公开(公告)号：US20040191558A1

公开(公告)日：2004-09-30

申请号：US10807674

申请日：2004-03-24

Applicant: NGK Insulators, Ltd.

Inventor： Takahiro Ishikawa ,  Masayuki Shinkai ,  Makoto Miyahara ,  Shuhei Ishikawa ,  Nobuaki Nakayama ,  Seiji Yasui

IPC: B32B003/00 ,  B32B017/00 ,  B32B018/00 ,  B32B007/00 ,  C25D005/10 ,  B32B015/00

CPC classification number: C04B37/026 ,  B23K35/3006 ,  B32B2311/12 ,  C04B35/08 ,  C04B35/52 ,  C04B35/522 ,  C04B35/565 ,  C04B2235/407 ,  C04B2235/80 ,  C04B2235/96 ,  C04B2235/9607 ,  C04B2237/125 ,  C04B2237/34 ,  C04B2237/343 ,  C04B2237/36 ,  C04B2237/363 ,  C04B2237/365 ,  C04B2237/368 ,  C04B2237/407 ,  H01L21/4882 ,  H01L23/3735 ,  H01L2924/0002 ,  Y10T428/12493 ,  H01L2924/00

Abstract: A heat spreader module has a pedestal, a heat spreader member joined to the pedestal by a first active hard brazing material, an intermediate layer joined to the heat spreader member by a second active hard brazing material, an insulating board joined to the intermediate layer by a third active hard brazing material, and a circuit board joined to the insulating board by a fourth active hard brazing material. The first through fourth active hard brazing materials are supplied such that the active hard brazing materials have a thickness ranging from 3 to 20 nullm when the components of the heat spreader module are joined together under pressure, and contain an active element in an amount ranging from 400 to 1000 nullg/cm2.

Abstract translation: 散热器模块具有基座，通过第一主动硬钎焊材料接合到基座的散热构件，通过第二主动硬钎焊材料连接到散热构件的中间层，通过第二主动硬钎焊材料接合到中间层的绝缘板 第三活性硬钎料，以及通过第四活性硬钎焊材料与绝缘板接合的电路板。 供给第一至第四活性硬钎焊材料，使得当散热器组件的组件在压力下接合在一起时，活性硬钎焊材料的厚度范围为3-20μm，并且含有活性元素的量为 400至1000杯/厘米2。

公开(公告)号：US20030082393A1

公开(公告)日：2003-05-01

申请号：US10279959

申请日：2002-10-24

Applicant: NGK Insulators, Ltd.

Inventor： Shuhei Ishikawa ,  Tsutomu Mitsui ,  Hiroyuki Takeuchi ,  Seiji Yasui ,  Ken Suzuki ,  Nobuaki Nakayama

IPC: B32B009/00

CPC classification number: C22C12/00 ,  C22C1/1036 ,  C22C9/10 ,  C22C2001/1021 ,  C22C2001/1052 ,  C22C2001/1057 ,  H01L21/4871 ,  H01L23/373 ,  H01L23/3736 ,  H01L2924/0002 ,  Y10T428/30 ,  H01L2924/00

Abstract: A mass of graphite is placed into a case, and the case is put into a furnace (step S301). The space in the furnace is heated to produce a porous sintered body of graphite (step S302). Thereafter, the case with the porous sintered body contained therein is removed from the furnace, and put into a cavity in a press (step S303). Then, a molten mass of a metal is poured into the case (step S304), and a punch is inserted into the cavity to press the molten metal into the porous sintered body in the case (step S305).

Abstract translation: 将一块石墨放入壳体中，将壳体放入炉中（步骤S301）。 加热炉中的空间以产生多孔石墨烧结体（步骤S302）。 此后，将其中包含的多孔烧结体的情况从炉中取出并放入压机中的空腔（步骤S303）。 然后，将金属熔融物倒入到壳体中（步骤S304），并且在该情况下将冲头插入到空腔中以将熔融金属压入多孔烧结体（步骤S305）。

公开(公告)号：US20040207987A1

公开(公告)日：2004-10-21

申请号：US10783892

申请日：2004-02-20

Applicant: NGK Insulators, Ltd.

Inventor： Takahiro Ishikawa ,  Masayuki Shinkai ,  Makoto Miyahara ,  Shuhei Ishikawa ,  Nobuaki Nakayama ,  Kazuyoshi Inoue

IPC: H05K007/20

CPC classification number: H01L23/3736 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat spreader module includes a base, a heat spreader member arranged on the base, a thermal conductive layer arranged on the heat spreader member, a first joining member interposed between the base and the heat spreader member, and a second joining member interposed between the heat spreader member and the thermal conductive layer. The base comprises a copper alloy which has a proof stress of not less than 45 MPa and a coefficient of thermal conductivity of not less than 270 W/mK after performing a heat treatment between 600null and 900null C. for 10 minutes.

Abstract translation: 散热器模块包括基座，布置在基座上的散热构件，布置在散热构件上的导热层，插入在基座和散热构件之间的第一接合构件，以及介于其之间的第二接合构件 散热构件和导热层。 该基体包括铜合金，其在600℃和900℃之间进行10分钟的热处理后，具有不低于45MPa的预定应力和不小于270W / mK的导热系数。

公开(公告)号：US20030096059A1

公开(公告)日：2003-05-22

申请号：US10293549

申请日：2002-11-13

Applicant: NGK Insulators, Ltd.

