公开(公告)号：US20150131229A1

公开(公告)日：2015-05-14

申请号：US14401282

申请日：2013-05-10

Applicant: NEC Corporation

Inventor： Arihiro Matsunaga ,  Minoru Yoshikawa ,  Hitoshi Sakamoto ,  Akira Shoujiguchi ,  Masaki Chiba ,  Kenichi Inaba

IPC: H05K7/20 ,  B23P15/26

CPC classification number: H05K7/20336 ,  B23P15/26 ,  F28D15/0266 ,  F28D15/0275 ,  F28F2275/08 ,  H01L23/4006 ,  H01L23/427 ,  H01L2023/4062 ,  H01L2924/0002 ,  H05K7/20309 ,  H05K7/20318 ,  H05K7/2039 ,  Y10T29/4913 ,  Y10T29/53174 ,  H01L2924/00

Abstract: It is impossible in a cooling device using a phase-change system, seeking high heat transport performance, to obtain sufficient cooling performance due to the increase in thermal resistance with a heating element to be cooled, therefore, a connecting structure of a cooling device according to an exemplary aspect of the present invention includes a connecting board with an opening; a pressing plate of thin plate elastically deformable; first fixing means for fixing the pressing plate to the connecting board with the pressing plate disposed covering heat receiving means composing the cooling device; and second fixing means for fixing the connecting board to a substrate with the heat receiving means abutting against a heating element mounted on the substrate and disposed in the opening.

Abstract translation: 由于与要冷却的加热元件的热​​阻增加，因此使用相变系统的冷却装置，寻求高的热输送性能，以获得足够的冷却性能是不可能的，因此，冷却装置的连接结构 本发明的示例性方面包括具有开口的连接板; 薄板的压板可弹性变形; 第一固定装置，用于将压板固定到连接板上，其中压板设置成覆盖构成冷却装置的热接收装置; 以及第二固定装置，用于将所述连接板固定到基板上，所述热接收装置抵靠安装在所述基板上并设置在所述开口中的加热元件。

公开(公告)号：US20140083652A1

公开(公告)日：2014-03-27

申请号：US14118556

申请日：2012-05-21

Applicant: NEC Corporation

Inventor： Arihiro Matsunaga ,  Minoru Yoshikawa ,  Hitoshi Sakamoto ,  Masaki Chiba ,  Kenichi Inaba

IPC: F28D15/02

CPC classification number: F28D15/025 ,  F28D15/0266 ,  F28D15/0275 ,  H01L23/10 ,  H01L23/4006 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A sealed casing includes a container provided with a plurality of opening and houses at least one heat-generating body, and a plurality of top boards sealing the openings respectively, and is characterized in that at least one of the openings is disposed in a heat-generating area where the heat-generating body is disposed, and that a cooling unit is disposed on the top board sealing the opening in the heat-generating area.

Abstract translation: 密封壳体包括设置有多个开口并容纳至少一个发热体的容器和分别密封开口的多个顶板，其特征在于，至少一个开口设置在热交换器中， 并且在顶板上设置冷却单元，该冷却单元密封发热区域中的开口。

公开(公告)号：US10215456B2

公开(公告)日：2019-02-26

申请号：US15036464

申请日：2014-12-05

Applicant: NEC Corporation ,  NEC Platforms, Ltd.

Inventor： Arihiro Matsunaga ,  Masaki Chiba ,  Minoru Yoshikawa ,  Tadao Hosaka ,  Shunsuke Fujii ,  Akira Shoujiguchi ,  Kenichi Inaba ,  Masanori Sato

IPC: F25B39/00 ,  F28D15/02 ,  H05K7/20 ,  F25B23/00 ,  F25B39/02 ,  F28D15/06

Abstract: In order to supply a refrigerant to multiple-stage heat receivers equally while saving space, a refrigerant distribution device to distribute a refrigerant supplied from the upper stream according to the present invention includes a main body including a side wall part, an upper face part and a bottom face part, an upstream pipe provided on the upper face part in a manner communicating with an inside of the main body, a downstream pipe provided in a state partially inserted inside the main body via an under face hole part provided in the bottom face part, a tributary pipe provided in the side wall part or the bottom face part in a manner communicating with the inside of the main body, and a refrigerant direction changing means provided between the upstream pipe and the downstream pipe.

