公开(公告)号：US20220029061A1

公开(公告)日：2022-01-27

申请号：US17495280

申请日：2021-10-06

Applicant: NICHIA CORPORATION

Inventor： Kenji OZEKI ,  Atsushi KOJIMA ,  Chinami NAKAI ,  Yoshio ICHIHARA

IPC: H01L33/44 ,  H01L33/56 ,  H01L33/60 ,  H01L33/54

Abstract: A light-emitting device includes: a mounting board; at least one light-emitting element located on or above the mounting board; a first covering member comprising, in order from an upper surface of the mounting board: a containing layer comprising a light-absorbing material, and a light-transmissive layer; and a second covering member located over the first covering member and the light-emitting element. A thickness of the containing layer is less than a thickness of the light-emitting element.

公开(公告)号：US20190305196A1

公开(公告)日：2019-10-03

申请号：US16369715

申请日：2019-03-29

Applicant: NICHIA CORPORATION

Inventor： Yoshio ICHIHARA ,  Mitsuhiro ISONO

IPC: H01L33/54 ,  H01L33/48 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L23/00

Abstract: Alight emitting device includes a package, alight emitting element, and a light-transmissive encapsulant. The package has a top surface and a recessed portion formed with an opening at the top surface. The light emitting element is located on a bottom surface of the recessed portion. The light-transmissive encapsulant is supplied in the recessed portion. The package is provided with a groove formed in the top surface and surrounding the opening. A surface of the groove includes depressed portions and projecting portions. The encapsulant covers at least a part of the surface of the groove, and a portion of the encapsulant that covers the surface of the groove includes a surface irregularity.

公开(公告)号：US20170222110A1

公开(公告)日：2017-08-03

申请号：US15487578

申请日：2017-04-14

Applicant: NICHIA CORPORATION

Inventor： Yoshio ICHIHARA ,  Takeo KURIMOTO

IPC: H01L33/62 ,  H01L33/48 ,  H01L33/56 ,  H01L25/075

CPC classification number: H01L33/62 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/56 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A lead frame for a light emitting device includes a plurality of unit regions and a plurality of suspension pins. Each of the unit regions each includes first to third leads. The suspension pins defines substantially rectangular frames each surrounding a corresponding one of the unit regions. The suspension pins link adjacent ones of the unit regions. In each of the unit regions, the first lead is disposed near a first corner of the substantially rectangular frame and linked to the substantially rectangular frame only via a first extension, the second lead is disposed near a second corner of the substantially rectangular frame and linked to the substantially rectangular frame only via a second extension, and the third lead includes at least two third extensions respectively linked to opposing sides of the substantially rectangular frame.

公开(公告)号：US20150349224A1

公开(公告)日：2015-12-03

申请号：US14721218

申请日：2015-05-26

Applicant: NICHIA CORPORATION

Inventor： Yoshio ICHIHARA ,  Takeo KURIMOTO

IPC: H01L33/62 ,  H01L27/15 ,  H01L33/56

CPC classification number: H01L33/62 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/56 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A package for a light emitting device includes a resin molding and first to third leads. The first lead is disposed near a first corner of a substantially rectangular shape of the resin molding, and has a first exposed part exposed from one of two side surfaces that share the first corner while the first lead is not exposed from the resin molding on the other of the two side surfaces. The second lead is disposed near a second corner, and has a second exposed part exposed from one of two side surfaces that share the second corner while the second lead is not exposed from the resin molding on the other of the two side surfaces. The third lead has a plurality of lower surface exposed parts that are exposed from a lower surface of the resin molding.

Abstract translation: 用于发光器件的封装包括树脂模制件和第一至第三引线。 第一引线设置在树脂模制件的大致矩形形状的第一角附近，并且具有从两个侧表面中的一个暴露的第一暴露部分，其中第一引线不暴露于树脂模制件上的第一拐角 两个侧面中的另一个。 第二引线设置在第二角附近，并且具有从两个侧表面之一暴露的第二暴露部分，其中共享第二拐角，而第二引线不从两个侧表面中的另一个侧面上的树脂模制件露出。 第三引线具有从树脂模制件的下表面露出的多个下表面暴露部分。

公开(公告)号：US20230095815A1

公开(公告)日：2023-03-30

申请号：US17937326

申请日：2022-09-30

Applicant: NICHIA CORPORATION

Inventor： Yoshio ICHIHARA ,  Kenta MITSUYAMA ,  Daizo KIBA

IPC: H01L33/56 ,  H01L25/075 ,  H01L33/62 ,  H01L33/60 ,  H01L33/00

Abstract: Provided is a light-emitting device that can reduce deterioration of characteristics of the light-emitting device by using a waterproof resin.
Solution
A light-emitting device includes a resin package including a lead, a resin member a light-emitting element, and a mold resin portion. The lead includes an exposed region exposed at the primary surface from the resin member. The light-emitting element is disposed in the exposed region of the lead. The mold resin portion includes a base portion having an upper surface positioned above a primary surface of the resin package and a lateral surface portion of the base portion covering a part of the lateral surface portion of the resin package and a lens portion that seal the light-emitting element. In a cross-sectional view, a first point is an outermost point of the upper surface of the base portion, the second point is an outermost point of the lateral surface portion of the base portion, and the light-emitting element is positioned closer to a back surface of the resin package than the first point and is positioned above the second point.

公开(公告)号：US20220068894A1

公开(公告)日：2022-03-03

申请号：US17410179

申请日：2021-08-24

Applicant: NICHIA CORPORATION

Inventor： Yoshio ICHIHARA

IPC: H01L25/075 ,  H01L33/50 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62

Abstract: A light emitting device includes a package for surface mounting, the package including at least three leads defining a first recess, a second recess, and a third recess. A first light emitting element is disposed in the first recess and emits first light, a second light emitting element is disposed in the second recess and emits second light, and a third light emitting element is disposed in the third recess and emits third light. A first colored resin member is disposed in the first recess, a second colored resin member is disposed in the second recess, and a third colored resin member is disposed in the third. A mold resin including a first lens portion, a second lens portion, and a third lens portion each overlapping a recess of a respective one of the plurality of leads.

公开(公告)号：US20180254397A1

公开(公告)日：2018-09-06

申请号：US15974097

申请日：2018-05-08

Applicant: NICHIA CORPORATION

Inventor： Yoshio ICHIHARA ,  Takeo KURIMOTO

IPC: H01L33/62 ,  H01L33/56 ,  H01L25/075 ,  H01L33/48

CPC classification number: H01L33/62 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/56 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A package for a light emitting device includes a resin molding and a first lead. The resin molding defines a recess opening at the upper surface of the resin molding. The first lead includes first and second lower exposed surfaces and an upper exposed surface. The first and second lower exposed surfaces are exposed from the resin molding at the lower surface of the resin molding. The first and second lower exposed surfaces are spaced apart from each other with the resin molding being interposed therebetween. The upper exposed surface is exposed from the resin molding at a bottom surface of the recess of the resin molding. In a plan view, the upper exposed surface includes a concave portion in a region corresponding to a region between the first and second lower exposed surfaces, with the concave portion being filled with the resin molding.