Inventor： Ken Suzuki ,  Shuhei Ishikawa

IPC: B05D001/32 ,  B05D001/36 ,  B05D005/00 ,  B05D003/02 ,  B32B015/04

CPC classification number: C23C18/1605 ,  C23C18/1644 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/1889 ,  C25D5/022 ,  C25D5/54 ,  H01L23/3733 ,  H01L23/3735 ,  H01L2924/0002 ,  Y10T428/12535 ,  Y10T428/12576 ,  H01L2924/00

Abstract: A composite raw material is subjected to masking, and then the composite raw material is pretreated. After that, a surface of the composite raw material is activated, and a metal catalyst is applied to a joining surface of the composite raw material and a surface of a masking tape. Subsequently, an electroless plating treatment is performed to form a plating layer on the joining surface of the composite raw material and the surface of the masking tape. It is preferable that the thickness of the plating layer is 5 to 100 nullm. After that, the masking tape which has been stuck to the composite raw material is removed, and then a drying treatment is performed for the composite raw material having the plating layer formed only on the joining surface.

Abstract translation: 对复合原料进行掩蔽，然后对复合原料进行预处理。 此后，复合原料的表面被活化，并且金属催化剂被施加到复合原料的接合表面和掩蔽带的表面。 接着，进行化学镀处理，在复合原料的接合面和遮蔽带的表面上形成镀层。 镀层的厚度优选为5〜100μm。 之后，除去粘附在复合原料上的遮蔽胶带，然后对仅具有接合面形成镀层的复合原料进行干燥处理。

公开(公告)号：US20030054188A1

公开(公告)日：2003-03-20

申请号：US10245999

申请日：2002-09-18

Applicant: NGK Insulators, Ltd.

Inventor： Shuhei Ishikawa ,  Tsutomu Mitsui ,  Ken Suzuki ,  Nobuaki Nakayama ,  Hiroyuki Takeuchi ,  Seiji Yasui

IPC: B32B015/04

CPC classification number: C22C9/00 ,  C04B41/009 ,  C04B41/5127 ,  C04B41/52 ,  C04B41/88 ,  C04B41/90 ,  C04B2111/00844 ,  C22C1/1036 ,  C22C9/01 ,  C22C9/05 ,  C22C9/06 ,  C22C9/10 ,  H01L21/4871 ,  H01L23/3733 ,  H01L2924/0002 ,  Y10T428/12576 ,  Y10T428/12611 ,  Y10T428/249957 ,  Y10T428/24997 ,  Y10T428/249974 ,  C04B41/4521 ,  C04B41/4523 ,  C04B41/0072 ,  C04B41/4556 ,  C04B41/5027 ,  C04B41/5035 ,  C04B41/522 ,  C04B41/457 ,  C04B35/08 ,  C04B35/565 ,  C04B35/584 ,  C04B35/581 ,  C04B35/563 ,  C04B38/00 ,  H01L2924/00

Abstract: A composite material has SiC produced by preliminarily sintering a porous body having a coefficient of thermal expansion lower than the coefficient of thermal expansion of copper to construct a network therein, the SiC being impregnated with a copper alloy. The copper alloy comprises copper and one or more additive elements which are prepared to impart a coefficient of thermal conductivity of 160 W/mK or higher to the composite material. The additive elements comprise up to 5% of at least one element selected from Be, Al, Si, Mg, Ti, Ni, Bi, Te, Zn, Pb, Sn, and mish metal, and also contains unavoidable impurities and gas components.

Abstract translation: 复合材料具有通过预先烧结热膨胀系数低于铜的热膨胀系数以在其中构成网络的多孔体制造的SiC，所述SiC浸渍有铜合金。 铜合金包括铜和一种或多种添加元素，其被制备以赋予复合材料160W / mK以上的导热系数。 添加元素含有至少一种选自Be，Al，Si，Mg，Ti，Ni，Bi，Te，Zn，Pb，Sn和金属的元素的5％，并且还含有不可避免的杂质和气体成分。

公开(公告)号：US20020138973A1

公开(公告)日：2002-10-03

申请号：US10107893

申请日：2002-03-27

Applicant: NGK Insulators, Ltd.

Inventor： Takahiro Ishikawa ,  Masahiro Kida ,  Shuhei Ishikawa ,  Nobuaki Nakayama

IPC: B23P019/00

CPC classification number: H05K3/04 ,  H01L2224/32225 ,  H05K1/0306 ,  H05K3/06 ,  H05K3/202 ,  H05K3/38 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/53174

Abstract: An etching treatment is applied to a metal plate in accordance with a predetermined circuit pattern to form a circuit. Subsequently, a sandblast treatment is applied to an entire surface including the circuit to remove a conductive reactive layer remaining at a metal-removed portion of the circuit. Accordingly, an insulating substrate as an underlying layer is exposed from the metal-removed portion of the circuit. The sandblast treatment is performed under a condition in which an Ni plating layer remains on the circuit at a stage at which the conductive reactive layer remaining at the metal-removed portion of the circuit is removed.

Abstract translation: 根据预定的电路图案对金属板进行蚀刻处理以形成电路。 随后，将喷砂处理施加到包括该电路的整个表面以去除残留在电路的金属去除部分处的导电反应层。 因此，作为下层的绝缘基板从电路的金属除去部露出。 在除去残留在电路的金属去除部分的导电性反应层的阶段，在电镀层上残留Ni镀层的条件下进行喷砂处理。