Simple method of designing acoustic matching layers in thickness-mode piezoelectric transducers
    1.
    发明申请
    Simple method of designing acoustic matching layers in thickness-mode piezoelectric transducers 审中-公开
    在厚度模式压电换能器中设计声匹配层的简单方法

    公开(公告)号:US20050184620A1

    公开(公告)日:2005-08-25

    申请号:US10782468

    申请日:2004-02-19

    CPC分类号: G10K11/02 B06B1/067

    摘要: The present invention relates to an optimum designing method of matching layers of a thickness-mode piezoelectric transducer in which a front load effective impedance when viewing in a load direction from a front side of a piezoelectric plate is used as a design parameter when designing an acoustic matching layer. An impedance characteristic of each acoustic matching layer is determined using a new matching formula. An optimized design parameter is determined in a region in which an amplitude in a peak amplitude contour map and a depth of a pulse width contour map using video waveforms for statistically evaluating a sensitivity and resolution of a piezoelectric transducer.

    摘要翻译: 本发明涉及一种厚度模式压电换能器的层的最佳设计方法,其中在设计声学时使用从压电板的正面观察负载方向的前负载有效阻抗作为设计参数 匹配层。 使用新的匹配公式确定每个声匹配层的阻抗特性。 在使用视频波形的峰值幅度轮廓图的幅度和脉冲宽度轮廓线的深度的区域中确定优化的设计参数,以统计评估压电换能器的灵敏度和分辨率。

    Iterative approach for applying multiple currents to a body using voltage sources in electrical impedance tomography
    2.
    发明申请
    Iterative approach for applying multiple currents to a body using voltage sources in electrical impedance tomography 审中-公开
    在电阻抗断层扫描中使用电压源将多个电流施加到身体的迭代方法

    公开(公告)号:US20050251062A1

    公开(公告)日:2005-11-10

    申请号:US11124246

    申请日:2005-05-06

    IPC分类号: A61B5/05 A61B5/053

    CPC分类号: A61B5/0536

    摘要: Voltage sources produce desired current patterns in an ACT-type Electrical Impedance Tomography (EIT) system. An iterative adaptive algorithm generates the necessary voltage pattern that will result in the desired current pattern. The convergence of the algorithm is shown under the condition that the estimation error of the linear mapping from voltage to current is small. The simulation results are presented along with the implication of the convergence condition.

    摘要翻译: 电压源在ACT型电阻抗层析成像(EIT)系统中产生所需的电流模式。 迭代自适应算法产生将导致所需电流模式的必要电压模式。 在从电压到电流的线性映射的估计误差小的条件下示出了算法的收敛。 仿真结果与收敛条件的含义一起呈现。

    Extended depth of focus (EDOF) lens to increase pseudo-accommodation by utilizing pupil dynamics
    4.
    发明授权
    Extended depth of focus (EDOF) lens to increase pseudo-accommodation by utilizing pupil dynamics 有权
    扩展焦距(EDOF)镜头,通过利用瞳孔动力学增加伪适应度

    公开(公告)号:US08241354B2

    公开(公告)日:2012-08-14

    申请号:US12503267

    申请日:2009-07-15

    IPC分类号: A61F2/16

    摘要: In one aspect, the present invention provides an ophthalmic lens (e.g., an IOL) that includes an optic having an anterior surface and a posterior surface disposed about an optical axis. At least one of the surfaces (e.g., the anterior surface) has a profile characterized by superposition of a base profile and an auxiliary profile. The auxiliary profile can include an inner region, an outer region and a transition region between the inner and the outer regions, where an optical path difference across the transition region (i.e., the optical path difference between the inner and the outer radial boundaries of the transition region) corresponds to a non-integer fraction (e.g., ½) of a design wavelength (e.g., a wavelength of about 550 nm).

    摘要翻译: 一方面,本发明提供一种眼科镜片(例如,IOL),其包括具有围绕光轴设置的前表面和后表面的光学元件。 至少一个表面(例如,前表面)具有由基体轮廓和辅助轮廓叠加来表征的轮廓。 辅助轮廓可以包括内部区域,外部区域和内部区域和外部区域之间的过渡区域,其中穿过过渡区域的光程差(即,内部和外部径向边界之间的光程差) 过渡区域)对应于设计波长(例如,约550nm的波长)的非整数分数(例如,1/2)。

    LED package
    5.
    发明申请
    LED package 审中-公开
    LED封装

    公开(公告)号:US20070108460A1

    公开(公告)日:2007-05-17

    申请号:US11593085

    申请日:2006-11-06

    IPC分类号: H01L33/00 H01L29/22

    摘要: An LED package is provided. A light emitting chip generates light when current is applied. A frame is electrically connected to the light emitting chip via a wire, and has the light emitting chip mounted thereon. A molding fixes the frame thereto, and has a cavity surrounding the light emitting chip and an embossed protrusion formed on a top surface thereof. A lens is domed upward from the embossed protrusion along an outer periphery of the embossed protrusion. The lens is made of a light transmissible resin filled in the cavity. The invention ensures a sufficient view angle of light generated from the LED chip, thereby increasing light extraction efficiency. This consequently simplifies an assembly process, allowing mass production and reducing manufacturing costs.

