公开(公告)号：US20230183436A1

公开(公告)日：2023-06-15

申请号：US17923970

申请日：2021-04-30

Applicant: NITTO DENKO CORPORATION

Inventor： Kenichi EGUCHI ,  Aika ISHII ,  Haruka ONA ,  Hikaru YANO ,  Hiroyuki FUJITA

IPC: C08J7/046 ,  C09D183/04 ,  C08J7/04

CPC classification number: C08J7/046 ,  C09D183/04 ,  C08J7/0427 ,  C08J2383/04 ,  C08J2467/03

Abstract: The present invention relates to a coating material containing a resin component and at least one kind of oil component P, in which the oil component P can exude out from a cured or dried coating film layer to which the coating material has been applied when a temperature drops to a predetermined value or less, a wetting parameter is 0.5 (J/cm3)1/2 or less, and a gel fraction of the coating film layer is 30% or more.

公开(公告)号：US20140145230A1

公开(公告)日：2014-05-29

申请号：US14079789

申请日：2013-11-14

Applicant: NITTO DENKO CORPORATION

Inventor： Hirokazu MATSUDA ,  Haruka ONA ,  Yasunari OOYABU

IPC: H01L33/56 ,  H01L33/50

CPC classification number: H01L33/56 ,  C08G77/12 ,  C08G77/16 ,  C08G77/20 ,  C08L83/06 ,  C09D183/14 ,  H01L33/50 ,  H01L33/52 ,  H01L33/62 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2924/181 ,  H01L2933/005 ,  Y10T428/31663 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An encapsulating sheet, for encapsulating an optical semiconductor element mounted on a board by a wire-bonding connection, includes an embedding layer for embedding the optical semiconductor element and a wire and a cover layer covering the embedding layer. The embedding layer and the cover layer contain a catalyst containing a transition metal and are prepared from a silicone resin composition that is cured by accelerating a reaction by the catalyst. The ratio of the concentration of the transition metal in the cover layer to that of the transition metal in the embedding layer is 1 or more. The length from an interface between the embedding layer and the cover layer to a portion of the wire that is positioned closest to the cover layer-side is 150 μm or more.

Abstract translation: 一种用于封装通过引线接合连接安装在基板上的光半导体元件的封装片，包括用于嵌入光半导体元件的嵌入层和覆盖该嵌入层的导线和覆盖层。 包埋层和覆盖层含有含有过渡金属的催化剂，并由通过加速催化剂的反应固化的有机硅树脂组合物制备。 覆盖层中的过渡金属的浓度与嵌入层中的过渡金属的浓度的比例为1以上。 从嵌入层和覆盖层之间的界面到位于最靠近覆盖层侧的线的一部分的长度为150μm以上。

公开(公告)号：US20140178677A1

公开(公告)日：2014-06-26

申请号：US14138355

申请日：2013-12-23

Applicant: NITTO DENKO CORPORATION

Inventor： Hirokazu MATSUDA ,  Haruka ONA

IPC: H01L33/52

CPC classification number: H01L33/52 ,  B29C43/18 ,  H01L33/56 ,  H01L2224/48091 ,  H01L2933/005 ,  Y10T428/265 ,  H01L2924/00014

Abstract: An encapsulating sheet, for encapsulating an optical semiconductor element, includes an embedding layer for embedding the optical semiconductor element, a covering layer disposed at one side in a thickness direction with respect to the embedding layer, and a barrier layer interposed between the embedding layer and the covering layer; having a thickness of 50 μm or more and 1,000 μm or less; and for suppressing a transfer of a component contained in the covering layer to the embedding layer.

Abstract translation: 一种用于封装光学半导体元件的封装片包括：用于嵌入光学半导体元件的嵌入层，相对于嵌入层设置在厚度方向一侧的覆盖层，以及插入在所述嵌入层和 覆盖层; 具有50μm以上且1000μm以下的厚度; 并且用于抑制包含在覆盖层中的组分转移到嵌入层。

公开(公告)号：US20130345370A1

公开(公告)日：2013-12-26

申请号：US13912443

申请日：2013-06-07

Applicant: NITTO DENKO CORPORATION

Inventor： Haruka ONA ,  Hiroyuki Katayama

IPC: C07F7/08 ,  C08L83/04

CPC classification number: C07F7/087 ,  C08G77/16 ,  C08G77/20 ,  C08K5/5425 ,  C08K2201/014 ,  C08L83/04 ,  G02B1/04

Abstract: A first silicone resin composition is prepared by allowing an organopolysiloxane containing silanol groups at both ends containing silanol groups at both ends of a molecule and a silicon compound containing, in one molecule, at least two leaving groups leaving by a condensation reaction with the silanol groups to undergo the condensation reaction in the presence of a condensation catalyst. The silicon compound contains a trifunctional silicon compound containing, in one molecule, the three leaving groups and a bifunctional silicon compound containing, in one molecule, the two leaving groups.

