公开(公告)号：US07285831B2

公开(公告)日：2007-10-23

申请号：US11179434

申请日：2005-07-12

申请人： Mu-kyeng Jung ,  Hee-sung Kang ,  Hyuk-ju Ryu ,  Woo-young Chung ,  Kyung-soo Kim

发明人： Mu-kyeng Jung ,  Hee-sung Kang ,  Hyuk-ju Ryu ,  Woo-young Chung ,  Kyung-soo Kim

IPC分类号： H01L29/94

CPC分类号： H01L29/7846 ,  H01L21/823814 ,  H01L21/82385 ,  H01L29/7833 ,  H01L29/7843

摘要： A complementary metal oxide semiconductor (CMOS) device having improved performance includes a first device active region including at least one pair of transistor active regions wherein one transistor active region has a first width and the other transistor active region for forming a contact has a second width, a first gate arranged on the first device active region, a MOS transistor of a first conductivity type including a source/drain region of the first conductivity type formed in the first device active region, a second device active region having a third width greater than the first width, a second gate arranged on the second device active region, and a MOS transistor of a second conductivity type including a source/drain region of the second conductivity type formed in the second device active region.

摘要翻译： 具有改进性能的互补金属氧化物半导体（CMOS）器件包括包括至少一对晶体管有源区的第一器件有源区，其中一个晶体管有源区具有第一宽度，而用于形成接触的另一晶体管有源区具有第二宽度 布置在第一器件有源区上的第一栅极，第一导电类型的MOS晶体管，包括形成在第一器件有源区中的第一导电类型的源极/漏极区域，第三器件有源区域的第三宽度大于 所述第一宽度，布置在所述第二器件有源区上的第二栅极和包括形成在所述第二器件有源区中的所述第二导电类型的源极/漏极区的第二导电类型的MOS晶体管。

公开(公告)号：US20060027876A1

公开(公告)日：2006-02-09

申请号：US11179434

申请日：2005-07-12

申请人： Mu-kyeng Jung ,  Hee-sung Kang ,  Hyuk-ju Ryu ,  Woo-young Chung ,  Kyung-soo Kim

发明人： Mu-kyeng Jung ,  Hee-sung Kang ,  Hyuk-ju Ryu ,  Woo-young Chung ,  Kyung-soo Kim

IPC分类号： H01L29/76

CPC分类号： H01L29/7846 ,  H01L21/823814 ,  H01L21/82385 ,  H01L29/7833 ,  H01L29/7843

摘要： A complementary metal oxide semiconductor (CMOS) device having improved performance includes a first device active region including at least one pair of transistor active regions wherein one transistor active region has a first width and the other transistor active region for forming a contact has a second width, a first gate arranged on the first device active region, a MOS transistor of a first conductivity type including a source/drain region of the first conductivity type formed in the first device active region, a second device active region having a third width greater than the first width, a second gate arranged on the second device active region, and a MOS transistor of a second conductivity type including a source/drain region of the second conductivity type formed in the second device active region.

摘要翻译： 具有改进性能的互补金属氧化物半导体（CMOS）器件包括包括至少一对晶体管有源区的第一器件有源区，其中一个晶体管有源区具有第一宽度，而用于形成接触的另一晶体管有源区具有第二宽度 布置在第一器件有源区上的第一栅极，第一导电类型的MOS晶体管，包括形成在第一器件有源区中的第一导电类型的源极/漏极区域，第三器件有源区域的第三宽度大于 所述第一宽度，布置在所述第二器件有源区上的第二栅极和包括形成在所述第二器件有源区中的所述第二导电类型的源极/漏极区的第二导电类型的MOS晶体管。

公开(公告)号：US20070145452A1

公开(公告)日：2007-06-28

申请号：US11684865

申请日：2007-03-12

申请人： Byung-jun Oh ,  Kyung-tae Lee ,  Mu-kyeng Jung

发明人： Byung-jun Oh ,  Kyung-tae Lee ,  Mu-kyeng Jung

IPC分类号： H01L29/94

CPC分类号： H01L21/76801 ,  H01L21/76838 ,  H01L21/76895 ,  H01L23/5223 ,  H01L27/0688 ,  H01L27/10852 ,  H01L28/40 ,  H01L28/60 ,  H01L2924/0002 ,  H01L2924/00

