公开(公告)号：US20040158021A1

公开(公告)日：2004-08-12

申请号：US10773296

申请日：2004-02-09

Applicant: NITTO DENKO CORPORATION

Inventor： Naoki Sadayori ,  Yuji Hotta

IPC: C08G073/00

CPC classification number: C08G18/71 ,  C08G18/025 ,  C08G18/7607

Abstract: A polycarbodiimide copolymer having a repeating structural unit represented by the following formula (1) in a number nullmnull: 1 (wherein R1 means a naphthylene group) and a repeating structural unit represented by the following formula (2) in a number nullnnull: 2 (wherein R2 means an organic diisocyanate residue other than the aforementioned R1) and also having on both termini a terminal structural unit derived from a monoisocyanate, wherein mnulln is from 3 to 200 and n/(mnulln) is from 0.05 to 0.99. The polycarbodiimide which has a refractive index higher than the general counterparts, is excellent in heat stability and has high workability and moldability.

Abstract translation: 具有数字“m”的由下式（1）表示的重复结构单元的聚碳化二亚胺共聚物（其中R 1表示亚萘基）和由下式（2）表示的重复结构单元的数目 “n”：（其中R 2表示除上述R 1以外的有机二异氰酸酯残基），并且在两末端上均具有衍生自单异氰酸酯的末端结构单元，其中m + n为3〜200，n /（m + n）为0.05〜0.99。 折射率高于一般对应物的聚碳化二亚胺具有优异的热稳定性，并且具有高的加工性和成型性。

公开(公告)号：US20040013816A1

公开(公告)日：2004-01-22

申请号：US10616983

申请日：2003-07-11

Applicant: NITTO DENKO CORPORATION

Inventor： Ryuusuke Naitou ,  Amane Mochizuki ,  Kazunori Mune ,  Naoki Sadayori ,  Takahiro Fukuoka

IPC: B05D005/06

CPC classification number: G03F7/001 ,  G02B6/138 ,  G03F7/0045

Abstract: A process of producing a polymer optical waveguide, including (a) a step of forming an undercladding layer on a substrate; (b) a step of forming a photosensitive resin composition layer containing a 1,4-dihydropyridine derivative and a resin on the undercladding layer; (c) a step of irradiating a region of the photosensitive resin composition layer corresponding to a core pattern with UV light through a mask to form UV light-exposed areas and UV light-unexposed areas on the photosensitive resin composition layer; (d) a step of heating the UV light-exposed areas and UV light-unexposed areas of the photosensitive resin composition layer; and (e) a step of forming an overcladding layer on the photosensitive resin composition layer after heating.

Abstract translation: 一种制造聚合物光波导的方法，包括（a）在基板上形成下包层的步骤; （b）在下含层上形成含有1,4-二氢吡啶衍生物和树脂的感光性树脂组合物层的工序; （c）通过掩模用UV光照射与核心图案相对应的感光性树脂组合物的区域的步骤，以在感光性树脂组合物层上形成紫外线曝光区域和UV光未曝光区域; （d）对感光性树脂组合物层的紫外线曝光区域和紫外线未曝光区域进行加热的工序; 和（e）加热后在感光性树脂组合物层上形成外包层的工序。

公开(公告)号：US20040176547A1

公开(公告)日：2004-09-09

申请号：US10793213

申请日：2004-03-05

Applicant: NITTO DENKO CORPORATION

Inventor： Naoki Sadayori ,  Yuji Hotta

IPC: C08G018/28

CPC classification number: C08G18/095 ,  C08G18/69 ,  C08G18/71 ,  C08G18/7607

Abstract: A polycarbodiimide copolymer which comprises at least one structural unit selected from rubber residues represented by the following formulae (1) and (2) in a number nullmnull: 1 and a structural unit represented by the following formula (3) in a number nullnnull: 2 and which comprises on both termini a terminal structural unit derived from a monoisocyanate, wherein m is an integer of 2 or more, n is an integer of 1 or more, mnulln is from 3 to 1,500 and m/(mnulln) is from {fraction (1/1,500)} to null. The polycarbodiimide is capable of keeping the inherent heat resistance and also showing excellent flexibility. Films and molding materials having high heat resistance and flexibility can be obtained.

