotta

发明人： Akihiro Kawashima ,  Hirokazu Yoshida ,  Yasunobu Tagusa ,  Kiyoshi Inada ,  Hideshi Makita ,  Yoshihisa Dotta

IPC分类号： G02F1/13 ,  G02F1/1345

CPC分类号： G02F1/13452 ,  G02F1/1345

摘要： In a liquid crystal display apparatus, in order to reduce the size and weight, an integrated circuit for driving a liquid crystal is mounted on the glass substrate including the liquid crystal panel either directly or by way of a tape carrier. That is, two glass substrates of liquid crystal panel are mutually overlapped with an offset, and a liquid crystal material is injected into the overlapping regions of the two glass substrates, and liquid crystal display is effected in this region. Further, in the non-overlapping region of the two glass substrates, the integrated circuit is connected either directly or by way of a tape carrier. On the glass substrates, electrodes for varying the optical characteristics of the liquid crystals are provided, and the integrated circuit drives the liquid crystal by controlling the voltage applied to the electrodes. Further transparent insulation films are formed usually formed on the electrodes. The transparent insulation films are also formed in the non-overlapping region of the glass substrates. Since the transparent insulation films are finely patterned by photolithography, they may be selectively formed on the portions where defective insulation is likely to occur between the wiring conductors following the integrated circuit from the electrodes, or between the integrated circuit and the peripheral portion of the connecting part.

公开(公告)号：US09596129B2

公开(公告)日：2017-03-14

申请号：US14379991

申请日：2013-03-18

申请人： Hirokazu Yoshida ,  Masanori Takashima

发明人： Hirokazu Yoshida ,  Masanori Takashima

IPC分类号： H04L12/24 ,  H04Q3/66 ,  H04L12/701 ,  H04L12/717

CPC分类号： H04L41/0654 ,  H04L45/00 ,  H04L45/42 ,  H04Q3/66 ,  H04Q2213/13145 ,  H04Q2213/13166 ,  H04Q2213/13167 ,  H04Q2213/13178

摘要： A communication system includes a communication apparatus that processes a packet according to control information set by a control apparatus; a first control apparatus that controls the communication apparatus by setting the control information in the communication apparatus; and a second control apparatus that operates in concert with the first control apparatus. The first control apparatus transmits information necessary for interoperation between the first and second control apparatuses to the second control apparatus via the communication apparatus.

摘要翻译： 通信系统包括：根据由控制装置设定的控制信息处理分组的通信装置; 第一控制装置，其通过设置通信装置中的控制信息来控制通信装置; 以及与第一控制装置协同工作的第二控制装置。 第一控制装置经由通信装置向第二控制装置发送第一和第二控制装置之间的互操作所必需的信息。

公开(公告)号：US08409375B2

公开(公告)日：2013-04-02

申请号：US12325657

申请日：2008-12-01

申请人： Hirokazu Yoshida ,  Tsukasa Takazawa

发明人： Hirokazu Yoshida ,  Tsukasa Takazawa

IPC分类号： C22F1/08 ,  B22D11/06

CPC分类号： C22C9/06 ,  B22D11/004 ,  B22D11/0602 ,  B22D11/0605 ,  B22D11/1206 ,  C22C9/00 ,  C22C9/04 ,  C22F1/08

摘要： A method of producing a copper alloy wire rod, containing: a casting step for obtaining an ingot by pouring molten copper of a precipitation strengthening copper alloy into a belt-&-wheel-type or twin-belt-type movable mold; and a rolling step for rolling the ingot obtained by the casting step, which steps are continuously performed, wherein an intermediate material of the copper alloy wire rod in the mid course of the rolling step or immediately after the rolling step is quenched.