摘要： Integrated circuit devices include an integrated circuit substrate and a conductive lower electrode layer of a capacitor on the integrated circuit substrate. A dielectric layer is on the lower electrode layer and a conductive upper electrode layer of the capacitor is on the dielectric layer. A first intermetal dielectric layer is on the upper electrode layer. The first intermetal dielectric layer includes at least one via hole extending to the upper electrode layer. A first conductive interconnection layer is on the at least one via hole of the first intermetal dielectric layer. A second intermetal dielectric layer is on the first intermetal dielectric layer. The second intermetal dielectric layer includes at least one via hole extending to the first conductive interconnection layer and at least partially exposing the at least one via hole of the first intermetal dielectric layer. A second conductive interconnection layer is provided in the at least one via hole of the second intermetal dielectric layer that electrically contacts the first conductive interconnection layer.

摘要翻译： 集成电路器件包括集成电路衬底和集成电路衬底上的电容器的导电下电极层。 介电层位于下电极层上，电容器的导电上电极层位于电介质层上。 第一金属间电介质层在上电极层上。 第一金属间电介质层包括延伸到上电极层的至少一个通孔。 第一导电互连层位于第一金属间电介质层的至少一个通孔上。 第二金属间介电层位于第一金属间电介质层上。 第二金属间电介质层包括延伸到第一导电互连层并且至少部分暴露第一金属间介电层的至少一个通孔的至少一个通孔。 第二导电互连层设置在与第一导电互连层电接触的第二金属间电介质层的至少一个通孔中。

公开(公告)号：US07928002B2

公开(公告)日：2011-04-19

申请号：US12396632

申请日：2009-03-03

申请人： Mu-kyeng Jung ,  Sun-jung Lee ,  Ki-chul Park

发明人： Mu-kyeng Jung ,  Sun-jung Lee ,  Ki-chul Park

IPC分类号： H01L21/4763

CPC分类号： H01L21/76895 ,  H01L21/76816 ,  H01L21/76877 ,  H01L23/485 ,  H01L23/53252 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method of forming a wiring layer of a semiconductor device, includes forming a first interlayer insulating layer to have a first thickness corresponding to a part of the thickness of an interlayer insulating layer that is to be formed on a support layer and forming a first contact plug in the first interlayer insulating layer. The method further includes forming a second interlayer insulating layer to have a second thickness on the first contact plug and the first interlayer insulating layer, thereby forming the interlayer insulating layer, wherein the second thickness corresponds to the rest of the thickness of the interlayer insulating layer, and forming a second contact plug connected to the first contact plug in the second interlayer insulating layer, thereby forming a local wiring layer including the first contact plug and the second contact plug.

摘要翻译： 一种形成半导体器件的布线层的方法，包括形成第一层间绝缘层，以具有对应于待形成在支撑层上的层间绝缘层的厚度的一部分的第一厚度并形成第一接触 插入第一层间绝缘层。 该方法还包括在第一接触插塞和第一层间绝缘层上形成具有第二厚度的第二层间绝缘层，从而形成层间绝缘层，其中第二厚度对应于层间绝缘层的其余厚度 并且形成与所述第二层间绝缘层中的所述第一接触插塞连接的第二接触插塞，由此形成包括所述第一接触插塞和所述第二接触插塞的局部布线层。

公开(公告)号：US07229875B2

公开(公告)日：2007-06-12

申请号：US10688077

申请日：2003-10-16

申请人： Kyoung-woo Lee ,  Wan-jae Park ,  Jeong-hoon Ahn ,  Kyung-tae Lee ,  Mu-kyeng Jung ,  Yong-jun Lee ,  Il-goo Kim ,  Soo-geun Lee