    摘要翻译: 提供LED封装。 当施加电流时,发光芯片产生光。 框架经由导线电连接到发光芯片,并且其上安装有发光芯片。 模制件将框架固定在其上,并且具有围绕发光芯片的空腔和形成在其顶表面上的压花突起。 透镜从压花突起沿着压纹凸起的外周向上圆顶。 透镜由填充在空腔中的透光树脂制成。 本发明确保从LED芯片产生的光的足够的视角,从而提高光提取效率。 因此简化了组装过程,从而允许批量生产并降低制造成本。

    Combined base transceiver station and base station controller handoff
    6.
    发明申请
    Combined base transceiver station and base station controller handoff 有权
    组合基站收发台和基站控制器切换

    公开(公告)号:US20050192012A1

    公开(公告)日:2005-09-01

    申请号:US11037814

    申请日:2005-01-18

    摘要: A system, method, and computer readable medium for a softer handoff comprises receiving a Pilot Strength Measurement Message (PSMM) to request a handoff by a selector distribution unit (SDU), receiving a softer handoff request message by a channel element control (CEC), receiving a softer handoff request message by a radio call control (RCC), receiving a traffic channel assignment message by the CEC, and receiving an indication of an addition of a new sector for the softer handoff by the SDU.

    摘要翻译: 用于更软切换的系统,方法和计算机可读介质包括接收导频强度测量消息(PSMM)以通过选择器分配单元(SDU)请求切换,通过信道单元控制(CEC)接收更软的越区切换请求消息, 通过无线电呼叫控制(RCC)接收更软的越区切换请求消息,由CEC接收业务信道分配消息,并且接收SDU对较软切换的新扇区的添加指示。

    Extended depth of focus (EDOF) lens to increase pseudo-accommodation by utilizing pupil dynamics
    7.
    发明授权
    Extended depth of focus (EDOF) lens to increase pseudo-accommodation by utilizing pupil dynamics 有权
    扩展焦距(EDOF)镜头,通过利用瞳孔动力学增加伪适应度

    公开(公告)号:US08562675B2

    公开(公告)日:2013-10-22

    申请号:US13562143

    申请日:2012-07-30

    IPC分类号: A61F2/16

    摘要: In one aspect, the present invention provides an ophthalmic lens (e.g., an IOL) that includes an optic having an anterior surface and a posterior surface disposed about an optical axis. At least one of the surfaces (e.g., the anterior surface) has a profile characterized by superposition of a base profile and an auxiliary profile. The auxiliary profile can include an inner region, an outer region and a transition region between the inner and the outer regions, where an optical path difference across the transition region (i.e., the optical path difference between the inner and the outer radial boundaries of the transition region) corresponds to a non-integer fraction (e.g., ½) of a design wavelength (e.g., a wavelength of about 550 nm).

    摘要翻译: 一方面,本发明提供一种眼科镜片(例如,IOL),其包括具有围绕光轴设置的前表面和后表面的光学元件。 至少一个表面(例如,前表面)具有由基体轮廓和辅助轮廓叠加来表征的轮廓。 辅助轮廓可以包括内部区域,外部区域和内部区域和外部区域之间的过渡区域,其中穿过过渡区域的光程差(即,内部和外部径向边界之间的光程差) 过渡区域)对应于设计波长(例如,约550nm的波长)的非整数分数(例如,1/2)。

    Side-emitting LED package and method of manufacturing the same
    8.
    发明申请
    Side-emitting LED package and method of manufacturing the same 审中-公开
    侧面发光LED封装及其制造方法

    公开(公告)号:US20060273337A1

    公开(公告)日:2006-12-07

    申请号:US11444402

    申请日:2006-06-01

    IPC分类号: H01L33/00

    摘要: The invention relates to a side-emitting LED package and a manufacturing method thereof. The side-emitting LED package includes a substrate with an electrode formed thereon, and a light source disposed on the substrate and electrically connected to the electrode. The side-emitting LED package also includes a molded part having an upper surface with a center thereof depressed concavely, covering and protecting the substrate and the light source, and a reflection layer covering an entire upper surface of the molded part to reflect light sideward from the molded part which forms a light transmitting surface. The package is not restricted in the shape of the molded part and is not affected by the LED chip size, enabling a compact structure. The invention can also process a substrate by a PCB process, enabling mass-production.

    摘要翻译: 本发明涉及一种侧面发光LED封装及其制造方法。 侧发光LED封装包括其上形成有电极的基板和设置在基板上并与电极电连接的光源。 侧发光LED封装还包括具有上表面的模制部件,其中心凹陷地凹陷,覆盖和保护基板和光源,以及覆盖模制部件的整个上表面的反射层,以将光从侧向反射 模制部件形成透光表面。 封装不限制成型件的形状,不受LED芯片尺寸的影响,从而实现了紧凑的结构。 本发明还可以通过PCB工艺处理衬底,从而实现批量生产。