摘要翻译： 一种铜合金线材的制造方法，其特征在于，包括：通过将析出强化铜合金的熔融铜浇注到带轮式或双带式可动模中获得锭的铸造工序; 以及轧制通过铸造步骤获得的锭的轧制步骤，连续进行这些步骤，其中在轧制步骤的中间阶段或刚刚在轧制步骤之后铜合金线材的中间材料被淬火。

公开(公告)号：US20100186615A1

公开(公告)日：2010-07-29

申请号：US12160937

申请日：2007-01-17

申请人： Ryoi Kodama ,  Eishi Sato ,  Hirokazu Yoshida

发明人： Ryoi Kodama ,  Eishi Sato ,  Hirokazu Yoshida

IPC分类号： B01J7/00 ,  C06D5/00

CPC分类号： B60R21/2644 ,  B60R22/4628 ,  C06B45/00 ,  C06D5/06 ,  F42B3/04 ,  F42B3/103

摘要： A gas generator including a cup filled with gas generant molded articles that generate gas by combustion, and an ignitor on which an ignition agent is disposed. Each gas generant molded article is formed of smokeless powders containing nitrocellulose as its major ingredient. Each gas generant molded article includes an explosive containing a fuel agent containing a guanidine derivative and/or a tetrazole derivative and an oxidizing agent containing a metal nitrate and/or perchlorate. Thus, it is possible to provide a gas generator by which the amount of CO gas generated in operation can be reduced and the combustion speed can easily be controlled, and to provide a pretensioner system provided with the gas generator.

摘要翻译： 一种气体发生器，包括填充有通过燃烧产生气体的气体发生剂模制品的杯，以及设置着火剂的点火器。 每个气体发生剂模制品由含有硝化纤维素作为主要成分的无烟粉末形成。 每个气体发生剂模制品包括含有含有胍衍生物和/或四唑衍生物的燃料的炸药和含有硝酸金属盐和/或高氯酸盐的氧化剂。 因此，可以提供一种气体发生器，通过该气体发生器可以减少在操作中产生的CO气体的量，并且可以容易地控制燃烧速度，并且提供一种具有气体发生器的预紧器系统。

公开(公告)号：US07351476B2

公开(公告)日：2008-04-01

申请号：US10980185

申请日：2004-11-04

申请人： Kenji Kawazu ,  Mika Kai ,  Hirokazu Yoshida ,  Yasuhiro Nakano

发明人： Kenji Kawazu ,  Mika Kai ,  Hirokazu Yoshida ,  Yasuhiro Nakano

IPC分类号： B32B27/40 ,  C08J3/00 ,  C08K3/20 ,  C08L75/00

CPC分类号： C08G18/62 ,  C09D175/04 ,  Y10T428/31551 ,  C08L2666/20 ,  C08L2666/28

摘要： The present invention aims to give a two package curing type polyurethane coating composition which can form a film having soft, wet and dry feelings simultaneously and which maintains general properties such as designing property, film strength, pot life, resistance to scratching and discoloration, resistance to stains with fats and oils and the like, and to provide a coated article with the coating composition. The two package curing type polyurethane coating composition comprises a resin solution containing an acrylic polyol and a curing agent solution containing a polyisocyanate. The resin solution contains urethane resin beads (A) in the amount of 25 to 50 parts by weight and an organic matting agent (B) in the amount of 3 to 10 parts by weight, and the total of (A) and (B) is at least 30 parts by weight in 100 parts by weight of solid contents of the resin solution. And the equivalent ratio of OH groups/NCO groups of the acrylic polyol and the polyisocyanate is in the range of 4.5:1 to 1.5:1.

摘要翻译： 本发明的目的在于提供一种可以同时形成具有柔软，湿润和干燥感觉的膜的两包装固化型聚氨酯涂料组合物，其保持一般性能，例如设计性能，膜强度，适用期，抗划痕和变色性，耐电阻性 用油脂等进行染色，并提供涂布制品与涂料组合物。 两种包装固化型聚氨酯涂料组合物包含含有丙烯酸多元醇的树脂溶液和含有多异氰酸酯的固化剂溶液。 树脂溶液含有25〜50重量份的聚氨酯树脂珠（A）和3〜10重量份的有机消光剂（B），（A）和（B）的总和 在100重量份的树脂溶液的固体成分中为至少30重量份。 丙烯酸多元醇和多异氰酸酯的OH基/ NCO基团的当量比在4.5:1至1.5:1的范围内。