发明人： Kyoung-woo Lee ,  Wan-jae Park ,  Jeong-hoon Ahn ,  Kyung-tae Lee ,  Mu-kyeng Jung ,  Yong-jun Lee ,  Il-goo Kim ,  Soo-geun Lee

IPC分类号： H01L21/8234

CPC分类号： H01L28/40 ,  H01L23/5222 ,  H01L2924/0002 ,  H01L2924/00

摘要： Embodiments of the invention include a MIM capacitor having a high capacitance with improved manufacturability. Such a capacitor includes an upper electrode, a lower electrode, and a dielectric layer that is intermediate the upper and the lower electrodes. A first voltage can be applied to the upper electrode and a second voltage, which is different from the first voltage, can be applied to the lower electrode. A wire layer, through which the first voltage is applied to the upper electrode, is located in the same level as or in a lower level than the lower electrode.

摘要翻译： 本发明的实施例包括具有高电容且具有改进的可制造性的MIM电容器。 这种电容器包括上电极，下电极和位于上电极和下电极之间的电介质层。 可以将第一电压施加到上电极，并且可以将不同于第一电压的第二电压施加到下电极。 将第一电压施加到上电极的线层位于与下电极相同的水平或比下电极低的水平位置。

公开(公告)号：US07679123B2

公开(公告)日：2010-03-16

申请号：US11684865

申请日：2007-03-12

申请人： Byung-jun Oh ,  Kyung-tae Lee ,  Mu-kyeng Jung

发明人： Byung-jun Oh ,  Kyung-tae Lee ,  Mu-kyeng Jung

IPC分类号： H01L29/94

CPC分类号： H01L21/76801 ,  H01L21/76838 ,  H01L21/76895 ,  H01L23/5223 ,  H01L27/0688 ,  H01L27/10852 ,  H01L28/40 ,  H01L28/60 ,  H01L2924/0002 ,  H01L2924/00

摘要： Integrated circuit devices include an integrated circuit substrate and a conductive lower electrode layer of a capacitor on the integrated circuit substrate. A dielectric layer is on the lower electrode layer and a conductive upper electrode layer of the capacitor is on the dielectric layer. A first intermetal dielectric layer is on the upper electrode layer. The first intermetal dielectric layer includes at least one via hole extending to the upper electrode layer. A first conductive interconnection layer is on the at least one via hole of the first intermetal dielectric layer. A second intermetal dielectric layer is on the first intermetal dielectric layer. The second intermetal dielectric layer includes at least one via hole extending to the first conductive interconnection layer and at least partially exposing the at least one via hole of the first intermetal dielectric layer. A second conductive interconnection layer is provided in the at least one via hole of the second intermetal dielectric layer that electrically contacts the first conductive interconnection layer.

摘要翻译： 集成电路器件包括集成电路衬底和集成电路衬底上的电容器的导电下电极层。 介电层位于下电极层上，电容器的导电上电极层位于电介质层上。 第一金属间电介质层在上电极层上。 第一金属间电介质层包括延伸到上电极层的至少一个通孔。 第一导电互连层位于第一金属间电介质层的至少一个通孔上。 第二金属间介电层位于第一金属间电介质层上。 第二金属间电介质层包括延伸到第一导电互连层并且至少部分暴露第一金属间介电层的至少一个通孔的至少一个通孔。 第二导电互连层设置在与第一导电互连层电接触的第二金属间电介质层的至少一个通孔中。

公开(公告)号：US20070184610A1

公开(公告)日：2007-08-09

申请号：US11733711

申请日：2007-04-10

申请人： Kyoung-woo Lee ,  Wan-jae Park ,  Jeong-hoon Ahn ,  Kyung-tae Lee ,  Mu-kyeng Jung ,  Yong-jun Lee ,  Il-goo Kim ,  Soo-geun Lee

