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    LIGHT-EMITTING DEVICE ASSEMBLY AND LIGHTING DEVICE
    2.
    发明申请
    LIGHT-EMITTING DEVICE ASSEMBLY AND LIGHTING DEVICE 审中-公开
    发光装置组件和照明装置

    公开(公告)号：US20130229805A1

    公开(公告)日：2013-09-05

    申请号：US13778575

    申请日：2013-02-27

    Applicant: NITTO DENKO CORPORATION

    Inventor： Yasunari OOYABU ,  Hiroyuki KATAYAMA ,  Shigehiro UMETANI ,  Hisataka ITO ,  Shinsuke WAKIYA

    IPC: F21V21/00

    CPC classification number: F21V21/00 ,  H01L25/0753 ,  H01L33/54 ,  H01L2924/0002 ,  H01L2933/005 ,  H01L2924/00

    Abstract: A light-emitting device assembly includes a plurality of light-emitting devices. The plurality of light-emitting devices each includes a circuit board including a pair of electrodes to be connected to an external power source, and to which an electric power is supplied from the power source through the electrodes; a semiconductor element supported on and electrically connected to the circuit board; and an encapsulating layer that encapsulates the semiconductor element on the circuit board. The plurality of light-emitting devices are disposed so as to be continuous in one direction. The encapsulating layer is disposed so that the encapsulating layers of the light-emitting devices next to each other are in contact with each other when viewed from the top.

    Abstract translation: 发光器件组件包括多个发光器件。 多个发光装置各自包括电路板，该电路板包括一对电极以连接到外部电源，并且通过电极从电源向其提供电力; 半导体元件，其被支撑并电连接到所述电路板; 以及将半导体元件封装在电路板上的封装层。 多个发光装置被配置为在一个方向上连续。 封装层被设置为使得当从顶部观察时彼此相邻的发光器件的封装层彼此接触。

    LIGHT EMITTING DIODE DEVICE AND METHOD OF PRODUCING THE SAME
    3.
    发明申请
    LIGHT EMITTING DIODE DEVICE AND METHOD OF PRODUCING THE SAME 审中-公开
    发光二极管装置及其制造方法

    公开(公告)号：US20130193477A1

    公开(公告)日：2013-08-01

    申请号：US13744743

    申请日：2013-01-18

    Applicant: NITTO DENKO CORPORATION

    Inventor： Hiroyuki KATAYAMA ,  Yasunari OOYABU ,  Satoshi SATO

    IPC: H01L33/52

    CPC classification number: H01L33/52 ,  B29C43/10 ,  B29C43/18 ,  H01L33/56 ,  H01L2933/005

    Abstract: A method of producing a light emitting diode device includes preparing an encapsulating resin layer; embedding a light emitting diode element in the encapsulating resin layer; and heating while pressing with gas the encapsulating resin layer having the light emitting diode element being embedded therein.

    Abstract translation: 一种制造发光二极管器件的方法包括制备封装树脂层; 在封装树脂层中嵌入发光二极管元件; 并在加压气体的同时加热具有发光二极管元件的封装树脂层嵌入其中。

    CARBON-DIOXIDE CAPTURE AND TREATMENT SYSTEM AND CARBON-DIOXIDE NEGATIVE EMISSIONS PLANT
    5.
    发明公开
    CARBON-DIOXIDE CAPTURE AND TREATMENT SYSTEM AND CARBON-DIOXIDE NEGATIVE EMISSIONS PLANT 审中-公开

    公开(公告)号：US20230302403A1

    公开(公告)日：2023-09-28

    申请号：US17925248

    申请日：2021-04-23

    Applicant: NITTO DENKO CORPORATION

    Inventor： Terukazu IHARA ,  Shinya NISHIYAMA ,  Kensuke TANI ,  Hirokazu MATSUDA ,  Satoru SUZUKI ,  Koso MATSUDA ,  Hiroyuki KATAYAMA

    IPC: B01D53/62 ,  B01D53/75

    CPC classification number: B01D53/62 ,  B01D53/75 ,  B01D2257/504 ,  B01D2258/06

    Abstract: Provided is a carbon-dioxide capture and treatment system comprising: a carbon dioxide-enriched mixture gas generation device comprising a separation membrane capable of increasing a carbon dioxide concentration of a mixture gas taken therein, thereby generating a carbon dioxide-enriched mixture gas; a carbon dioxide conversion device configured to convert carbon dioxide in the enriched mixture gas received from the carbon dioxide-enriched mixture gas generation device, into a chemically stable compound; a final treatment device comprising an adsorbent, wherein the final treatment device is configured to adsorb the carbon dioxide by the adsorbent, thereby separating the carbon dioxide from other gas components; and a carbon dioxide direct capture device configured to take in air contained in an ambient environment, and supply the taken-in air to the final treatment device or an upstream side thereof in the carbon-dioxide capture and treatment system.

    PHOSPHOR LAYER-COVERED LED, PRODUCING METHOD THEREOF, AND LED DEVICE
    9.
    发明申请
    PHOSPHOR LAYER-COVERED LED, PRODUCING METHOD THEREOF, AND LED DEVICE 审中-公开
    磷光体层覆盖的LED，其制造方法和LED器件

    公开(公告)号：US20140009060A1

    公开(公告)日：2014-01-09

    申请号：US13914116

    申请日：2013-06-10

    Applicant: NITTO DENKO CORPORATION

    Inventor： Ryuichi KIMURA ,  Hiroyuki KATAYAMA ,  Yuki EBE ,  Hidenori ONISHI ,  Kazuhiro FUKE

    IPC: H05B33/10

    CPC classification number: H05B33/10 ,  H01L24/97 ,  H01L33/0095 ,  H01L33/50 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2933/0041 ,  H01L2924/00

    Abstract: A method for producing a phosphor layer-covered LED includes the steps of preparing a support sheet including a hard support board and a pressure-sensitive adhesive layer laminated at one surface in a thickness direction of the support board and having a pressure-sensitive adhesive force capable of being reduced by application of an active energy ray; attaching an LED to the support board via the pressure-sensitive adhesive layer; disposing a phosphor layer at the one surface in the thickness direction of the support board so as to cover the LED with the phosphor layer; cutting the phosphor layer corresponding to the LED to produce a phosphor layer-covered LED including the LED and the phosphor layer covering the LED; and peeling the phosphor layer-covered LED from the pressure-sensitive adhesive layer by applying an active energy ray at least from one side in the thickness direction to the pressure-sensitive adhesive layer.

    Abstract translation: 荧光体层覆盖的LED的制造方法包括以下步骤：在支撑板的厚度方向上的一个表面层叠有硬质支撑基板和粘合剂层的支撑片，并具有压敏粘合力 能够通过施加活性能量射线而减少; 通过压敏粘合剂层将LED附着到支撑板上; 在支撑板的厚度方向的一个表面处设置荧光体层，以便用荧光体层覆盖LED; 切割与LED相对应的荧光体层，以制造包括LED的荧光体层覆盖的LED和覆盖LED的荧光体层; 以及通过至少从厚度方向的一侧施加活性能量射线至所述压敏粘合剂层，从所述压敏粘合剂层剥离所述荧光体层覆盖的LED。

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