公开(公告)号：US20140326016A1

公开(公告)日：2014-11-06

申请号：US14370194

申请日：2012-12-21

Applicant: NEC Corporation

Inventor： Akira Shoujiguchi ,  Minoru Yoshikawa ,  Hitoshi Sakamoto ,  Masaki Chiba ,  Kenichi Inaba ,  Arihiro Matsunaga

IPC: H05K7/20 ,  F25B39/00

CPC classification number: H05K7/208 ,  F25B39/00 ,  G06F1/20 ,  G06F2200/201 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H05K7/20309 ,  H05K7/20318 ,  H05K7/20809 ,  H01L2924/00

Abstract: A cooling device of the present invention is a cooling device arranged in a chassis equipped with an upper surface, and comprises: a refrigerant; a vaporizer that includes an evaporative vessel having a side face of a curved surface shape, and performs heat-absorption by making the refrigerant change its phase from a liquid phase state to a vapor phase state; a condenser that performs heat-radiation by making the refrigerant change its phase from a vapor phase state to a liquid phase state; a pipe that connects the vaporizer and the condenser; and a flow path suppression means for suppressing a cooling wind that flows between an area over the evaporative vessel and the upper surface.

Abstract translation: 本发明的冷却装置是布置在具有上表面的底盘中的冷却装置，包括：制冷剂; 蒸发器，其包括具有弯曲表面形状的侧面的蒸发容器，并且通过使制冷剂将其相位从液相状态转变为气相状态来进行吸热; 通过使制冷剂将其相位从气相状态转变为液相状态而进行热辐射的冷凝器; 连接蒸发器和冷凝器的管道; 以及流路抑制装置，用于抑制在蒸发容器上方的区域和上表面之间流动的冷却风。

公开(公告)号：US10182517B2

公开(公告)日：2019-01-15

申请号：US15037859

申请日：2014-11-14

Applicant: NEC Corporation

Inventor： Minoru Yoshikawa ,  Kenichi Inaba ,  Masanori Sato ,  Akira Shoujiguchi ,  Arihiro Matsunaga ,  Masaki Chiba

IPC: F28F7/00 ,  F28D15/00 ,  H05K7/20 ,  G06F1/20 ,  F28D15/02

Abstract: A vapor pipe 103 connects a heat dissipation portion 200 and each of a plurality of heat receiving portions 102. A liquid pipe 104 connects the heat dissipation portion 200 and each of a plurality of the heat receiving portions 102. A bypass pipe 105 connects the vapor pipe 103 and the liquid pipe 104. A valve 106 opens and closes a flow path of the bypass pipe 105. A first connection portion 107 connects the vapor pipe 103 and the bypass pipe 105. A second connection portion 108 connects the liquid pipe 103 and the bypass pipe 105. The first connection portion 107 is disposed at a position higher than that of the second connection portion 108. As a result, refrigerant can be efficiently transported in a short time.

公开(公告)号：US09696068B2

公开(公告)日：2017-07-04

申请号：US14427487

申请日：2013-07-19

Applicant: NEC Corporation

Inventor： Arihiro Matsunaga ,  Minoru Yoshikawa ,  Hitoshi Sakamoto ,  Akira Shoujiguchi ,  Masaki Chiba ,  Kenichi Inaba

IPC: F25B39/02 ,  H01L23/427 ,  B23P15/26

CPC classification number: F25B39/028 ,  B23P15/26 ,  H01L23/427 ,  H01L2924/0002 ,  Y10T29/49359 ,  H01L2924/00

Abstract: In order to maintain a high cooling capability even in a case where a heating element has a lower calorific value, a boiling section of a heat receiving section in a phase change cooling apparatus includes a comb-shaped structure and a porous layer provided on a bottom portion of the comb-shaped structure between fins of the comb-shaped structure. With such a boiling section, a liquid film of a liquid phase refrigerant is forcedly made thinner. Thus, the liquid phase refrigerant is changed in phase into a gaseous phase refrigerant even in a case of a small difference between the temperature of the gaseous phase refrigerant and the temperature of the heat receiving surface.