Abstract translation: 一种聚碳二亚胺共聚物，其包含至少一种选自下列式（1）和（2）表示的数字“m”的橡胶残留物的结构单元和由下式（3）表示的结构单元，数目“n “，并且其在两末端上包含衍生自单异氰酸酯的末端结构单元，其中m为2以上的整数，n为1以上的整数，m + n为3〜1500，m /（m + n）为{部分（1 / 1,500〜1/3），聚碳化二亚胺能够保持固有的耐热性，并且还具有优异的柔软性，可以获得具有高耐热性和柔软性的薄膜和成型材料。

公开(公告)号：US20040157992A1

公开(公告)日：2004-08-12

申请号：US10768674

申请日：2004-02-02

Applicant: NITTO DENKO CORPORATION

Inventor： Kazuki Uwada ,  Yuji Hotta ,  Naoki Sadayori

IPC: C08G018/00

CPC classification number: C08G18/797 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A resin for the encapsulation of a photosemiconductor element which comprises a polycarbodiimide having a specific structure; a photosemiconductor device including a photosemiconductor element encapsulated with the resin; and a process for producing the photosemiconductor device which includes the steps of placing the resin on a photosemiconductor element and heating the resin. The resin enables the photosemiconductor element to maintain high brightness when it is a light-emitting element and to maintain high photodetection sensitivity when it is a photodetector, and also enables the photosemiconductor element to be easily encapsulated.

Abstract translation: 一种用于包封具有特定结构的聚碳二亚胺的光半导体元件的树脂; 一种光半导体装置，包括用该树脂封装的光半导体元件; 以及制造光半导体装置的方法，包括将树脂放置在光半导体元件上并加热树脂的步骤。 该树脂使其能够在作为发光元件时保持高亮度，并且在作为光电检测器时能够保持高的光检测灵敏度，并且能够容易地封装光半导体元件。

公开(公告)号：US20040178423A1

公开(公告)日：2004-09-16

申请号：US10808380

申请日：2004-03-25

Applicant: NITTO DENKO CORPORATION

Inventor： Akiko Matsumura ,  Kazuki Uwada ,  Naoki Sadayori ,  Yuji Hotta

IPC: H01L023/48

CPC classification number: H01L21/563 ,  C08G18/095 ,  C08G18/692 ,  C08G18/71 ,  C08L63/00 ,  C09J7/10 ,  C09J175/14 ,  C09J2475/00 ,  H01L23/293 ,  H01L24/29 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83191 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  Y10T428/31504 ,  Y10T428/31721 ,  C08L2666/20 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/0401

Abstract: An adhesive film for underfill excellent in relaxation effect of the stress generated in the above semiconductor element and the wiring circuit board and in the connecting electrode parts and also excellent in reliability of electrical connection between the semiconductor element and the wiring circuit board.

Abstract translation: 用于底部填充的粘合膜在上述半导体元件，布线电路板和连接电极部分中产生的应力的松弛效果优异，并且半导体元件和布线电路板之间的电连接的可靠性也优异。

公开(公告)号：US20040167310A1

公开(公告)日：2004-08-26

申请号：US10757512

申请日：2004-01-15

Applicant: NITTO DENKO CORPORATION

Inventor： Ichiro Suehiro ,  Naoki Sadayori ,  Yuji Hotta

IPC: C08G018/00

CPC classification number: G02B3/0031 ,  C08G18/025 ,  C08G18/71 ,  C08G18/724 ,  C08G18/7607 ,  G02B1/041

Abstract: A microlens array having a resin layer forming convex lenses, wherein the resin layer comprises a cured product of a polycarbodiimide resin represented by formula: R1nullNnullCnullNnullRnullNnullCnullNnullnR1 wherein R represents a diisocyanate residue; R1 represents a monoisocyanate residue; and n represents an integer of 1 to 100.

Abstract translation: 一种具有形成凸透镜的树脂层的微透镜阵列，其中该树脂层包括由下式表示的聚碳二亚胺树脂的固化产物：R 1 -N = C = N＆Parenopenst; RN = C = N＆Parenclosest; nR 1其中R 代表二异氰酸酯残基; R 1表示单异氰酸酯残基; n表示1〜100的整数。

公开(公告)号：US20040096633A1

公开(公告)日：2004-05-20

申请号：US10704905

申请日：2003-11-12

Applicant: NITTO DENKO CORPORATION

Inventor： Akiko Matsumura ,  Kazuki Uwada ,  Naoki Sadayori ,  Yuji Hotta

IPC: B32B003/00

CPC classification number: H01L21/563 ,  C08G73/00 ,  C09J7/10 ,  C09J179/00 ,  C09J2479/08 ,  H01L23/293 ,  H01L24/29 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/31681 ,  Y10T428/31721 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/0401

Abstract: An adhesive film for underfill which relaxes the stress formed in the wiring circuit substrate, semiconductor element and electrode parts for connection. The adhesive film is a quickly hardening type, and forms a highly heat resistant sealing resin layer quickly between the wiring circuit substrate and semiconductor element of a semiconductor device.

Abstract translation: 用于底部填充剂的粘合膜，其放松在布线电路基板，半导体元件和用于连接的电极部件中形成的应力。 粘合膜是快速硬化型，并且在布线电路基板和半导体器件的半导体元件之间快速形成高耐热密封树脂层。