-
公开(公告)号:US20170178926A1
公开(公告)日:2017-06-22
申请号:US15129838
申请日:2015-03-30
Applicant: NITTA HAAS INCORPORATED
Inventor: Takayuki MATSUSHITA , Tomoki YAMASAKI
IPC: H01L21/321 , C09G1/02 , H01L21/3105
CPC classification number: H01L21/3212 , C09G1/02 , H01L21/02024 , H01L21/31053
Abstract: The present invention relates to a polishing composition including water and silica, wherein the silica has a BET specific surface area of 30 m2/g or more and an NMR specific surface area of 10 m2/g or more, and a polishing method using the polishing composition. The polishing composition of the present invention adopts silica having the BET specific surface area falling within the above-described range, and additionally having the NMR specific surface area falling within a specific range, and consequently attains a high polishing rate, and can maintain the polishing rate even when used for a long time.
-
公开(公告)号:US20180312725A1
公开(公告)日:2018-11-01
申请号:US15769934
申请日:2016-10-21
Applicant: NITTA HAAS INCORPORATED
Inventor: Noriaki SUGITA , Shuhei MATSUDA , Takayuki MATSUSHITA , Mika TAZURU
IPC: C09G1/02 , H01L21/306
CPC classification number: C09G1/02 , B24B37/00 , B24B37/044 , H01L21/02024 , H01L21/304 , H01L21/30625
Abstract: A polishing composition capable of suppressing surface defects and reducing haze is provided. The polishing composition includes: abrasives; at least one water-soluble polymer selected from vinyl alcohol-based resins having a 1,2-diol structural unit; a polyalcohol; and an alkali compound. Preferably, the polishing composition further includes a non-ionic surfactant.
-
公开(公告)号:US20180305580A1
公开(公告)日:2018-10-25
申请号:US15769889
申请日:2016-10-20
Applicant: NITTA HAAS INCORPORATED
Inventor: Noriaki SUGITA , Mika TAZURU , Takayuki MATSUSHITA , Shuhei MATSUDA
Abstract: A polishing composition that can suppress surface defects and reduce haze is provided. A polishing composition includes: abrasives; at least one water-soluble polymer selected from vinyl alcohol-based resins having a 1,2-diol structural unit; and an alkali compound, where an average particle size of particles in the polishing composition measured by dynamic light scattering is not more than 55 nm. Preferably, the polishing composition further includes a non-ionic surfactant. Preferably, the polishing composition further includes a polyalcohol.
-
公开(公告)号:US20150299517A1
公开(公告)日:2015-10-22
申请号:US14440688
申请日:2013-11-19
Applicant: NITTA HAAS INCORPORATED
Inventor: Takayuki MATSUSHITA
IPC: C09G1/02
CPC classification number: C09G1/02 , C09K3/1409 , C23F1/30 , H01L21/02024
Abstract: A polishing composition of the present invention contains: a polyvinyl alcohol resin having a 1,2-diol structure in its side chain, the polyvinyl alcohol resin being a copolymer of a monomer represented by Formula (1) below and a vinyl ester monomer; an organic acid; and abrasive grains whose surfaces are chemically modified so as to have a minus zeta potential on the surfaces in a solution with a pH of 2.0 or more and to have no isoelectric point: (where R1 to R6 each independently denote a hydrogen atom or an organic group, X denotes a single bond or a linking group, and R7 and R8 each independently denote a hydrogen atom or R9—CO— (where R9 denotes an alkyl group)).
Abstract translation: 本发明的研磨用组合物含有:侧链具有1,2-二醇结构的聚乙烯醇树脂,聚乙烯醇树脂为下述式(1)表示的单体与乙烯基酯单体的共聚物, 有机酸; 表面被化学改性以在pH为2.0以上的溶液中的表面具有负ζ电位且不具有等电点的磨粒:(其中R 1至R 6各自独立地表示氢原子或有机物 基团,X表示单键或连接基团,并且R 7和R 8各自独立地表示氢原子或R 9 -CO-(其中R 9表示烷基))。
-
-
-