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    Ceramic electronic component and method for producing ceramic electronic component
    2.
    发明授权
    Ceramic electronic component and method for producing ceramic electronic component 有权

    公开(公告)号：US11011306B2

    公开(公告)日：2021-05-18

    申请号：US16161313

    申请日：2018-10-16

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Hiromichi Tanaka ,  Yuki Takemori

    IPC: H01G4/012 ,  H01G4/30 ,  H01G4/008 ,  H01G4/12 ,  H01G4/232

    Abstract: A ceramic electronic component that includes a ceramic insulator and an inner conductor layer disposed in the ceramic insulator. The inner conductor layer contains a metal and a metal oxide containing at least one first metal element selected from Ti, Mg, and Zr, first insulator regions that contain at least one second metal element selected from Ti, Mg, and Zr and that are discontinuous from the ceramic insulator and present in a dispersed state in the inner conductor layer, and a second insulator region containing a third metal element the same as the second metal element contained in the first insulator regions and present around the inner conductor layer.

    Multilayer ceramic substrate
    4.
    发明授权
    Multilayer ceramic substrate 有权

    公开(公告)号：US10485099B2

    公开(公告)日：2019-11-19

    申请号：US16170427

    申请日：2018-10-25

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Takahiro Oka ,  Yoshitake Yamagami ,  Yuki Takemori ,  Kazuo Kishida ,  Hiromichi Kawakami

    IPC: H05K1/02 ,  H05K1/03 ,  H05K3/46 ,  H05K1/11

    Abstract: A multilayer ceramic substrate according to the present invention includes a plurality of base layers that are laminated containing a low-temperature co-fired ceramic material, a plurality of first constraint layers which contain a metal oxide not completely sintered at the sintering temperature of the low-temperature co-fired ceramic material and which are located between the base layers, and a protective layer which contains the metal oxide and which is in contact with an outermost base layer of the plurality of base layers in the lamination direction, and wherein X1>X2, where X1 is a content of the metal oxide in a surface section of the protective layer and X2 is a content of the metal oxide in a boundary section of the protective layer that is in contact with the outermost base layer.

    Ceramic electronic component
    5.
    发明授权
    Ceramic electronic component 有权

    公开(公告)号：US11641712B2

    公开(公告)日：2023-05-02

    申请号：US16903699

    申请日：2020-06-17

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Yuki Takemori

    IPC: H05K1/11 ,  H05K1/03 ,  H05K3/28 ,  B32B3/26 ,  B32B15/04 ,  B32B3/30 ,  B32B9/00 ,  B32B9/04 ,  H05K1/02 ,  H05K3/34 ,  H05K3/46 ,  H05K3/24

    Abstract: A ceramic electronic component that includes an electronic component body having a superficial base ceramic layer; a surface electrode on a surface of the electronic component body; and a covering ceramic layer covering a peripheral section of the surface electrode. The peripheral section of the surface electrode that is covered by the covering ceramic layer has a thin portion located on a central side of the surface electrode and which is thinner than a central section of the surface electrode, and a width of the thin portion is 20% or more of a width of the peripheral section of the surface electrode that is covered by the covering ceramic layer.

    CERAMIC ELECTRONIC COMPONENT
    6.
    发明申请
    CERAMIC ELECTRONIC COMPONENT 审中-公开

    公开(公告)号：US20200315006A1

    公开(公告)日：2020-10-01

    申请号：US16903699

    申请日：2020-06-17

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Yuki Takemori

    IPC: H05K1/03 ,  H05K1/11 ,  H05K3/28 ,  H05K3/34 ,  H05K3/46

    Abstract: A ceramic electronic component that includes an electronic component body having a superficial base ceramic layer; a surface electrode on a surface of the electronic component body; and a covering ceramic layer covering a peripheral section of the surface electrode. The peripheral section of the surface electrode that is covered by the covering ceramic layer has a thin portion located on a central side of the surface electrode and which is thinner than a central section of the surface electrode, and a width of the thin portion is 20% or more of a width of the peripheral section of the surface electrode that is covered by the covering ceramic layer.

    CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR
    7.
    发明申请
    CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR 审中-公开
    陶瓷电子元件及其制造方法

    公开(公告)号：US20140362491A1

    公开(公告)日：2014-12-11

    申请号：US14282057

    申请日：2014-05-20

    Applicant: MURATA MANUFACTURING CO., LTD.

    Inventor： Hiroshige Adachi ,  Kazuhiro Kaneko ,  Yuki Takemori

    IPC: H01G4/12 ,  H01G4/40 ,  H01F27/40 ,  C04B35/64

    CPC classification number: H01G4/40 ,  C03C3/064 ,  C03C3/091 ,  C03C10/0036 ,  H01F2017/0026 ,  H01G4/105 ,  H01G4/129 ,  H01G4/30

    Abstract: When firing a composite substrate structured to have stacked ceramic dielectric and ceramic magnetic layers, a glass constituent is diffused from the ceramic dielectric layer to the ceramic magnetic layer to, as a result, decrease sinterability of the ceramic dielectric layer or degrade insulation resistance characteristics thereof. When the ceramic dielectric includes 40 to 80% by weight of glass formed from 35 to 50% by weight of CaO, 0 to 20% by weight of Al2O3, 5 to 20% by weight of B2O3, and 30 to 50% by weight of SiO2; and 20 to 60% by weight of at least of alumina, forsterite, and/or quartz, this problem is avoided. The dielectric composition increases the viscosity of the glass, and suppresses constituent diffusion from the ceramic dielectric layer to the ceramic magnetic layer, because the glass is partially crystallized to form wollastonite during firing.

    Abstract translation: 当烧结构造为具有堆叠的陶瓷电介质和陶瓷磁性层的复合衬底时，玻璃成分从陶瓷电介质层扩散到陶瓷磁性层，结果降低陶瓷电介质层的烧结性或降低其绝缘电阻特性 。 当陶瓷电介质包含40〜80重量％的由35〜50重量％的CaO，0〜20重量％的Al 2 O 3，5〜20重量％的B 2 O 3和30〜50重量％ SiO2; 和20〜60重量％的至少氧化铝，镁橄榄石和/或石英，避免了这个问题。 电介质组合物增加了玻璃的粘度，并且抑制了从陶瓷介电层到陶瓷磁性层的组成扩散，因为玻璃在焙烧期间被部分结晶以形成硅灰石。

    Ceramic electronic component
    8.
    发明授权
    Ceramic electronic component 有权

    公开(公告)号：US10729009B2

    公开(公告)日：2020-07-28

    申请号：US16174623

    申请日：2018-10-30

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Yuki Takemori

    IPC: H05K1/11 ,  H05K1/03 ,  H05K3/28 ,  H05K3/34 ,  H05K3/46 ,  H05K3/24

    Abstract: A ceramic electronic component that includes an electronic component body having a superficial base ceramic layer, a surface electrode on a surface of the electronic component body, and a covering ceramic layer covering a peripheral section of the surface electrode. The peripheral section of the surface electrode that is covered by the covering ceramic layer has an opening or a thin portion.

    MULTILAYER CERAMIC SUBSTRATE
    9.
    发明申请
    MULTILAYER CERAMIC SUBSTRATE 审中-公开

    公开(公告)号：US20200045811A1

    公开(公告)日：2020-02-06

    申请号：US16596981

    申请日：2019-10-09

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Takahiro Oka ,  Yoshitake Yamagami ,  Yuki Takemori ,  Kazuo Kishida ,  Hiromichi Kawakami

    IPC: H05K1/02 ,  H05K3/46 ,  H05K1/03

    Abstract: A multilayer ceramic substrate according to the present invention includes a plurality of base layers that are laminated containing a low-temperature co-fired ceramic material, a plurality of first constraint layers which contain a metal oxide not completely sintered at the sintering temperature of the low-temperature co-fired ceramic material and which are located between the base layers, and a protective layer which contains the metal oxide and which is in contact with an outermost base layer of the plurality of base layers in the lamination direction, and wherein X1>X2, where X1 is a content of the metal oxide in a surface section of the protective layer and X2 is a content of the metal oxide in a boundary section of the protective layer that is in contact with the outermost base layer.

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