公开(公告)号：US09433129B2

公开(公告)日：2016-08-30

申请号：US14401282

申请日：2013-05-10

Applicant: NEC Corporation

Inventor： Arihiro Matsunaga ,  Minoru Yoshikawa ,  Hitoshi Sakamoto ,  Akira Shoujiguchi ,  Masaki Chiba ,  Kenichi Inaba

IPC: H05K7/20 ,  B23P15/26 ,  H01L23/427 ,  F28D15/02 ,  G06F1/20 ,  H01L23/40

Abstract: It is impossible in a cooling device using a phase-change system, seeking high heat transport performance, to obtain sufficient cooling performance due to the increase in thermal resistance with a heating element to be cooled, therefore, a connecting structure of a cooling device according to an exemplary aspect of the present invention includes a connecting board with an opening; a pressing plate of thin plate elastically deformable; first fixing means for fixing the pressing plate to the connecting board with the pressing plate disposed covering heat receiving means composing the cooling device; and second fixing means for fixing the connecting board to a substrate with the heat receiving means abutting against a heating element mounted on the substrate and disposed in the opening.

公开(公告)号：US20150062821A1

公开(公告)日：2015-03-05

申请号：US14385754

申请日：2013-03-14

Applicant: NEC CORPORATION

Inventor： Minoru Yoshikawa ,  Hitoshi Sakamoto ,  Akira Shoujiguchi ,  Masaki Chiba ,  Kenichi Inaba ,  Arihiro Matsunaga

IPC: H05K1/02 ,  H05K7/20

CPC classification number: H05K1/0203 ,  F28D15/0266 ,  F28F7/02 ,  G06F1/20 ,  G06F2200/201 ,  H01L23/427 ,  H01L2924/0002 ,  H05K7/20309 ,  H05K7/20318 ,  H05K7/20327 ,  H05K7/20809 ,  H01L2924/00

Abstract: The size of an electronic device using a cooling structure for an electronic circuit board is increased when using a heating element with a large amount of heat generation, therefore, a cooling structure for an electronic circuit board according to an exemplary aspect of the present invention includes an evaporator with an evaporation container storing a refrigerant; a condenser condensing and liquefying a vapor-phase refrigerant vaporized in the evaporator and radiating heat; and a pipe connecting the evaporator to the condenser, wherein the evaporator includes a heat receiving area, on one side of the evaporation container, thermally connecting to a heating element disposed on the electronic circuit board, and a plurality of flow path plates, in an area including the heat receiving area, extending in the direction parallel to the electronic circuit board; and a vapor-liquid interface of the refrigerant is positioned above or at the level of a lower end and below an upper end of the heat receiving area in the vertical direction, in the arrangement condition that the drawing direction of the flow path plates is approximately parallel to the vertical direction.

Abstract translation: 当使用具有大量发热量的加热元件时，使用电子电路板的冷却结构的电子设备的尺寸增加，因此，根据本发明的示例性方面的电子电路板的冷却结构包括 具有储存制冷剂的蒸发容器的蒸发器; 冷凝和液化在蒸发器中蒸发并蒸发热的气相制冷剂的冷凝器; 以及将蒸发器连接到冷凝器的管道，其中所述蒸发器包括在所述蒸发容器的一侧上的热接收区域，其热连接到设置在所述电子电路板上的加热元件，以及多个流路板， 包括受热面积的区域，沿与电子电路板平行的方向延伸; 并且在流路板的拉拔方向为大致的布置条件下，制冷剂的汽 - 液界面位于上下方向的下端的上方并位于热接收区域的上端的下方 平行于垂直方向。

公开(公告)号：US20140366572A1

公开(公告)日：2014-12-18

申请号：US14370185

申请日：2012-12-12

Applicant: Arihiro MATSUNAGA ,  Minoru YOSHIKAWA ,  Hitoshi SAKAMOTO ,  Akira SHOUJIGUCHI ,  Masaki CHIBA ,  Kenichi INABA ,  NEC Corporation

Inventor： Arihiro Matsunaga ,  Minoru Yoshikawa ,  Hitoshi Sakamoto ,  Akira Shoujiguchi ,  Masaki Chiba ,  Kenichi Inaba

