摘要:
Backlight intensity is adjusted in a terminal. An adaptation apparatus transmits a visual signal after optimizing brightness or contrast of the visual signal based on the backlight intensity information which is related to the adjusted backlight intensity, so that the user can enjoy digital item with reduced power consumption of the terminal.
摘要:
An apparatus and method for adapting an audio signal is provided. The apparatus adapts the audio signal to a usage environment including user's characteristic, terminal capacity and user's natural environments responsive to user's adaptation request, to thereby provide the user with a high quality of digital contents efficiently.
摘要:
A context knowledge modeling method is provided. The context knowledge modeling method includes the steps of: a) defining a context knowledge space as a two-dimensional space based on an abstract level and an application domain of knowledge; b) locating a share ontology as a highest level of the abstract level for defining a common ontology concept at a plurality of applications and services performed in various environment and domains; c) locating at least one of domain ontologies as a lower abstract level than the share ontology by taking over the ontology concept defined at the share ontology and defining a class and an attribute specialized at a corresponding domain and a developing application; and d) locating one or more instance bases expressing knowledge about real objects to have a lower abstract level than the domain ontologies.
摘要:
A method of sequentially forming a silicide layer and a contact barrier in a semiconductor device is provided. In the method, a pre-metal dielectric layer is deposited over an underlying structure that has a silicon substrate, a gate electrode on the substrate, and source/drain regions in the substrate. Contact holes are formed toward the gate electrode and the source/drain regions in the dielectric layer. Then, a metal layer for the silicide layer is selectively deposited on the bottom of the contact holes by using ion implantation, for example. Thereafter, the contact barrier is conformally deposited on entire exposed surface, and a heat-treatment process is performed to form the silicide layer from the metal layer.
摘要:
Disclosed herein are a liquid composition for immersion lithography and a lithography method using the composition. The liquid composition includes at least one nonionic surfactant selected from the group comprising of a polyvinyl alcohol, a pentaerythritol-based compound, a polymer containing an alkylene oxide, and a compound represented by Formula I: wherein R is a linear or branched, substituted C1-C40 alkyl, and n is an integer ranging from 10 to 10,000. The surface tension of the liquid composition is reduced by the nonionic surfactant, thereby solving the problem that the liquid composition is not completely filled or is partially concentrated on a wafer having a fine topology and removing micro bubbles between the photoresist film and the liquid composition.
摘要翻译:本文公开了用于浸没式光刻的液体组合物和使用该组合物的光刻方法。 液体组合物包含至少一种非离子表面活性剂,其选自聚乙烯醇,季戊四醇基化合物,含有烯化氧的聚合物和由式I表示的化合物:其中R是直链或支链的取代的C C 1 -C 40烷基,n是10至10,000的整数。 通过非离子表面活性剂降低液体组合物的表面张力,从而解决液体组合物未完全填充或部分浓缩在具有细微拓扑结构的晶片上并且去除光致抗蚀剂膜和液体组合物之间的微小气泡的问题。
摘要:
A water heating apparatus using electrodes is provided. The water heating apparatus includes a heating tank in which electrolyte solution is stored and a plurality pairs of heating electrodes composed of positive electrodes and negative electrodes arranged in the heating tank at uniform intervals. Since the plurality of pairs of electrodes are arranged in the heating tank at uniform intervals, the heating operation can be always performed in a state where the electrolyte solution of no less than the minimum water level is stored regardless of the direction of the heating tank so that it is possible to heat water or to generate steam. Therefore, the water heating apparatus can be easily applied to a product that is inclined or upset and that is not in a specific direction.
摘要:
A multilayer chip capacitor, and a method for manufacturing the same are Provided. The capacitor comprises a capacitor body having a plurality of dielectric layers stacked therein, a plurality of first and second internal electrodes formed on the dielectric layers, each of the internal electrodes including a main electrode portion and a lead portion, chip-protecting side members formed on both sides of the capacitor body to contact both sides of the first and second internal electrodes, and a pair of external electrodes formed on the outer surface of the capacitor body. The width of the main electrode portion is the same as that of the dielectric layers, and the width of the lead portion is smaller than that of the dielectric layers.
摘要:
Disclosed is a method for designing a development drawing of a developable surface, the method including the steps of: setting a control contour from a circumference surface of a 3-dimensional model; performing an algorithm LIDM-GC-Dvlp to search a control point set; outputting a control point of a profile curve; visualizing a developable surface typed general circumference surface; modifying a design by a user depending on the visualized result; selecting a developable surface segment intended to generate the development drawing; and performing an algorithm LIDM-GC-Plane-Dvlp for the control point to generate the development drawing.
摘要:
Disclosed herein is a method of manufacturing a multilayered ceramic capacitor by a spin coating process, and a multilayered ceramic capacitor obtained by the above method. The method of the current invention provides a plurality of dielectric layers formed by spin coating, in which the process of coating the dielectric layer and the process of printing the inner electrode can be provided as a single process. Therefore, the thickness of the dielectric layer is easily controlled while the dielectric layer is formed to be thin. Further, since the dielectric layers and the inner electrodes are formed successively, the processes of separating and layering the dielectric layers, and the process of compressing the ceramic multilayered body can be omitted. Thereby, the ceramic multilayered body need not be compressed, and thus, a pillowing phenomenon does not occur in the multilayered ceramic capacitor.
摘要:
A flip chip bonding method and substrate architecture are disclosed for enhancing bonding performance between a chip and a substrate by forming a bump on the chip or the substrate. The flip chip bonding method includes performing pretreatment of a wafer having chips, dicing, and obtaining the pretreated individual chip; performing pretreatment of a substrate; aligning the pads of the pretreated chip with the pads of the pretreated substrate, and bonding the chip and the substrate together by applying an ultrasonic wave and heat using a collet and simultaneously applying pressure. Post treatment is performed by filling or molding resin after bonding. The chip or the substrate is formed with a plated bump, a stud bump or a wedge bump. The stud bump or the wedge bump can be additionally formed on the plated bump.