发明人： Kyoung-woo Lee ,  Wan-jae Park ,  Jeong-hoon Ahn ,  Kyung-tae Lee ,  Mu-kyeng Jung ,  Yong-jun Lee ,  Il-goo Kim ,  Soo-geun Lee

IPC分类号： H01L21/8242 ,  H01L21/20

CPC分类号： H01L28/40 ,  H01L23/5222 ,  H01L2924/0002 ,  H01L2924/00

摘要： Embodiments of the invention include a MIM capacitor that has a high capacitance that can be manufactured without the problems that affected the prior art. Such a capacitor includes an upper electrode, a lower electrode, and a dielectric layer that is intermediate the upper and the lower electrodes. A first voltage can be applied to the upper electrode and a second voltage, which is different from the first voltage, can be applied to the lower electrode. A wire layer, through which the first voltage is applied to the upper electrode, is located in the same level as or in a lower level than the lower electrode.

公开(公告)号：US07208791B2

公开(公告)日：2007-04-24

申请号：US11168126

申请日：2005-06-28

申请人： Byung-jun Oh ,  Kyung-tae Lee ,  Mu-kyeng Jung

发明人： Byung-jun Oh ,  Kyung-tae Lee ,  Mu-kyeng Jung

IPC分类号： H01L27/108

CPC分类号： H01L21/76801 ,  H01L21/76838 ,  H01L21/76895 ,  H01L23/5223 ,  H01L27/0688 ,  H01L27/10852 ,  H01L28/40 ,  H01L28/60 ,  H01L2924/0002 ,  H01L2924/00

摘要： Integrated circuit devices include an integrated circuit substrate and a conductive lower electrode layer of a capacitor on the integrated circuit substrate. A dielectric layer is on the lower electrode layer and a conductive upper electrode layer of the capacitor is on the dielectric layer. A first intermetal dielectric layer is on the upper electrode layer. The first intermetal dielectric layer includes at least one via hole extending to the upper electrode layer. A first conductive interconnection layer is on the at least one via hole of the first intermetal dielectric layer. A second intermetal dielectric layer is on the first intermetal dielectric layer. The second intermetal dielectric layer includes at least one via hole extending to the first conductive interconnection layer and at least partially exposing the at least one via hole of the first intermetal dielectric layer. A second conductive interconnection layer is provided in the at least one via hole of the second intermetal dielectric layer that electrically contacts the first conductive interconnection layer.

摘要翻译： 集成电路器件包括集成电路衬底和集成电路衬底上的电容器的导电下电极层。 介电层位于下电极层上，电容器的导电上电极层位于电介质层上。 第一金属间电介质层在上电极层上。 第一金属间电介质层包括延伸到上电极层的至少一个通孔。 第一导电互连层位于第一金属间电介质层的至少一个通孔上。 第二金属间介电层位于第一金属间电介质层上。 第二金属间电介质层包括延伸到第一导电互连层并且至少部分暴露第一金属间介电层的至少一个通孔的至少一个通孔。 第二导电互连层设置在与第一导电互连层电接触的第二金属间电介质层的至少一个通孔中。

公开(公告)号：US20050247968A1

公开(公告)日：2005-11-10

申请号：US11168126

申请日：2005-06-28

申请人： Byung-jun Oh ,  Kyung-tae Lee ,  Mu-kyeng Jung

发明人： Byung-jun Oh ,  Kyung-tae Lee ,  Mu-kyeng Jung

IPC分类号： H01L21/768 ,  H01L21/02 ,  H01L21/3205 ,  H01L21/822 ,  H01L23/52 ,  H01L23/522 ,  H01L27/00 ,  H01L27/04 ,  H01L27/06 ,  H01L27/08 ,  H01L27/108

CPC分类号： H01L21/76801 ,  H01L21/76838 ,  H01L21/76895 ,  H01L23/5223 ,  H01L27/0688 ,  H01L27/10852 ,  H01L28/40 ,  H01L28/60 ,  H01L2924/0002 ,  H01L2924/00

