公开(公告)号：US20150364357A1

公开(公告)日：2015-12-17

申请号：US14710696

申请日：2015-05-13

Applicant: NITTO DENKO CORPORATION

Inventor： Naohide TAKAMOTO ,  Hiroyuki HANAZONO ,  Akihiro FUKUI

IPC: H01L21/683 ,  H01L23/00 ,  H01L21/78

CPC classification number: H01L21/6836 ,  H01L23/544 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81007 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2224/81911 ,  H01L2224/83007 ,  H01L2224/83022 ,  H01L2224/83104 ,  H01L2224/83862 ,  H01L2224/92125 ,  H01L2924/15311 ,  H01L2924/3512 ,  Y10T428/14 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/01082 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01083 ,  H01L2924/0665 ,  H01L2924/066

Abstract: The present invention is to provide a dicing-tape integrated film for the backside of a semiconductor that is capable of suppressing the increase of the peel strength between the dicing tape and the film for the backside of a flip-chip semiconductor due to heating. The dicing-tape integrated film for the backside of a semiconductor has a dicing tape having a substrate and a pressure-sensitive adhesive layer formed on the substrate and a film for the backside of a flip-chip semiconductor formed on the pressure-sensitive adhesive layer of the dicing tape, in which the difference (γ2−γ1) of the surface free energy γ2 and the surface free energy γ1 is 10 mJ/m2 or more, where γ1 represents the surface free energy of the pressure-sensitive adhesive layer and γ2 represents the surface free energy of the film for the backside of a flip-chip semiconductor.

Abstract translation: 本发明提供一种用于半导体背面的切割带一体膜，其能够抑制由于加热而导致的倒装芯片半导体背面的切割带和膜之间的剥离强度的增加。 用于半导体背面的切割胶带集成膜具有切割带，该切割带具有基板和形成在基板上的压敏粘合剂层和形成在压敏粘合剂层上的倒装芯片半导体的背面的膜 其中表面自由能γ2和表面自由能γ1的差（γ2-γ1）为10mJ / m2以上，其中γ1表示压敏粘合剂层的表面自由能，γ2 表示用于倒装芯片半导体背面的膜的表面自由能。

公开(公告)号：US20160035640A1

公开(公告)日：2016-02-04

申请号：US14782289

申请日：2014-03-27

Applicant: NITTO DENKO CORPORATION

Inventor： Kosuke MORITA ,  Naohide TAKAMOTO ,  Hiroyuki HANAZONO ,  Akihiro FUKUI

IPC: H01L23/31 ,  C09J7/02 ,  H01L21/56

CPC classification number: H01L23/3157 ,  C09J7/38 ,  C09J2201/606 ,  H01L21/563 ,  H01L21/6836 ,  H01L23/295 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2221/6834 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2221/68386 ,  H01L2224/11002 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/14181 ,  H01L2224/16238 ,  H01L2224/16268 ,  H01L2224/27003 ,  H01L2224/27436 ,  H01L2224/2929 ,  H01L2224/29298 ,  H01L2224/29386 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/75753 ,  H01L2224/8113 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/83191 ,  H01L2224/83862 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2224/11 ,  H01L2224/27 ,  H01L2924/0103 ,  H01L2924/01083 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01082 ,  H01L2924/05432 ,  H01L2924/207 ,  H01L2224/81 ,  H01L2224/83

Abstract: The present invention provides an underfill film and a sealing sheet that are excellent in thermal conductive property and are capable of satisfactorily filling the space between the semiconductor element and the substrate. The present invention relates to an underfill film having a resin and a thermally conductive filler, in which a content of the thermally conductive filler is 50% by volume or more, an average particle size of the thermally conductive filler is 30% or less of a thickness of the underfill film, and a maximum particle size of the thermally conductive filler is 80% or less of the thickness of the underfill film.

Abstract translation: 本发明提供了导热性优异且能令人满意地填充半导体元件与基板之间的空间的底部填充膜和密封片。 本发明涉及一种具有树脂和导热性填料的底部填充膜，其中导热填料的含量为50体积％以上，导热性填料的平均粒径为30质量％以下 底部填充膜的厚度，导热性填料的最大粒径为底部填充膜的厚度的80％以下。

公开(公告)号：US20150357223A1

公开(公告)日：2015-12-10

申请号：US14709914

申请日：2015-05-12

Applicant: NITTO DENKO CORPORATION

Inventor： Naohide TAKAMOTO ,  Hiroyuki HANAZONO ,  Akihiro FUKUI

IPC: H01L21/683 ,  H01L23/00 ,  H01L21/78

CPC classification number: H01L21/6836 ,  H01L21/78 ,  H01L23/544 ,  H01L24/81 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2221/68386 ,  H01L2223/54486 ,  H01L2224/13111 ,  H01L2224/13611 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/81007 ,  H01L2224/81193 ,  H01L2224/81203 ,  Y10T428/31515 ,  H01L2924/0103 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/01047 ,  H01L2924/01029

Abstract: The present invention is to provide a dicing-tape integrated film for the backside of a semiconductor that is capable of suppressing the transfer of the coloring agent contained in a film for the backside of a flip-chip semiconductor formed on the pressure-sensitive adhesive layer of the dicing tape onto the dicing tape. The dicing-tape integrated film for the backside of a semiconductor has a dicing tape having a substrate and a pressure-sensitive adhesive layer formed on the substrate and a film for the backside of a flip-chip semiconductor formed on the pressure-sensitive adhesive layer of the dicing tape, the film for the backside of a flip-chip semiconductor contains a coloring agent, and the solubility of the coloring agent to toluene at 23° C. is 2 g/100 ml or less.

Abstract translation: 本发明提供一种半导体背面的切割带一体化膜，其能够抑制形成在压敏粘合剂层上的倒装芯片半导体的背面的膜中所含的着色剂的转印 的切割胶带到切割胶带上。 用于半导体背面的切割胶带集成膜具有切割带，该切割带具有基板和形成在基板上的压敏粘合剂层和形成在压敏粘合剂层上的倒装芯片半导体的背面的膜 在倒装芯片半导体的背面用薄膜中含有着色剂，着色剂在23℃下对甲苯的溶解度为2g / 100ml以下。