Abstract translation: 通过使分子的两端含有硅烷醇基的硅烷醇基的含有有机聚硅氧烷和在一分子中含有至少两个离去基团的硅化合物，通过与硅烷醇基团进行缩合反应离开而制备第一有机硅树脂组合物 在缩合催化剂存在下进行缩合反应。 硅化合物含有在一个分子中含有三个离去基团的三官能硅化合物和在一个分子中含有两个离去基团的双官能硅化合物。

公开(公告)号：US20220145028A1

公开(公告)日：2022-05-12

申请号：US17598395

申请日：2020-03-13

Applicant: NITTO DENKO CORPORATION

Inventor： Daisuke MATSUKUMA ,  Haruka ONA ,  Yoshihiro NAKAMURA ,  Hiroyuki FUJITA

IPC: C08J7/04 ,  C09D183/04 ,  C09D5/00 ,  C09D7/65 ,  C08J5/18 ,  B05D3/12

Abstract: An object of the present invention is to provide a film capable of enhancing snow sliding property and highly preventing snow accretion and/or ice accretion on a structure. The film of the present invention includes, as an outermost layer, an oil-containing layer containing an oil component in a resin, wherein the oil component bleeds from a surface of the oil-containing layer at a temperature not more than a predetermined temperature, the surface of the oil-containing layer has a concave-convex configuration, and the arithmetic mean height (Sa) in a 3.2 cm×3.2 cm region on the surface of the oil-containing layer is 4 μm or more.

公开(公告)号：US20150076552A1

公开(公告)日：2015-03-19

申请号：US14547354

申请日：2014-11-19

Applicant: NITTO DENKO CORPORATION

Inventor： Haruka ONA ,  Hiroyuki KATAYAMA ,  Sadahiro NAKANISHI

IPC: H01L33/56

CPC classification number: H01L33/56 ,  C08G77/16 ,  C08G77/20 ,  C08L83/04 ,  H01L2924/0002 ,  H01L2933/005 ,  H01L2924/00

Abstract: A silicone resin composition contains a polysiloxane containing at least one pair of condensable substituted groups capable of condensation by heating and at least one pair of addable substituted groups capable of addition by an active energy ray.

Abstract translation: 有机硅树脂组合物含有含有能够通过加热缩合的至少一对可缩合取代基的聚硅氧烷和能够通过活性能量射线添加的至少一对可加成取代基。

公开(公告)号：US20160176160A1

公开(公告)日：2016-06-23

申请号：US14910313

申请日：2014-08-01

Applicant: NITTO DENKO CORPORATION

Inventor： Ryota MITA ,  Hiroyuki KATAYAMA ,  Hirokazu MATSUDA ,  Haruka ONA ,  Takanori ONO ,  Tomomi NISHI

IPC: B32B7/12 ,  B32B27/06 ,  B32B7/06

CPC classification number: B32B7/12 ,  B32B7/06 ,  B32B27/06 ,  B32B27/283 ,  B32B2307/726 ,  B32B2307/7265 ,  B32B2307/748 ,  B32B2457/00 ,  F16J15/022

Abstract: A release sheet includes a first moisture impermeable substrate layer and a water-containing layer laminated at one surface in a thickness direction of the first moisture impermeable substrate layer and containing water. The release sheet is used by covering a pressure-sensitive adhesive surface of a silicone resin sheet with the water-containing layer.

Abstract translation: 剥离片包括第一不透水性基材层和层叠在第一不透水性基材层的厚度方向的一个表面并含有水的含水层。 通过用含水层覆盖有机硅树脂片的压敏粘合剂表面来使用剥离片。

公开(公告)号：US20130341671A1

公开(公告)日：2013-12-26

申请号：US13912450

申请日：2013-06-07

Applicant: NITTO DENKO CORPORATION

Inventor： Haruka ONA ,  Hiroyuki Katayama ,  Sadahiro Nakanishi

IPC: H01L33/56

CPC classification number: H01L33/56 ,  C08G77/16 ,  C08G77/20 ,  C08L83/04 ,  H01L2924/0002 ,  H01L2933/005 ,  H01L2924/00

Abstract: A silicone resin composition contains a polysiloxane containing at least one pair of condensable substituted groups capable of condensation by heating and at least one pair of addable substituted groups capable of addition by an active energy ray.