ACOUSTIC WAVE DEVICE
    1.
    发明申请

    公开(公告)号:US20210111697A1

    公开(公告)日:2021-04-15

    申请号:US17102468

    申请日:2020-11-24

    Abstract: An acoustic wave device includes a support substrate and first and second resonant sections adjacent to each other on the support substrate. Each of the first and second resonant sections includes a piezoelectric thin film, an IDT electrode on the piezoelectric thin film, and a support layer surrounding the piezoelectric thin film in a plan view of the acoustic wave device. The support layer has a different linear expansion coefficient from the piezoelectric thin film. The piezoelectric thin film in the first resonant section and the piezoelectric thin film in the second resonant section are divided by the support layer between the resonant section and the resonant section.

    ACOUSTIC WAVE DEVICE
    2.
    发明公开

    公开(公告)号:US20240007076A1

    公开(公告)日:2024-01-04

    申请号:US18369893

    申请日:2023-09-19

    CPC classification number: H03H9/02228 H03H9/02015 H03H9/173 H03H9/131

    Abstract: An acoustic wave device includes a piezoelectric substrate including a support including a support substrate and a piezoelectric layer on the support, a functional electrode on the piezoelectric layer, at least one support, and a lid. One of the at least one support surrounds the functional electrode on the piezoelectric substrate and the lid is provided on the support. A first cavity is provided in the support. The first cavity overlaps at least a portion of the functional electrode in plan view. A second cavity is surrounded by the piezoelectric substrate, a support provided between the piezoelectric substrate and the lid, and the lid. A height of the first cavity is greater than a height of the second cavity.

    ACOUSTIC WAVE DEVICE, ACOUSTIC WAVE DEVICE PACKAGE, RADIO-FREQUENCY FRONT-END CIRCUIT, AND COMMUNICATION DEVICE

    公开(公告)号:US20230019446A1

    公开(公告)日:2023-01-19

    申请号:US17945139

    申请日:2022-09-15

    Abstract: An acoustic wave device includes a silicon oxide film, a piezoelectric body, and an interdigital transducer electrode laminated on a support substrate made of silicon. Where a wave length that is determined by an electrode finger pitch of the interdigital transducer electrode is λ, a thickness of the support substrate is greater than or equal to about 3λ. An acoustic velocity of the first higher mode that propagates through the piezoelectric body is an acoustic velocity VSi=(V1)1/2 of bulk waves that propagate in the support substrate, which is determined by V1 out of solutions V1, V2, and V3 of x derived from the mathematical expression Ax3+Bx2+Cx+D=0, or higher than VSi.

    ACOUSTIC WAVE DEVICE AND FILTER DEVICE

    公开(公告)号:US20220216842A1

    公开(公告)日:2022-07-07

    申请号:US17704859

    申请日:2022-03-25

    Abstract: An acoustic wave device includes a piezoelectric layer, at least one pair of electrodes adjacent to each other, and an additional film. The piezoelectric layer is made of lithium niobate or lithium tantalate, and includes first and second opposing principal surfaces. The at least one pair of electrodes is located on the first principal surface of the piezoelectric layer. The additional film is located on the piezoelectric layer or either one or both of the electrodes so as to overlap, in plan view, either one or both of areas in which the electrodes are located and an area between the electrodes. When d represents a thickness of the piezoelectric layer and p represents a center-to-center distance between the electrodes, d/p is equal to or less than about 0.5.

    ACOUSTIC WAVE DEVICE
    5.
    发明申请

    公开(公告)号:US20210399711A1

    公开(公告)日:2021-12-23

    申请号:US17465906

    申请日:2021-09-03

    Abstract: An acoustic wave device includes a piezoelectric substrate, an interdigital transducer electrode on the piezoelectric substrate, and reflectors. The interdigital transducer electrode includes first and second busbars including first and second cavities in a first direction, and first and second edge regions and first and second gap regions. The first and second edge regions include low acoustic velocity regions. Regions in which the first and second cavities are provided include high acoustic velocity regions. The reflector includes first and second reflector busbars and first reflection electrode fingers each including a second end portion that faces the second reflector busbar. The first reflection electrode fingers overlap the entire or substantially the entire second gap region when viewed in the first direction.

    ELECTRONIC COMPONENT
    6.
    发明申请

    公开(公告)号:US20200295731A1

    公开(公告)日:2020-09-17

    申请号:US16892332

    申请日:2020-06-04

    Abstract: An electronic component includes a support member, a piezoelectric film, and an interdigital transducer. The support member includes silicon as a primary component. The piezoelectric film is provided directly or indirectly on the support member. The interdigital transducer includes a plurality of electrode fingers. The plurality of electrode fingers are provided side by side separately from each other. The interdigital transducer is provided on the principal surface of the piezoelectric film. The film thickness of the piezoelectric film is about 3.5λ or less, where λ denotes the wavelength of an acoustic wave determined by the electrode finger pitch of the interdigital transducer. In the support member, the high-impurity-concentration region is further from the piezoelectric film than the low-impurity-concentration region.

    ACOUSTIC WAVE DEVICE, ACOUSTIC WAVE DEVICE PACKAGE, RADIO-FREQUENCY FRONT-END CIRCUIT, AND COMMUNICATION DEVICE

    公开(公告)号:US20190393854A1

    公开(公告)日:2019-12-26

    申请号:US16562465

    申请日:2019-09-06

    Abstract: An acoustic wave device includes a silicon oxide film, a piezoelectric body, and an interdigital transducer electrode laminated on a support substrate made of silicon. Where a wave length that is determined by an electrode finger pitch of the interdigital transducer electrode is λ, a thickness of the support substrate is greater than or equal to about 3λ. An acoustic velocity of the first higher mode that propagates through the piezoelectric body is an acoustic velocity Vsi=(V1)1/2 of bulk waves that propagate in the support substrate, which is determined by V1 out of solutions V1, V2, and V3 of x derived from the mathematical expression Ax3+Bx2+Cx+D=0, or higher than Vsi.

    ACOUSTIC WAVE DEVICE
    9.
    发明申请

    公开(公告)号:US20220216846A1

    公开(公告)日:2022-07-07

    申请号:US17701988

    申请日:2022-03-23

    Abstract: An acoustic wave device includes a piezoelectric layer and first and second electrodes facing each other in a direction crossing a thickness direction of the piezoelectric layer. The acoustic wave device utilizes a bulk wave of a thickness slip first-order mode. The acoustic wave device includes first and second resonators. Each of the first and second resonators includes the first and second electrodes, and a setting portion including a setup region where the first and second electrodes are provided in the piezoelectric layer. The thickness of each of the first and second resonators excludes the thickness of the first and second electrodes included in the resonator. The thickness of the first resonator is different from the thickness of the second resonator.

    ACOUSTIC WAVE DEVICE
    10.
    发明申请

    公开(公告)号:US20220216392A1

    公开(公告)日:2022-07-07

    申请号:US17705308

    申请日:2022-03-26

    Abstract: An acoustic wave device includes a piezoelectric layer and first and second electrodes facing each other in a direction crossing a thickness direction of the piezoelectric layer. The acoustic wave device utilizes a bulk wave of a thickness slip first-order mode. The acoustic wave device includes first and second resonators. Each of the first and second resonators includes the first and second electrodes, and a setting portion including a setup region where the first and second electrodes are provided in the piezoelectric layer. The thickness of each of the first and second resonators excludes the thickness of the first and second electrodes included in the resonator. The thickness of the first resonator is different from the thickness of the second resonator.

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