公开(公告)号：US12255151B2

公开(公告)日：2025-03-18

申请号：US17392344

申请日：2021-08-03

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshihito Otsubo ,  Yukio Yamamoto

IPC: H01L23/552 ,  H01L23/367 ,  H01L23/498 ,  H01L25/065

Abstract: A module (101) includes a substrate (1) having a first main surface (1a) and including wiring, a first component (31) having a circuit surface (31a), mounted on the first main surface (1a) such that the circuit surface (31a) faces the first main surface (1a), and having a ground terminal (10) on the circuit surface (31a), a first sealing resin (6a) disposed to cover the first main surface (1a) and the first component (31), and a heat dissipation portion (5) provided along an upper surface of the first sealing resin (6a). The wiring is connected to the ground terminal (10), and the module further includes a heat conducting member (7) connecting the wiring and the heat dissipation portion (5).

公开(公告)号：US11322472B2

公开(公告)日：2022-05-03

申请号：US16892352

申请日：2020-06-04

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshihito Otsubo ,  Yukio Yamamoto

IPC: H01L23/552 ,  H01L23/00 ,  H01L25/10 ,  H01L25/16 ,  H01L25/18

Abstract: Provided is a module which has a package-on-package structure including a redistribution layer and can be easily reduced in height. A module 1 includes an upper module including a substrate, a first component, and a sealing resin layer, and a lower module including an intermediate layer and a redistribution layer. The first component is connected to the redistribution layer with a columnar conductor interposed therebetween and provided in the intermediate layer, and both the first component and a second component are rewired by the redistribution layer. Since the intermediate layer is formed by using a frame-shaped substrate, the upper module and the lower module can be connected without necessarily a bump, so that it is possible to provide a module which has a fanout-type package-on-package structure and can be easily reduced in height.

公开(公告)号：US12193144B2

公开(公告)日：2025-01-07

申请号：US17478355

申请日：2021-09-17

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yukio Yamamoto ,  Yoshihito Otsubo

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/18

Abstract: A modules is provided in which an electronic component is disposed on a first main surface and each of a plurality of first connection terminals is disposed on a second main surface. Moreover, a second connection terminal is disposed on the second main surface. When a substrate is viewed in a direction perpendicular to the second main surface, the second connection terminal is larger in area than each of the first connection terminals. When the substrate is viewed in the direction perpendicular to the second main surface, the second connection terminal is disposed on a straight line connecting the first connection terminals. The second connection terminal serves to establish an electrical connection.

公开(公告)号：US11264366B2

公开(公告)日：2022-03-01

申请号：US16891206

申请日：2020-06-03

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshihito Otsubo ,  Yukio Yamamoto

IPC: H01L23/552 ,  H01L25/10 ,  H01L23/29 ,  H01L23/31 ,  H01L23/498 ,  H01L23/00 ,  H01L25/00

Abstract: Provided is a module which has a package-on-package structure including a redistribution layer and can be easily reduced in height. A module includes an upper module including a substrate, a first component, and a sealing resin layer, and a lower module including an intermediate layer and a redistribution layer. The first component is connected to the redistribution layer with a columnar conductor interposed therebetween and provided in the intermediate layer, and both the first component and a second component are rewired by the redistribution layer. By fixing a resin block containing the second component to a lower surface of the substrate by a fixing conductor, positional deviation of the second component can be prevented. Further, by polishing an upper surface of the resin block, it is possible to improve the flatness.

公开(公告)号：US20220007494A1

公开(公告)日：2022-01-06

申请号：US17478355

申请日：2021-09-17

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yukio Yamamoto ,  Yoshihito Otsubo

IPC: H05K1/02 ,  H05K1/18 ,  H05K1/11

Abstract: A modules is provided in which an electronic component is disposed on a first main surface and each of a plurality of first connection terminals is disposed on a second main surface. Moreover, a second connection terminal is disposed on the second main surface. When a substrate is viewed in a direction perpendicular to the second main surface, the second connection terminal is larger in area than each of the first connection terminals. When the substrate is viewed in the direction perpendicular to the second main surface, the second connection terminal is disposed on a straight line connecting the first connection terminals. The second connection terminal serves to establish an electrical connection.

公开(公告)号：US20190191565A1

公开(公告)日：2019-06-20

申请号：US16283858

申请日：2019-02-25

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takahiro Oka ,  Yuki Takemori ,  Kazuo Kishida ,  Hiromichi Kawakami ,  Yukio Yamamoto ,  Kensuke Otake

IPC: H05K1/18 ,  H01L23/13 ,  H01L23/15 ,  H01L23/498 ,  H05K1/11 ,  H05K1/03 ,  H05K3/34

CPC classification number: H05K1/181 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/4864 ,  H01L21/4867 ,  H01L23/13 ,  H01L23/15 ,  H01L23/49822 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/13017 ,  H01L2224/13147 ,  H01L2224/1357 ,  H01L2224/1403 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2924/014 ,  H05K1/0306 ,  H05K1/111 ,  H05K1/18 ,  H05K3/1216 ,  H05K3/26 ,  H05K3/34 ,  H05K3/3436 ,  H05K3/4007 ,  H05K3/4061 ,  H05K3/4644 ,  H05K2201/09472 ,  H05K2201/10795 ,  H05K2201/1081

Abstract: An electronic device that includes an electronic component mounted on a multilayer ceramic substrate. The electronic component includes a connection terminal on the mounting surface side thereof, the connection terminal having an end with a rounded convex shape when viewed in cross section. The multilayer ceramic substrate includes a recessed portion at a position corresponding to the connection terminal, the recessed portion having a rounded concave shape when viewed in cross section, and a surface electrode disposed on at least part of the recessed portion and electrically connected to the connection terminal.