摘要： Integrated circuit devices include an integrated circuit substrate and a conductive lower electrode layer of a capacitor on the integrated circuit substrate. A dielectric layer is on the lower electrode layer and a conductive upper electrode layer of the capacitor is on the dielectric layer. A first intermetal dielectric layer is on the upper electrode layer. The first intermetal dielectric layer includes at least one via hole extending to the upper electrode layer. A first conductive interconnection layer is on the at least one via hole of the first intermetal dielectric layer. A second intermetal dielectric layer is on the first intermetal dielectric layer. The second intermetal dielectric layer includes at least one via hole extending to the first conductive interconnection layer and at least partially exposing the at least one via hole of the first intermetal dielectric layer. A second conductive interconnection layer is provided in the at least one via hole of the second intermetal dielectric layer that electrically contacts the first conductive interconnection layer.

摘要翻译： 集成电路器件包括集成电路衬底和集成电路衬底上的电容器的导电下电极层。 介电层位于下电极层上，电容器的导电上电极层位于电介质层上。 第一金属间电介质层在上电极层上。 第一金属间电介质层包括延伸到上电极层的至少一个通孔。 第一导电互连层位于第一金属间电介质层的至少一个通孔上。 第二金属间介电层位于第一金属间电介质层上。 第二金属间电介质层包括延伸到第一导电互连层并且至少部分暴露第一金属间介电层的至少一个通孔的至少一个通孔。 第二导电互连层设置在与第一导电互连层电接触的第二金属间电介质层的至少一个通孔中。

公开(公告)号：US06940114B2

公开(公告)日：2005-09-06

申请号：US10657490

申请日：2003-09-08

申请人： Byung-jun Oh ,  Kyung-tae Lee ,  Mu-kyeng Jung

发明人： Byung-jun Oh ,  Kyung-tae Lee ,  Mu-kyeng Jung

IPC分类号： H01L21/768 ,  H01L21/02 ,  H01L21/3205 ,  H01L21/822 ,  H01L23/52 ,  H01L23/522 ,  H01L27/00 ,  H01L27/04 ,  H01L27/06 ,  H01L27/08 ,  H01L27/108

CPC分类号： H01L21/76801 ,  H01L21/76838 ,  H01L21/76895 ,  H01L23/5223 ,  H01L27/0688 ,  H01L27/10852 ,  H01L28/40 ,  H01L28/60 ,  H01L2924/0002 ,  H01L2924/00

摘要： Integrated circuit devices include an integrated circuit substrate and a conductive lower electrode layer of a Metal-Insulator-Metal (MIM) capacitor on the integrated circuit substrate. A dielectric layer is on the lower electrode layer and a conductive upper electrode layer of the MIM capacitor is on the dielectric layer. A first intermetal dielectric layer is on the upper electrode layer. The first intermetal dielectric layer includes at least one via hole extending to the upper electrode layer. A first conductive interconnection layer is on the at least one via hole of the first intermetal dielectric layer. A second intermetal dielectric layer is on the first intermetal dielectric layer. The second intermetal dielectric layer includes at least one via hole extending to the first conductive interconnection layer and at least partially exposing the at least one via hole of the first intermetal dielectric layer. A second conductive interconnection layer is provided in the at least one via hole of the second intermetal dielectric layer that electrically contacts the first conductive interconnection layer.

摘要翻译： 集成电路器件包括在集成电路衬底上的集成电路衬底和金属 - 绝缘体 - 金属（MIM）电容器的导电下电极层。 电介质层位于下电极层上，MIM电容器的导电上电极层位于电介质层上。 第一金属间电介质层在上电极层上。 第一金属间电介质层包括延伸到上电极层的至少一个通孔。 第一导电互连层位于第一金属间电介质层的至少一个通孔上。 第二金属间电介质层位于第一金属间电介质层上。 第二金属间电介质层包括延伸到第一导电互连层并且至少部分暴露第一金属间介电层的至少一个通孔的至少一个通孔。 第二导电互连层设置在与第一导电互连层电接触的第二金属间电介质层的至少一个通孔中。