公开(公告)号：US11428442B2

公开(公告)日：2022-08-30

申请号：US16975918

申请日：2019-03-19

Applicant: NEC Corporation

Inventor： Hisato Sakuma ,  Koichi Todoroki ,  Masaki Chiba ,  Takafumi Natsumeda ,  Minoru Yoshikawa

IPC: F25B5/02 ,  F25B6/02 ,  F25B25/00 ,  F25B49/02 ,  H05K7/20

Abstract: A cooling device includes a first evaporation unit, a second evaporation unit, a first condensation unit, a second condensation unit, common piping, a compressor, an expansion valve, a first valve, and a second valve. The common piping combines liquid-phase refrigerant flowing from the first condensation unit and liquid-phase refrigerant flowing from the second condensation unit. The first valve adjusts the liquid-phase refrigerant amount flowing into the first evaporation unit. The second valve adjusts the liquid-phase refrigerant amount flowing into the second evaporation unit. In addition, the pressure inside the common pipe is greater than the respective pressures inside the first evaporation unit and the second evaporation unit.

公开(公告)号：US20150131229A1

公开(公告)日：2015-05-14

申请号：US14401282

申请日：2013-05-10

Applicant: NEC Corporation

Inventor： Arihiro Matsunaga ,  Minoru Yoshikawa ,  Hitoshi Sakamoto ,  Akira Shoujiguchi ,  Masaki Chiba ,  Kenichi Inaba

IPC: H05K7/20 ,  B23P15/26

CPC classification number: H05K7/20336 ,  B23P15/26 ,  F28D15/0266 ,  F28D15/0275 ,  F28F2275/08 ,  H01L23/4006 ,  H01L23/427 ,  H01L2023/4062 ,  H01L2924/0002 ,  H05K7/20309 ,  H05K7/20318 ,  H05K7/2039 ,  Y10T29/4913 ,  Y10T29/53174 ,  H01L2924/00

Abstract: It is impossible in a cooling device using a phase-change system, seeking high heat transport performance, to obtain sufficient cooling performance due to the increase in thermal resistance with a heating element to be cooled, therefore, a connecting structure of a cooling device according to an exemplary aspect of the present invention includes a connecting board with an opening; a pressing plate of thin plate elastically deformable; first fixing means for fixing the pressing plate to the connecting board with the pressing plate disposed covering heat receiving means composing the cooling device; and second fixing means for fixing the connecting board to a substrate with the heat receiving means abutting against a heating element mounted on the substrate and disposed in the opening.

Abstract translation: 由于与要冷却的加热元件的热​​阻增加，因此使用相变系统的冷却装置，寻求高的热输送性能，以获得足够的冷却性能是不可能的，因此，冷却装置的连接结构 本发明的示例性方面包括具有开口的连接板; 薄板的压板可弹性变形; 第一固定装置，用于将压板固定到连接板上，其中压板设置成覆盖构成冷却装置的热接收装置; 以及第二固定装置，用于将所述连接板固定到基板上，所述热接收装置抵靠安装在所述基板上并设置在所述开口中的加热元件。

公开(公告)号：US20140083652A1

公开(公告)日：2014-03-27

申请号：US14118556

申请日：2012-05-21

Applicant: NEC Corporation

Inventor： Arihiro Matsunaga ,  Minoru Yoshikawa ,  Hitoshi Sakamoto ,  Masaki Chiba ,  Kenichi Inaba

IPC: F28D15/02

CPC classification number: F28D15/025 ,  F28D15/0266 ,  F28D15/0275 ,  H01L23/10 ,  H01L23/4006 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A sealed casing includes a container provided with a plurality of opening and houses at least one heat-generating body, and a plurality of top boards sealing the openings respectively, and is characterized in that at least one of the openings is disposed in a heat-generating area where the heat-generating body is disposed, and that a cooling unit is disposed on the top board sealing the opening in the heat-generating area.

