公开(公告)号：US08975743B2

公开(公告)日：2015-03-10

申请号：US13776752

申请日：2013-02-26

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoichi Moriya ,  Tetsuo Kanamori ,  Yukihiro Yagi ,  Yasutaka Sugimoto ,  Takahiro Takada

IPC: H01L23/34 ,  H01L23/373 ,  H01L23/538 ,  H01L25/07 ,  H01L25/16 ,  H01L23/00

Abstract: In a semiconductor device including a semiconductor element that produces heat and a substrate on which the semiconductor element is mounted, functions of the substrate are divided between a heat dissipating substrate and a wiring substrate. The heat dissipating substrate has a relatively high thermal conductivity, and includes principal surfaces defined by electric insulators, one of which is provided with an outer conductor located thereon. The wiring substrate is mounted on the upper principal surface of the heat dissipating substrate, has a thermal conductivity lower than that of the heat dissipating substrate, and includes a wiring conductor made mainly of silver or copper and located inside the wiring substrate, the wiring conductor being electrically connected to the outer conductor. The semiconductor element is mounted on the upper principal surface of the heat dissipating substrate and disposed in a through hole of the wiring substrate.

公开(公告)号：US09030005B2

公开(公告)日：2015-05-12

申请号：US13776752

申请日：2013-02-26

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoichi Moriya ,  Tetsuo Kanamori ,  Yukihiro Yagi ,  Yasutaka Sugimoto ,  Takahiro Takada

IPC: H01L23/34 ,  H01L23/373 ,  H01L23/538 ,  H01L25/07 ,  H01L25/16 ,  H01L23/00

CPC classification number: H01L23/34 ,  H01L23/3735 ,  H01L23/5383 ,  H01L23/5389 ,  H01L24/06 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/072 ,  H01L25/16 ,  H01L2224/32225 ,  H01L2224/48101 ,  H01L2224/48157 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/09701 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: In a semiconductor device including a semiconductor element that produces heat and a substrate on which the semiconductor element is mounted, functions of the substrate are divided between a heat dissipating substrate and a wiring substrate. The heat dissipating substrate has a relatively high thermal conductivity, and includes principal surfaces defined by electric insulators, one of which is provided with an outer conductor located thereon. The wiring substrate is mounted on the upper principal surface of the heat dissipating substrate, has a thermal conductivity lower than that of the heat dissipating substrate, and includes a wiring conductor made mainly of silver or copper and located inside the wiring substrate, the wiring conductor being electrically connected to the outer conductor. The semiconductor element is mounted on the upper principal surface of the heat dissipating substrate and disposed in a through hole of the wiring substrate.

Abstract translation: 在包括产生热的半导体元件的半导体器件和其上安装半导体元件的衬底之间，衬底的功能在散热衬底和布线衬底之间被划分。 散热基板具有相对高的导热性，并且包括由绝缘体限定的主表面，其中一个被设置有位于其上的外部导体。 布线基板安装在散热基板的上主面上，其导热系数低于散热基板的导热系数，并且包括主要由银或铜制成并位于布线基板内的布线导体，布线导体 电连接到外导体。 半导体元件安装在散热基板的上主表面上，并布置在布线基板的通孔中。

公开(公告)号：US08754742B2

公开(公告)日：2014-06-17

申请号：US13627013

申请日：2012-09-26

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yusuke Otsuka ,  Yuichi Iida ,  Kazuo Kishida ,  Takahiro Takada

IPC: H01C1/012 ,  H01C17/30 ,  H01C7/00 ,  H05K3/46 ,  H01L23/13 ,  H01C17/075 ,  H01L23/538 ,  H01L23/66 ,  H01C1/14 ,  H01C17/00

CPC classification number: H01C17/30 ,  H01C1/14 ,  H01C7/003 ,  H01C17/00 ,  H01C17/075 ,  H01L23/13 ,  H01L23/5385 ,  H01L23/66 ,  H01L2924/0002 ,  H05K1/167 ,  H05K3/4629 ,  H01L2924/00

Abstract: A multilayer ceramic substrate includes a ceramic laminated body including a plurality of ceramic layers stacked on each other, a resistor, and a resistor connecting conductor with a portion overlapping the resistor and an overcoat layer that covers the resistor located on a principal surface of the ceramic laminated body. An overcoat layer is made relatively thick during firing, thereby making cracks less likely to be caused, and after the firing step, the thickness of the overcoat layer is reduced by physically scraping down the surface of the overcoat layer, thereby reducing the trimming time. In the overcoat layer, a region that covers a portion in which a resistor overlaps a resistor connecting conductor is thicker than a region that covers the other portion.