IPC: F25B39/00 ,  F25B39/04 ,  F25B39/02

CPC classification number: F25B39/00 ,  F25B23/006 ,  F25B39/028 ,  F25B39/04 ,  F25B2339/02 ,  F25B2339/041 ,  F28D15/0266 ,  F28D2021/0028 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

Abstract: [Problem] When a size of a cooling device using a boiling cooling system is reduced, a cooling performance decreases.[Means for solving the problems] It is characterized in that an evaporation unit which stores refrigerant, a condensing unit which condenses a gas-phase refrigerant produced by vaporizing the refrigerant in the evaporation unit to a liquid and dissipates heat, a vapor pipe which conveys the gas-phase refrigerant to the condensing unit, and a liquid pipe which conveys a liquid-phase refrigerant obtained by condensing the gas-phase refrigerant in the condensing unit to the evaporation unit are included, the condensing unit includes a heat dissipation flow path, an upper header which connects the vapor pipe and the heat dissipation flow path, and a lower header which connects the heat dissipation flow path and the liquid pipe, the upper header includes a flow path header portion connected to the heat dissipation flow path and an upper header extension portion located around the flow path header portion, and the upper header extension portion has a connection port connected to the vapor pipe in a face to which the heat dissipation flow path is connected.

Abstract translation: [问题]当使用沸腾冷却系统的冷却装置的尺寸减小时，冷却性能降低。 解决问题的手段其特征在于，存储制冷剂的蒸发单元，将通过将蒸发单元中的制冷剂蒸发而产生的气相制冷剂冷凝成液体并散热的冷凝单元，传送蒸发管 包含冷凝单元的气相制冷剂和将冷凝单元中的气相制冷剂冷凝至蒸发单元而获得的液相制冷剂的液体管，包括散热流路， 连接蒸气管和散热流路的上部集管和连接散热流路和液体管的下部集管，上部集管包括与散热流路连接的流路集管部，上部 头部延伸部分位于流动路径头部分周围，并且上部标题扩展部分具有连接到蒸气pi的连接端口 pe在散热流路连接的面上。

公开(公告)号：US09459031B2

公开(公告)日：2016-10-04

申请号：US14378659

申请日：2013-02-13

Applicant: NEC Corporation

Inventor： Kenichi Inaba ,  Minoru Yoshikawa ,  Hitoshi Sakamoto ,  Akira Shoujiguchi ,  Masaki Chiba ,  Arihiro Matsunaga

IPC: F25B43/00 ,  G06F1/20 ,  H05K7/20 ,  F28D15/02 ,  F25B39/00 ,  F25B39/02 ,  F25B39/04

CPC classification number: F25B43/00 ,  F25B39/00 ,  F25B39/02 ,  F25B39/04 ,  F28D15/0266 ,  G06F1/20 ,  H05K7/20818

Abstract: A cooling apparatus includes N (N is an integer of 2 or larger) refrigerant storage units arranged in a vertical direction and configured to store refrigerants, a condensation unit disposed above the N refrigerant storage units, a steam pipe for circulating gas phase refrigerants flowing out of the N refrigerant storage units to the condensation unit, a liquid pipe for circulating a liquid phase refrigerant flowing out of the condensation unit to an uppermost refrigerant storage unit, and separation piping for circulating a liquid phase refrigerant flowing out of an upper refrigerant storage unit to a lower refrigerant storage unit. The liquid phase refrigerant flows into each refrigerant storage unit via an inlet, and flows out from the refrigerant storage unit via a first connection port formed below the inlet.

Abstract translation: 一种冷却装置，其特征在于，包括N个（N为2以上的整数）制冷剂储存单元，其沿垂直方向配置，构成为储存制冷剂，冷凝单元设置在所述N个制冷剂储存单元的上方;蒸气管，其使流出的气相制冷剂循环 的N个制冷剂储存单元的冷凝装置，将从冷凝装置流出的液相制冷剂循环到最上层的制冷剂储存部的液体管，以及使从上部制冷剂储存部流出的液相制冷剂循环的分离配管 到下部制冷剂储存单元。 液相制冷剂经由入口流入各制冷剂储存单元，经由形成在入口下方的第一连接口从制冷剂储存单元流出。