Abstract translation: 密封壳体包括设置有多个开口并容纳至少一个发热体的容器和分别密封开口的多个顶板，其特征在于，至少一个开口设置在热交换器中， 并且在顶板上设置冷却单元，该冷却单元密封发热区域中的开口。

公开(公告)号：US11774115B2

公开(公告)日：2023-10-03

申请号：US17400667

申请日：2021-08-12

Applicant: NEC Corporation

Inventor： Masaki Chiba ,  Kunihiko Ishihara ,  Minoru Yoshikawa ,  Junichi Miyamoto ,  Yoshinori Miyamoto

IPC: F24F1/32 ,  F24F1/34 ,  F16L11/04 ,  F16L13/08

CPC classification number: F24F1/32 ,  F16L11/04 ,  F16L13/08 ,  F24F1/34 ,  F16L2011/047

Abstract: An air conditioner includes: a turbo compressor that compresses a heat medium; a heat exchanger that exchanges heat of the heat medium supplied from the turbo compressor with an atmosphere; and a supply flow path and a discharge flow path that connect the turbo compressor and the heat exchanger. At least one of the supply flow path and the discharge flow path includes piping, and the piping includes a gas barrier layer that covers a surface of a synthetic resin.

公开(公告)号：US20230309273A1

公开(公告)日：2023-09-28

申请号：US18020125

申请日：2020-08-13

Applicant: NEC Corporation

Inventor： Nirmal Singh RAJPUT ,  Masaki Chiba ,  Yoshinori Miyamoto ,  Junichi Miyamoto ,  Minoru Yoshikawa

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20836 ,  G06F1/206 ,  H05K7/20136 ,  H05K7/20745

Abstract: The present disclosure can provide a system, method and non-transitory computer readable storage medium capable of generating a uniform airflow at a heat exchanger surface. A system includes: a cooling unit body (11, 21) having an airflow inlet (18, 28) and an airflow outlet (15, 25); a heat exchanger (12, 22) provided inside the cooling unit body; and a plurality of fans (16, 17, 26, 27) provided at the airflow inlet. The system may include air velocity sensors (265, 275) provided at the heat exchanger (22).

公开(公告)号：US20230213253A1

公开(公告)日：2023-07-06

申请号：US17788888

申请日：2021-09-13

Applicant: NEC Corporation

Inventor： Takashi OHTSUKA ,  Koichi Todoroki ,  Yoshinori Miyamoto ,  Masaki Chiba ,  Mahiro Hachiya ,  Minoru Yoshikawa

IPC: F25B49/02 ,  F25B43/00

CPC classification number: F25B49/02 ,  F25B43/006 ,  F25B2600/13 ,  F25B2700/2109 ,  F25B2700/19 ,  F25B2600/2501 ,  F25B2400/23

Abstract: A cooling device using a refrigeration cycle in which a refrigerant is circulated through a heat receiver, a compressor, a heat radiator, and an expansion valve includes: a gas-liquid separator configured to perform gas-liquid separation on the refrigerant supplied from the expansion valve; a pump configured to send a liquid phase refrigerant separated by the gas-liquid separator to the heat receiver; and a control unit configured to control opening and closing of a refrigerant flow path of the refrigeration cycle, and an operation and stop of the compressor and the pump, wherein the control unit starts the operation of the pump on condition that a net positive suction head of the pump has reached a predetermined value or more.

公开(公告)号：US10182517B2

公开(公告)日：2019-01-15

申请号：US15037859

申请日：2014-11-14

Applicant: NEC Corporation

Inventor： Minoru Yoshikawa ,  Kenichi Inaba ,  Masanori Sato ,  Akira Shoujiguchi ,  Arihiro Matsunaga ,  Masaki Chiba

IPC: F28F7/00 ,  F28D15/00 ,  H05K7/20 ,  G06F1/20 ,  F28D15/02

Abstract: A vapor pipe 103 connects a heat dissipation portion 200 and each of a plurality of heat receiving portions 102. A liquid pipe 104 connects the heat dissipation portion 200 and each of a plurality of the heat receiving portions 102. A bypass pipe 105 connects the vapor pipe 103 and the liquid pipe 104. A valve 106 opens and closes a flow path of the bypass pipe 105. A first connection portion 107 connects the vapor pipe 103 and the bypass pipe 105. A second connection portion 108 connects the liquid pipe 103 and the bypass pipe 105. The first connection portion 107 is disposed at a position higher than that of the second connection portion 108. As a result, refrigerant can be efficiently transported in a short time.