Abstract translation: 多层陶瓷基板包括陶瓷层叠体，陶瓷层叠体包括彼此堆叠的多个陶瓷层，电阻器和电阻器连接导体以及与该电阻器重叠的部分，以及覆盖位于陶瓷的主表面上的电阻器的外涂层 层压体。 在焙烧时使外涂层相对较厚，从而使得难以产生裂纹，并且在烧制步骤之后，通过物理地刮擦外涂层的表面来降低外涂层的厚度，从而减少修整时间。 在覆盖层中，覆盖电阻器与电阻器连接导体重叠的部分的区域比覆盖另一部分的区域厚。

公开(公告)号：US08980028B2

公开(公告)日：2015-03-17

申请号：US13630049

申请日：2012-09-28

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoichi Moriya ,  Tsuyoshi Katsube ,  Yuki Takemori ,  Tetsuo Kanamori ,  Yasutaka Sugimoto ,  Takahiro Takada

IPC: H01L23/15 ,  B32B18/00 ,  C04B35/117 ,  C04B35/16 ,  C04B35/195 ,  C04B37/02 ,  C23C24/08 ,  C23C28/04 ,  H01L23/14 ,  H01L23/498 ,  H05K1/05

CPC classification number: H01L23/15 ,  B32B18/00 ,  C04B35/117 ,  C04B35/16 ,  C04B35/195 ,  C04B37/021 ,  C04B37/025 ,  C04B2235/3203 ,  C04B2235/3206 ,  C04B2235/3208 ,  C04B2235/3215 ,  C04B2235/3217 ,  C04B2235/3262 ,  C04B2235/3409 ,  C04B2235/365 ,  C04B2235/6025 ,  C04B2235/652 ,  C04B2235/656 ,  C04B2235/6582 ,  C04B2235/77 ,  C04B2237/10 ,  C04B2237/341 ,  C04B2237/407 ,  C04B2237/56 ,  C04B2237/60 ,  C04B2237/704 ,  C04B2237/708 ,  C23C24/082 ,  C23C28/04 ,  H01L23/142 ,  H01L23/49822 ,  H01L23/49894 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/09701 ,  H01L2924/15192 ,  H05K1/053 ,  Y10T156/10 ,  Y10T428/2495 ,  Y10T428/265

Abstract: In a metal base substrate with a low-temperature sintering ceramic layer located on a copper substrate, bonding reliability is increased between the copper substrate and the low-temperature sintering ceramic layer. A raw laminated body is prepared by stacking, on a surface of a copper substrate, a low-temperature sintering ceramic green layer including a low-temperature sintering ceramic material containing about 10 mol % to about 40 mol % of barium in terms of BaO and about 40 mol % to about 80 mol % of silicon in terms of SiO2, and this raw laminated body is subjected to firing at a temperature at which the low-temperature sintering ceramic green layer is sintered. In the thus obtained metal base substrate, a glass layer composed of Cu—Ba—Si based glass with a thickness of about 1 μm to about 5 μm is formed between the metal substrate and the low-temperature sintering ceramic layer.

Abstract translation: 在具有位于铜基板上的低温烧结陶瓷层的金属基底中，在铜基底和低温烧结陶瓷层之间的粘合可靠性提高。 通过在铜基材的表面上层叠包含以BaO换算含有约10mol％至约40mol％的钡的低温烧结陶瓷材料的低温烧结陶瓷生坯层来制备原料层压体，以及 约40mol％至约80mol％的SiO 2，并将该原料层压体在低温烧结陶瓷生坯层烧结的温度下进行烧制。 在这样得到的金属基底基板上，在金属基板和低温烧结陶瓷层之间形成厚度约1μm〜5μm的由Cu-Ba-Si系玻璃构成的玻璃层。

公开(公告)号：US09044728B2

公开(公告)日：2015-06-02

申请号：US13762418

申请日：2013-02-08

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Tetsuo Kanamori ,  Yukihiro Yagi ,  Takahiro Takada ,  Toshiyuki Miyamoto

IPC: B01J19/08 ,  C01B13/11

CPC classification number: B01J19/087 ,  C01B13/11 ,  C01B2201/10 ,  C01B2201/22 ,  C01B2201/32 ,  C01B2201/62 ,  C01B2201/64

Abstract: An ozone generating element includes a laminated body including stacked dielectric layers. A discharge electrode is provided on a first of the dielectric layers. An induction electrode is provided on a second of the dielectric layers that is opposed to the discharge electrode with the first dielectric layer interposed therebetween. A protective layer is arranged on the first dielectric layer so as to cover the discharge electrode, and includes a glass ceramic.

Abstract translation: 臭氧发生元件包括层叠体，该叠层体具有叠层的电介质层。 放电电极设置在第一介电层上。 感应电极设置在与放电电极相对的第二介电层上，其间介于第一介质层之间。 在第一电介质层上设置保护层以覆盖放电电极，并且包括玻璃陶瓷。