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公开(公告)号：US11258000B2
公开(公告)日：2022-02-22
申请号：US17025545
申请日：2020-09-18
Applicant: NICHIA CORPORATION
Inventor： Kazuma Kozuru , Ryota Okuno
Abstract: A semiconductor laser device includes: a package includes a recess and an upper surface that has an outer peripheral surface and a bonding surface positioned between the recess and the outer peripheral surface, the bonding surface having inner corners on the recess side and outer corners on the outer peripheral surface side; at least one semiconductor laser element disposed in the recess of the package; and a light-transmissive member bonded to the bonding surface of the package. The radius of curvature of inner corners is greater than the radius of curvature of outer corners.
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公开(公告)号：US12294196B2
公开(公告)日：2025-05-06
申请号：US18495403
申请日：2023-10-26
Applicant: NICHIA CORPORATION
Inventor： Soichiro Miura , Ryota Okuno
IPC: H01S5/02326 , H01S5/02253 , H01S5/02325
Abstract: A light emitting device includes: a laser element; a case enclosing the laser element, the case including a light-transmissive region configured to allow light emitted from the laser element to transmit through the light-transmissive region; a first lens configured to collimate or converge light emitted from the laser element; and a second lens that is disposed in the case and spaced apart from the first lens, the second lens located in an optical path between the laser element and the first lens. The second lens is spaced apart from the light-transmissive region such that an open space is located in the case between the light-transmissive region and the second lens.
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公开(公告)号：US11600757B2
公开(公告)日：2023-03-07
申请号：US17579449
申请日：2022-01-19
Applicant: NICHIA CORPORATION
Inventor： Kazuma Kozuru , Ryota Okuno
Abstract: A semiconductor laser device includes: a package includes a recess and an upper surface that has an outer peripheral surface and a bonding surface positioned between the recess and the outer peripheral surface, the bonding surface having inner corners on the recess side and outer corners on the outer peripheral surface side; at least one semiconductor laser element disposed in the recess of the package; and a light-transmissive member bonded to the bonding surface of the package. The radius of curvature of inner corners is greater than the radius of curvature of outer corners.
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Patent Agency Ranking
公开(公告)号：US10811581B2
公开(公告)日：2020-10-20
申请号：US16442114
申请日：2019-06-14
Applicant: NICHIA CORPORATION
Inventor： Kazuma Kozuru , Ryota Okuno
Abstract: A method of manufacturing a semiconductor device includes: a solder ball forming step comprising forming a plurality of solder balls at intervals on (i) a surface of a package surrounding a recess, or (ii) a surface of the light-transmissive member facing the surface of the package surrounding the recess (i) the surface of a light-transmissive member, or (ii) the surface of the package, into contact with an upper surface of the solder balls, which are softened, such that an air passage communicating with the recess is formed between the solder balls; and a bonding step comprising reducing a pressure in the recess via the air passage, and thereafter, in a state in which a gas for sealing is injected, heating and pressing the light-transmissive member and the package, to melt the solder balls and bond the light-transmissive member and the package.
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公开(公告)号：US11984698B2
公开(公告)日：2024-05-14
申请号：US17942922
申请日：2022-09-12
Applicant: NICHIA CORPORATION
Inventor： Soichiro Miura , Ryota Okuno
IPC: H01S5/02345 , H01S5/00 , H01S5/02255 , H01S5/023 , H01S5/02315 , H01S5/0233 , H01S5/042 , H01S5/40
CPC classification number: H01S5/02345 , H01S5/0071 , H01S5/02255 , H01S5/023 , H01S5/02315 , H01S5/0233 , H01S5/0425 , H01S5/4025
Abstract: A light emitting device includes a plurality of semiconductor laser elements, a frame part, a light-reflective member, a plurality of wires, and first and second protective elements. The frame part has a pair of first inner lateral surfaces and a second inner surface. The light-reflective member is configured to reflect laser light traveling from at least one of the plurality of semiconductor laser elements toward one of the first inner lateral surfaces of the frame part. The wires electrically connect the semiconductor laser elements respectively to an upper surface of the frame part. The first and second protective elements are disposed on the upper surface of the frame part in an area of the upper surface along the second inner surface. At least one of the wires is bonded on an area of the upper surface between the first and second protective elements.
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公开(公告)号：US11876342B2
公开(公告)日：2024-01-16
申请号：US18149241
申请日：2023-01-03
Applicant: NICHIA CORPORATION
Inventor： Soichiro Miura , Ryota Okuno
IPC: H01S5/02326
CPC classification number: H01S5/02326
Abstract: A light emitting device includes: a plurality of laser elements including a first laser element and a second laser element; a case enclosing the laser elements and including a light-transmissive region; and a plurality of main lenses including a first main lens configured to collimate or converge light emitted from the first laser element and a second main lens configured to collimate or converge light emitted from the second laser element. At least a first portion of the light-transmissive region is disposed on a first imaginary line passing through a light emitting end surface of the first laser element and the first main lens, and at least a second portion of the light-transmissive region is disposed on a second imaginary line passing through a light emitting end surface of the second laser element and the second main lens.
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公开(公告)号：US11575243B2
公开(公告)日：2023-02-07
申请号：US17069299
申请日：2020-10-13
Applicant: NICHIA CORPORATION
Inventor： Soichiro Miura , Ryota Okuno
IPC: H01S5/02326 , H01S5/02253
Abstract: A light emitting device includes: a plurality of light emitting elements including a first light emitting element and a second light emitting element; a case enclosing the light emitting elements and comprising a light-transmissive region; a plurality of main lenses, each covering a portion of the light-transmissive region, the plurality of main lenses including a first main lens configured to collimate or converge light emitted from the first light emitting element and a second main lens configured to collimate or converge light emitted from the second light emitting element; and a plurality of sub-lenses disposed in the case, the plurality of sub-lenses including a first sub-lens located in an optical path between the first light emitting element and the first main lens, and a second sub-lens located in an optical path between the second light emitting element and the second main lens.
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公开(公告)号：US11476638B2
公开(公告)日：2022-10-18
申请号：US16748246
申请日：2020-01-21
Applicant: NICHIA CORPORATION
Inventor： Soichiro Miura , Ryota Okuno
IPC: H01S5/02345 , H01S5/02255 , H01S5/40 , H01S5/023 , H01S5/02315 , H01S5/0233 , H01S5/042 , H01S5/00
Abstract: A light emitting device includes semiconductor laser elements, a frame part, a light-reflective member, a step part, metal films, wires, and a first protective element. The frame part surrounds a bottom surface on which the semiconductor laser elements are disposed. The light-reflective member is disposed on the bottom surface inside of a frame formed by the frame part. The step part is formed along a second inner lateral surface of the frame part, and disposed inside of the frame. The metal films are provided on an upper surface of the step part. The wires electrically connect the semiconductor laser elements respectively to the metal films. The first protective element is disposed on the upper surface of the step part and on a light traveling side of the laser light with respect to a plane including an emitting end surface of the first semiconductor laser element.
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