公开(公告)号：US09696068B2

公开(公告)日：2017-07-04

申请号：US14427487

申请日：2013-07-19

Applicant: NEC Corporation

Inventor： Arihiro Matsunaga ,  Minoru Yoshikawa ,  Hitoshi Sakamoto ,  Akira Shoujiguchi ,  Masaki Chiba ,  Kenichi Inaba

IPC: F25B39/02 ,  H01L23/427 ,  B23P15/26

CPC classification number: F25B39/028 ,  B23P15/26 ,  H01L23/427 ,  H01L2924/0002 ,  Y10T29/49359 ,  H01L2924/00

Abstract: In order to maintain a high cooling capability even in a case where a heating element has a lower calorific value, a boiling section of a heat receiving section in a phase change cooling apparatus includes a comb-shaped structure and a porous layer provided on a bottom portion of the comb-shaped structure between fins of the comb-shaped structure. With such a boiling section, a liquid film of a liquid phase refrigerant is forcedly made thinner. Thus, the liquid phase refrigerant is changed in phase into a gaseous phase refrigerant even in a case of a small difference between the temperature of the gaseous phase refrigerant and the temperature of the heat receiving surface.

公开(公告)号：US09433129B2

公开(公告)日：2016-08-30

申请号：US14401282

申请日：2013-05-10

Applicant: NEC Corporation

Inventor： Arihiro Matsunaga ,  Minoru Yoshikawa ,  Hitoshi Sakamoto ,  Akira Shoujiguchi ,  Masaki Chiba ,  Kenichi Inaba

IPC: H05K7/20 ,  B23P15/26 ,  H01L23/427 ,  F28D15/02 ,  G06F1/20 ,  H01L23/40

Abstract: It is impossible in a cooling device using a phase-change system, seeking high heat transport performance, to obtain sufficient cooling performance due to the increase in thermal resistance with a heating element to be cooled, therefore, a connecting structure of a cooling device according to an exemplary aspect of the present invention includes a connecting board with an opening; a pressing plate of thin plate elastically deformable; first fixing means for fixing the pressing plate to the connecting board with the pressing plate disposed covering heat receiving means composing the cooling device; and second fixing means for fixing the connecting board to a substrate with the heat receiving means abutting against a heating element mounted on the substrate and disposed in the opening.

公开(公告)号：US20150062821A1

公开(公告)日：2015-03-05

申请号：US14385754

申请日：2013-03-14

Applicant: NEC CORPORATION

Inventor： Minoru Yoshikawa ,  Hitoshi Sakamoto ,  Akira Shoujiguchi ,  Masaki Chiba ,  Kenichi Inaba ,  Arihiro Matsunaga

IPC: H05K1/02 ,  H05K7/20

CPC classification number: H05K1/0203 ,  F28D15/0266 ,  F28F7/02 ,  G06F1/20 ,  G06F2200/201 ,  H01L23/427 ,  H01L2924/0002 ,  H05K7/20309 ,  H05K7/20318 ,  H05K7/20327 ,  H05K7/20809 ,  H01L2924/00

Abstract: The size of an electronic device using a cooling structure for an electronic circuit board is increased when using a heating element with a large amount of heat generation, therefore, a cooling structure for an electronic circuit board according to an exemplary aspect of the present invention includes an evaporator with an evaporation container storing a refrigerant; a condenser condensing and liquefying a vapor-phase refrigerant vaporized in the evaporator and radiating heat; and a pipe connecting the evaporator to the condenser, wherein the evaporator includes a heat receiving area, on one side of the evaporation container, thermally connecting to a heating element disposed on the electronic circuit board, and a plurality of flow path plates, in an area including the heat receiving area, extending in the direction parallel to the electronic circuit board; and a vapor-liquid interface of the refrigerant is positioned above or at the level of a lower end and below an upper end of the heat receiving area in the vertical direction, in the arrangement condition that the drawing direction of the flow path plates is approximately parallel to the vertical direction.

Abstract translation: 当使用具有大量发热量的加热元件时，使用电子电路板的冷却结构的电子设备的尺寸增加，因此，根据本发明的示例性方面的电子电路板的冷却结构包括 具有储存制冷剂的蒸发容器的蒸发器; 冷凝和液化在蒸发器中蒸发并蒸发热的气相制冷剂的冷凝器; 以及将蒸发器连接到冷凝器的管道，其中所述蒸发器包括在所述蒸发容器的一侧上的热接收区域，其热连接到设置在所述电子电路板上的加热元件，以及多个流路板， 包括受热面积的区域，沿与电子电路板平行的方向延伸; 并且在流路板的拉拔方向为大致的布置条件下，制冷剂的汽 - 液界面位于上下方向的下端的上方并位于热接收区域的上端的下方 平行于垂直方向。