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    LIGHT-EMITTING DEVICE
    1.
    发明申请
    LIGHT-EMITTING DEVICE 有权

    公开(公告)号：US20250133884A1

    公开(公告)日：2025-04-24

    申请号：US18920602

    申请日：2024-10-18

    Applicant: NICHIA CORPORATION

    Inventor： Takayuki SOGO ,  Hiroshi MARUYAMA ,  Hiroyuki KITAOKA ,  Yusuke MONJI

    IPC: H01L33/58

    Abstract: A light-emitting device includes: a base having an upper surface; a lid body having an upper surface and a lower surface bonded to the base; and a lens member having a lower surface bonded to the lid body. An outer edge of the upper surface of the base has first and second sides parallel to each other. An outer edge of the lower surface of the lid body has first and second sides parallel to each other. In a top view, a distance from the second side of the base to the second side of the lid body is greater than a distance from the first side of the base to the first side of the lid body. A distance from the first side of the lid body to a lens surface is smaller than a distance from the second side of the lid body to the lens surface.

    LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
    2.
    发明申请
    LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME 有权
    发光装置及其制造方法

    公开(公告)号：US20150349207A1

    公开(公告)日：2015-12-03

    申请号：US14723463

    申请日：2015-05-28

    Applicant: NICHIA CORPORATION

    Inventor： Takayuki SOGO ,  Takanobu SOGAI ,  Hisashi KASAI

    IPC: H01L33/38 ,  H01L33/62 ,  H01L33/52

    CPC classification number: H01L33/382 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/385 ,  H01L33/52 ,  H01L33/54 ,  H01L33/62 ,  H01L2933/0016 ,  H01L2933/005 ,  H01L2933/0066

    Abstract: A light-emitting device includes a semiconductor light-emitting element, a first resin layer, a first metallic layer, a second resin layer, and a second metallic layer. The semiconductor light-emitting element includes a semiconductor stacked body and an electrode provided on one side of the semiconductor stacked body. The second resin layer is provided on the first resin layer and has a lower surface in contact with the first resin layer and an upper surface opposite to the lower surface. The second metallic layer is provided in the second resin layer and has a metallic lower surface and a metallic upper surface opposite to the metallic lower surface. The metallic upper surface is exposed from the second resin layer. The metallic upper surface of the second metallic layer is at least partially lower in height from the semiconductor stacked body than the upper surface of the second resin layer.

    Abstract translation: 发光器件包括半导体发光元件，第一树脂层，第一金属层，第二树脂层和第二金属层。 半导体发光元件包括半导体层叠体和设置在半导体层叠体一侧的电极。 第二树脂层设置在第一树脂层上，并且具有与第一树脂层接触的下表面和与下表面相对的上表面。 第二金属层设置在第二树脂层中，并且具有与金属下表面相对的金属下表面和金属上表面。 金属上表面从第二树脂层露出。 第二金属层的金属上表面比第二树脂层的上表面至少部分地低于半导体层叠体的高度。

    METHOD OF MANUFACTURING OPTICAL MEMBER, OPTICAL MEMBER, AND LIGHT EMITTING DEVICE
    3.
    发明申请
    METHOD OF MANUFACTURING OPTICAL MEMBER, OPTICAL MEMBER, AND LIGHT EMITTING DEVICE 审中-公开

    公开(公告)号：US20200295532A1

    公开(公告)日：2020-09-17

    申请号：US16815653

    申请日：2020-03-11

    Applicant: NICHIA CORPORATION

    Inventor： Takayuki SOGO

    IPC: H01S5/024 ,  H01S5/06 ,  H01S5/125

    Abstract: A method of an optical member comprises: providing a light transmissive member or a heat dissipating member in which a metal film and an optical film having a larger thickness than a thickness of the metal film are formed in separate regions of an upper face of a main body of the light transmissive member or an upper face of a main body of the heat dissipating member, providing a wavelength conversion member in which a metal film is formed on a lower face of a main body of the wavelength conversion member, and bonding the metal film of the light transmissive member or the metal film of the heat dissipating member to the metal film of the wavelength conversion member via a metal adhesive while positioning the optical film directly under a wavelength conversion part of the wavelength conversion member.

    METHOD OF MANUFACTURING OPTICAL MEMBER, OPTICAL MEMBER, AND LIGHT EMITTING DEVICE
    5.
    发明申请
    METHOD OF MANUFACTURING OPTICAL MEMBER, OPTICAL MEMBER, AND LIGHT EMITTING DEVICE 有权

    公开(公告)号：US20220077650A1

    公开(公告)日：2022-03-10

    申请号：US17526587

    申请日：2021-11-15

    Applicant: NICHIA CORPORATION

    Inventor： Takayuki SOGO

    IPC: H01S5/024 ,  H01S5/06 ,  H01S5/02257 ,  H01S5/00

    Abstract: An optical member includes: a main body having transparency or heat dissipation properties; an optical film disposed on an upper face of the main body; a metal film disposed on the upper face of the main body in a region other than a region where the optical film is disposed; a surrounding part joined via the metal film; and a wavelength conversion part surrounded by the surrounding part. The wavelength conversion part is positioned inward of a periphery of the optical film in a top view. The wavelength conversion part is not directly bonded to the optical film and the main body.

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